一种三维立体传输结构的分段式设计方法

随着信号频率以及芯片集成密度的持续增长,三维集成系统内部面临严重的耦合噪声问题。针对三维集成技术中广泛使用的硅通孔(TSV)和水平重布线层(RDL)构成的三维互连结构,提出了一种基于分段传输线(STL)的三维互连结构优化设计方案。通过将三维互连结构传输线按STL模式划分为数个传输线片段生成复数反射波,并运用基因算法(GA)筛选片段特征信息,从而优化反射波叠加效果,实现对传输过程中产生的信号损失进行补偿。仿真结果表明,该方法可以有效改善三维互连结构中由于耦合噪声造成的信号反射问题,提升系统传输性能。     

A generalized MoM-SPICE iterative technique for field coupling to multiconductor transmission lines in presence of complex structures

A generalized method of moments (MoM)-SPICE iterative technique for field coupling analysis of multiconductor transmission lines (MTLs) in the vicinity of complex structures is presented. Telegrapher's coupling equations are modified with additional distributed voltage and current sources for more accurate analysis of the total current induced onto transmission line bundles in the presence of complex structures. These additional voltage and current sources are introduced to enforce the electric field boundary condition and continuity equation on MTLs beyond the quasi-static regime. The surrounding structure is modeled via the MoM and a SPICE-like simulator is used to simulate equivalent circuit model of the MTLs extracted via the partial element equivalent circuit method. The proposed technique is based on perturbation theory with the quasi-static current distributions on the transmission lines still assumed to be dominant. Validation examples for single and MTLs are given in the presence of complex structures.     

Embedded microstrip interconnection lines for gigahertz digitalcircuits

Transmission line structures are needed for the high-performance interconnection lines of GHz integrated circuits (ICs) and multichip modules (MCMs), to minimize undesired electromagnetic wave phenomena and, therefore, to maximize the transmission bandwidth of the interconnection lines. In addition, correct and simple models of the interconnection lines are required for the efficient design and analysis of the circuits containing the interconnection lines. In this paper, we present electrical comparisons of three transmission line structures: conventional metal-insulator-semiconductor (MIS) and the embedded microstrip structures-embedded microstrip (EM) and inverted embedded microstrip (IEM). In addition, we propose closed-form expressions for the embedded microstrip structures EM and IEM and validate the expressions by comparing with empirical results based on S-parameter measurements and subsequent microwave network analysis. Test devices were fabricated using a 1-poly and 3-metal 0.6 μm Si process. The test devices contained the conventional MIS and the two embedded microstrip structures of different sizes. The embedded microstrip structures were shown to carry GHz digital signals with less loss and less dispersion than the conventional MIS line structures. S-parameter measurements of the test devices showed that the embedded microstrip structures could support the quasi-TEM mode propagation at frequencies above 2 GHz. On the other hand, the conventional MIS structure showed slow-wave mode propagation up to 20 GHz. More than 3-dB/mm difference of signal attenuation was observed between the embedded microstrip structures and the conventional MIS structure at 20 GHz. Finally, analytical RLCG transmission line models were developed and shown to agree well with the empirical models deduced from S-parameter measurements     

An Analysis of Gap in Microstrip Transmission Lines

Although microstrip transmission lines have been widely used in microwave integrated circuits, the discontinuity structures in the microstrip transmission lines such as a gap, an abruptly ended strip conductor, and so on, have hardly been analyzed. An analytical method and numerical results for a gap capacitance in the microstrip transmission line are described. The equivalent circuit parameters are formulated with three-dimensional Green's functions, based on a variational principle. The numerical results are in good agreement with the published experimental data. The fringing effect of an abruptly ended strip conductor is also investigated.     

Modeling and analyzing vertical interconnections

Continual interest in miniaturization is driving electronic packaging toward three-dimensional (3-D) structures and system integration. Utilization of a third dimension allows designers much more freedom, but at the same time it leads to an increase in the complexity of signal routing. High-density of components and interconnection increases the need for electromagnetic (EM) modeling. This paper focuses on EM modeling and the analysis of vertical interconnection in a stacked 3-D package. Solder-plated polymer balls are used in vertical interconnection between interposers and laser-drilled vias through the interposers. High-frequency responses of the vertical interconnections were studied with 3-D full-wave software. Based on the EM analysis, we propose equivalent circuit models for vertical connections, which were verified with measurements. In addition, an impedance-matching technique in vertical interconnection is discussed.     

A Hybrid Electromagnetic-Circuit Method for Electromagnetic Interference Onto Mass Wires

A current decomposition method is proposed for the analysis of field coupling to mass wires near complex structures. The foremost attribute of the method is the decomposition of the current on each wire into push-pull and push-push mode currents. The former refers to the perturbation current accounting for the interactions among the wires within the bundle, whereas the latter represents the interactions between the mass wire bundle and the surrounding structure. Multiconductor transmission line theory is employed to compute the push-pull mode current by using one of the wires in the bundle as the return/reference conductor. Current induced on a test wire located along the reference line is used to compute the push-push mode. For this analysis, we employed the method of moments for the electromagnetic analysis of surrounding structure and simulation program with integrated circuit emphasis (SPICE)-like simulators for the analysis of a circuit model of the transmission lines extracted via the partial element equivalent circuit method. Several validation examples (including transmission lines inside an automobile) are presented. It is also shown that the traditional transmission line theory based on quasi-static analysis fails with increasing complexity of the surrounding structure.     

Comment: Time-discrete networks

The letter is concerned with time-discrete networks characterised by difference relations. It is shown that a time-discrete network can be defined as an interconnection of lossless transmission lines and multiple parallel transmission lines, resistors and voltage- and current-sequence sources. An approximation of LC components by means of lossless transmission lines is equivalent to the choice of a `trapezoidal? rule of a numerical integration.     

用于片上网络的全异步串行连接转换器

针对传统片上网络路由器之间互连线过多,传输功耗大的缺陷,提出了一种用于全异步片上网络的串行传输转换器。通过将路由器之间的并行数据分组并以更小的数据块传输,使得片上路由之间的互连线成倍减少,并可以大大减小传输过程带来的功率损耗。零协议逻辑门限门的应用使电路准延时不敏感,提高了转换器的鲁棒性。基于SMIC 0.18μm标准CMOS工艺实现了此串行连接转换器及串行通道。结果表明,在32位数据位宽下,此全异步串行连接转换器可节约路由器之间近3/4的连线资源以及减少近2/3的功耗。此全异步串行连接转换器适用于对面积和功耗较为敏感的片上网络互连应用。     

A full asynchronous serial transmission converter for network-on-chips

Large transmission power consumptions and excessive interconnection lines are two shortcomings which exist in conventional network-on-chips. To improve performance in these areas, this paper proposes a full asynchronous serial transmission converter for network-on-chips. By grouping the parallel data between routers into smaller data blocks, interconnection lines between routers can be greatly reduced, which finally brings about saving of power overheads in the transmission process. Null convention logic units are used to make the circuit quasi-delay insensitive and highly robust. The proposed serial transmission converter and serial channel are implemented based on SMIC 0.18 μm standard CMOS technology. Results demonstrate that this full asynchronous serial transmission converter can save up to three quarters of the interconnection line resources and also reduce up to two-thirds of the power consumption under 32 bit data widths. The proposed full asynchronous serial transmission converter can apply to the on chip network which is sensitive to area and power.     

Modeling and characterization of the bonding-wire interconnection

In this paper, the bonding-wire interconnection has been studied from the points of view of its modeling and electrical characterization. Both singleand double-wire structures have been considered, the latter under the assumption of parallel wires. Two electrical models of the bonding wire are discussed. First, the finite-difference time-domain (FDTD) method is proposed for the rigorous analysis of such structures. This method uses a suitable discretization technique, which accounts for the wire curvature by means of a polygonal approximation. A quasi-static model of the bonding wire, suitable for commercial microwave computer-aided-design tools is then proposed. This model is based on the representation of the structure with four sections of a uniform transmission line and the model parameters are evaluated analytically from the dimensions of the interconnection. Accuracy and applicability of the quasi-static model have been assessed by analyzing several test structures, the reference results being obtained with the FDTD method. Finally, the quasi-static model has been used to provide an extensive electrical characterization of the bonding wire versus its main geometrical parameters. This characterization is given in terms of an equivalent series inductance and two equivalent shunt capacitances forming a π low-pass network. This representation is particularly useful in the matching of the bonding-wire discontinuity     

用电磁场算子理论分析脊波导的传输特性

该文用电磁场算子理论通过多个虚拟边界的电场和磁场的耦合求解脊波导的本征值,在此基础上讨论了脊波导的的传输特性。所采用的并矢格林函数没有奇异项,可以化为标量格林函数来表示,而且能很方便地计算,并与经典方法计算的结果进行了比较。     

A self-adaptive full asynchronous bi-directional transmission channel for network-on-chips

To improve two shortcomings of conventional network-on-chips,i.e.low utilization rate in channels between routers and excessive interconnection lines,this paper proposes a full asynchronous self-adaptive bi-directional transmission channel.It can utilize interconnection lines and register resources with high efficiency,and dynamically detect the data transmission state between routers through a direction regulator,which controls the sequencer to automatically adjust the transmission direction of the bi-d...     

Broadband Resonant-Type Metamaterial Transmission Lines

In this letter, it is shown that, contrary to previous assumptions, the broadband characteristics of metamaterial transmission lines are not exclusive of the so called CL loaded composite right/left handed (CRLH) structures. In the balance condition, the typical frequency gap between the left handed (LH) and right handed (RH) transmission bands of these CRLH lines collapses, the characteristic impedance varies smoothly in the vicinity of the transition frequency, and broadband response results. However, through an appropriate design, similar behavior can be obtained in resonant type metamaterial transmission lines, namely transmission lines loaded with complementary split rings resonators. A detailed analysis of the structures, based on the equivalent circuit model is provided, and implications of balancing are pointed out. In this letter, it is clearly demonstrated that broadband balanced CRLH lines can also be implemented by means of the resonant type approach     

An efficient characterization of interconnectedmulticonductor-transmisslon-line networks

The numerical solution of the multiconductor-transmission-line (MTL) equations for lossy interconnected transmission lines (TLs) is investigated in this paper. The solution for the transmission line segments is accomplished through the finite-difference time-domain method, whereas the terminations and interconnection networks (which may contain nonlinearities) are characterized with an efficient state-variable representation. High-frequency skin-effect losses in the TLs are included in the MTL equations through convolution integrals in the MTL equations. The computation of these convolution integrals represents the bulk of the solution effort. Two methods, the singular-value-decomposition method and the matrix-pencil method, are shown to significantly reduce the computation time and improve the solution accuracy     

Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate

A vertical interlayer connection via (VILCV) fabrication process is presented. This process is used for the interconnection of multilayer benzocyclobutene (BCB) based microwave multichip modules (MMCM). The excellent planarity of BCB allows VILCV to be formed using gold electroplating or stud bumps prior to BCB application. And mechanical polishing (MP) planarization is adopted to expose the VILCV, enabling interconnection between different layers. Subsequently upper interconnection is patterned. Metal/BCB multilayer structure can be made by repeating above steps. This approach eliminates the need for laser drilling and plasma etching. Both four terminal Kelvin structures and via chains are fabricated as test vehicles. Finally, a transition of transmission lines in different layers and a packaged MMIC embedded in Si substrate are presented and measured in high frequency range up to 20 GHz. The results show there is only minimal performance degradation.     

在片传输线等效电路模型的传递函数分析

提出了一种通过传递函数分析来确定在片传输线等效电路模型拓扑结构的新方法。通过这种方法,可分析得出由不同1-π单元组成的等效电路的拟合能力。通过对测量S参数的有理逼近构建了一个宽带宏模型。通过对比等效电路模型与宏模型的传递函数的零点和极点,开发出一种可靠且高效的确定传递函数等效电路结构的方法。分析发现复极点决定了模型的宽带拟合能力。共面传输线到50 GHz的测量S参数证明了本文提出的方法非常有助于寻找满足精度要求且最简单的拓扑。     

Evolutionary generation of 3-D line-segment circuits with a broadside-coupled multiconductor transmission-line model

Evolutionary generation of three-dimensional microwave line-segment circuits embedded in a multilayer structure is presented. Connections of the line segments and their lengths are expressed by sets of parameters, which are evolutionarily optimized by the genetic algorithms. Practical optimization time is achieved by introducing models of broadside-coupled multiconductor transmission lines instead of full-wave electromagnetic (EM) calculations. The scattering parameters of the models are connected with the scattering parameters of vias, and are synthesized into that of the whole circuit. Using line segments, we can obtain not only small components for limited-space applications, but also large components for wide-band frequency specifications without increasing computational complexity. Two bandpass filters and a bandstop filter were designed and tested by an EM simulator. The bandpass filters were also fabricated and measured. The results validated our proposing procedure.     

Exact Theory of Interdigital Band-Pass Filters and Related Coupled Band-Pass Structures

An exact theory of interdigital line networks and related coupled structures is presented. The theory of parallel-coupled line arrays is reviewed briefly, and the derivation of exact equivalent circuits from the impedance matrix using modem network synthesis techniques is discussed. A simplified theory of equivalent coupled structures is introduced in order to avoid the lengthy analysis required when using the impedance matrix approach. Equivalent networks for the interdigital line are obtained by inspection, using a transformed capacitance matrix associated with the two-dimensional geometry of the conductors and ground planes. The techniques presented are simple to apply and allow a given transmission response to be obtained in a variety of line configurations. A practical design example and experimental results are given to illustrate the simplicity of the approach, along with general criteria for the design of practical filter networks with optimum transmission characteristics. The paper is directed toward the design of interdigital band-pass filters; however, the techniques presented can be used to analyze and design a much broader class of microwave networks. The relationship of the exact theory to existing approximate theory is discussed.     

带状线低通滤波器的等效电路模型研究

所涉及的滤波器结构中包含开路端、T型接头等不连续性部分,因此在分析时应充分考虑到这些不连续部分所产生的传输损耗。基于传输线基本理论和矩量法(MoM),通过曲线拟合获得了偏心带状线开路端电容的解析公式,然后依据已有的微带线不连续性等效电路理论,提出了偏心带状线低通滤波器的等效电路模型。经实例验证发现,所得模型的计算结果与IE3D软件仿真结果吻合良好,而传输线理论法未考虑上述传输损耗,计算结果存在明显偏差。     

用FDTD法分析MCM中具有网孔接地板互连线的电特性

用时域有限差分（FDTD）法分析多芯片组件（MCM）中具有网孔接地板的互连线电特性并提取其等效电路参量。用电磁场和分布参数电路间的关系可以从FDTD法得到的数据中提取互连线呈周期性变化的分布参量。此外在文中也涉及上述分布参量的色散特性。