Zn-Al钎料成分对Cu/Zn-Al/Al钎焊接头界面结构及性能的影响

分别采用Zn-15Al,Zn-22Al,Zn-28Al,Zn-37Al和Zn-45Al钎料钎焊获得Cu/Al接头.利用SEM,EDS和XRD研究了Zn-Al钎料成分对Cu/Al接头中Cu母材/钎缝界面结构的影响,并系统阐述了Zn-Al钎料成分-接头界面结构-接头抗剪切强度之间的关系.研究发现,Cu/Zn-15Al/Al接头中Cu母材/钎缝界面结构为Cu/Al4.2Cu3.2Zn0.7,且Al4.2Cu3.2Zn0.7界面层较薄,其厚度为2~3μm,接头具有较高的抗剪切强度,达66.3 MPa.随着钎料中Al含量的提高,在Cu/Zn-22Al/Al接头界面处Al4.2Cu3.2Zn0.7界面层的厚度逐渐增大,甚至在Cu/Zn-28Al/Al接头的Al4.2Cu3.2Zn0.7界面层附近出现少量的Cu Al2,接头的抗剪切强度逐渐降低.当采用Al含量较高的Zn-37Al钎料钎焊Cu/Al接头时,Cu母材/钎缝界面结构转变为Cu/Al4.2Cu3.2Zn0.7/Cu Al2;脆性Cu Al2层的出现,使接头抗剪切强度大幅下降,为34.5 MPa.当采用Al含量最高的Zn-45Al钎料钎焊Cu/Al接头时,Cu母材/钎缝界面结构转变为Cu/Cu Al2,接头抗剪切强度最低,为31.6 MPa.     

热压焊接制备的Cu / Al双金属的界面组织和剪切强度

采用扩散焊（DFW）技术制备了Cu/Al双金属,连接温度范围683-803K,连接时间范围20-80min,连接压力15MPa。Cu/Al双金属界面处的SEM试验结果表明,随着焊接温度的升高和保温时间的延长,界面层厚度逐渐增加,在连接温度为803K,连接时间80min,Cu/Al界面处形成了Al4Cu9,Al3Cu4,AlCu、Al2Cu金属间化合物（从铜侧到铝侧）,根据扩散动力学,金属间化合物(IMCS)的生成顺序为Al2Cu、Al4Cu9、AlCu、Al3Cu4。Cu / Al双金属的剪切试验显示为脆性断裂,并且界面强度随着IMC的减少而增加。在723 K的焊接温度下进行20分钟焊接后,Cu / Al双金属的剪切强度最高为63.8 MPa。     

轧制复合电缆用Cu/Al复合材料变形规律研究

采用三步法复合工艺制备了电缆用Cu/Al复合板,分析了冷轧复合过程中Cu/Al复合板变形区的特点,研究了Cu层与Al层厚度比为1∶4时各组元压下率与总压下率的关系.将Cu/Al双金属变形区分为3个区,建立了基于原始坯料层厚比条件下的轧制复合Cu/Al复合板厚度模型.     

Al-Si-Ge钎料钎焊Cu/Al接头组织与性能研究

首次采用Al-5.6Si-25.2Ge钎料对Cu/Al异种金属进行了炉中钎焊,分别从钎料的熔化特性、铺展润湿性、Cu侧界面组织以及钎焊接头强度等方面进行了系统研究,并与Zn-22Al钎料钎焊结果进行对比。结果表明,Al-5.6Si-25.2Ge钎料具有较低的熔化温度(约541℃),同时在Cu、Al母材上均具有良好的铺展润湿性。Al-5.6Si-25.2Ge/Cu界面由CuAl_2/CuAl/Cu_3Al_2三层化合物组成,其中CuAl和Cu_3Al_2呈层状,厚度较薄,仅为1~2 mm;CuAl_2呈胞状,平均厚度约为3 mm。Zn-22Al/Cu界面结构为CuAl_2/CuAl/Cu_9Al_4,其中CuAl_2层平均厚度高达15 mm。接头抗剪切强度测试结果表明,Zn-22Al钎料钎焊Cu/Al接头抗剪切强度仅为42.7 MPa,而Al-5.6Si-25.2Ge钎料钎焊Cu/Al接头具有更高的抗剪切强度,为53.4 MPa。     

液-固体积比对消失模铸造Al/Cu双金属界面组织性能的影响

研究液固体积比对消失模铸造Al/Cu双金属界面组织和性能的影响,并对Al/Cu双金属界面的形成机理进行讨论。结果表明:液固体积比为3:1时Al/Cu双金属材料无法形成有效的冶金结合,当液固体积比超过5:1时,Al/Cu双金属材料连接区域部分位置开始发生冶金结合;在发生冶金反应的情况下,Al/Cu双金属界面面均由Al4Cu9层,AlCu层,Al2Cu层和共晶反应层4层组成;随液固体积比增大,由于凝固时间延长和铜基体的溶解增加的共同作用,共晶反应层组织出现先粗大后细化的变化。Al/Cu界面层的硬度在140~190HV之间,未呈明显的规律性,随着液固体积比的增大,Al/Cu双金属材料的剪切强度先增加后减小,并在在7:1时达到最大值(81 MPa),且均从金属间化合物(IMCs)层发生断裂。     

Al/Cu感应钎焊接头组织及性能研究

以某型汽车车载制冷系统为研究背景,采用Zn-22Al钎料配合Cs F-Al F_3钎剂通过感应钎焊的方法实现了Al/Cu的连接。研究结果表明,Al/Cu钎焊接头的Cu侧界面处主要由Al_4Cu_9和Al_2Cu_3金属间化合物组成,没有脆性Al_2Cu金属间化合物生成。钎焊接头抗剪切强度高达72 MPa,Al/Cu接头拉伸断裂于Cu侧界面处,呈现出典型的解理断裂形式。其研究结果能够为车载制冷系统及相近领域提供参考。     

退火温度对1060Al/TA2/CCSB爆炸复合板结合界面 微观组织与力学性能的影响

研究了1060Al/TA2/CCSB爆炸复合板结合界面在不同退火温度下的显微组织、力学性能。结果表明,复合板在其界面处呈现连续均匀分布的波状结合,界面处存在漩涡、熔化块、表面微裂纹和绝热剪切带等缺陷。对复合板进行拉脱测试和剪切测试,拉脱断裂发生在1060Al/TA2界面,1060Al/TA2界面的剪切强度低于TA2/CCSB界面。复合板波状界面的存在,阻碍了拉伸过程中的颈缩过程,使复合板塑性提高。随着退火温度升高到400℃,结合界面发生回复,消除了加工硬化效应,使得界面硬度降低;ASB消失并转变为等轴α晶粒,缺陷减少;界面处的熔化块发生溶解,使复合板结合界面组织结构更加均匀,获得良好的综合性能。     

化学镀Ni-P对挤压铸造固-液复合Cu/Al双合金界面的影响

为了有效增强Cu/Al双合金界面结合效果，采用化学镀镍的方法在铜合金的表面镀厚为11μm的Ni-P层，然后采用挤压铸造工艺制备了Cu/Al双合金铸件。研究表明，与无化学镀相比，采用化学镀Ni-P层的Cu/Al双合金界面无裂缝、夹渣等缺陷，界面厚度均匀，为冶金结合。界面由3个区域组成，从铜基体一侧开始依次是：Ⅰ区域主要由Ni(Cu)固溶体组成、Ⅱ区域由Ni₃P相组成、Ⅲ区域由Al₃Ni相组成；双合金界面的剪切强度显著增大，可达28.26 MPa。     

退火温度对铜/铝/铜复合板结合性能的影响

采用冷轧复合法制备Cu/Al/Cu 3层复合板,研究不同退火温度对Cu/Al/Cu复合板结合性能的影响。采用光学显微镜(OM)及扫描电镜(SEM)观察界面过渡层的微观组织形貌,采用EDX分析界面物相成分,采用室温拉伸实验检测结合界面的结合强度。结果表明,退火温度越高,界面扩散层越明显,扩散层厚度越大,增长的速度越快;随着温度升高,复合界面处生成金属间化合物Cu_9Al_4、CuAl_2和CuAl。退火温度达到550℃时,界面层还会生成Cu_4Al_3和Cu_3Al_2。界面的结合强度随着退火温度的升高先上升后下降,最后趋于稳定。冷轧复合法制备的Cu/Al/Cu复合板最佳退火温度为350℃。     

浸镀Ni对Al/Cu双金属材料界面显微组织及力学性能的影响(英文)

采用浸镀的方法在纯铝基体上浸镀镍基镀层,然后在450~550℃温度范围内用扩散复合的方法制备Al/Cu双金属材料。用扫描电子显微镜(SEM)和X射线衍射仪(XRD)分别对Al/Cu结合体的界面显微组织以及断裂表面进行表征。用拉伸剪切测试及显微硬度测试对Al/Cu双金属材料的力学性能进行测量。结果表明,Ni中间层可以有效地消除Al—Cu金属间化合物的形成。Al/Ni界面由Al_3Ni和Al_3Ni_2两相组成,而在Ni/Cu界面处则是Ni—Cu固溶体。Ni中间层的加入提高了复层材料的拉伸剪切强度。在500℃制备的添加Ni中间层的试样表现出最大的拉伸剪切值,为34.7 MPa。     

Cu/Mo/Cu复合板界面变形及厚度配比

采用热轧+温轧方法制备Cu/Mo/Cu复合板,研究轧制工艺对复合板结合界面及组元厚度配比的影响。结果表明：经过轧制变形后,铜钼界面实现紧密结合且结合机制为齿状啮合,铜层外表面和靠近界面层的晶粒比中部细小;随着变形量的增加,铜层等轴状晶粒沿轧制方向被拉伸,界面结合效果明显改善,且由齿状变得较为平直。分析组元厚度配比,铜层变形量较钼层的大,随着总压下量的增加,组元压下率的差值减小,变形量逐渐趋于一致;首次提出了Cu/Mo/Cu三层复合板厚度配比的关系,为实际选择原料提供依据     

Bonding strength of Invar/Cu clad strips fabricated by twin-roll casting process

Based on traditional twin-roll casting process, Invar/Cu clad strips were successfully fabricated by using solid Invar alloy strip and molten Cu under conditions of high temperature, high pressure and plastic deformation. A series of tests including tensile test, bending test, T-type peeling test and scanning electron microscope (SEM) and energy dispersive spectrometer (EDS) measurements were carried out to analyze the mechanical properties of Invar/Cu clad strips and the micro-morphology of tensile fracture surfaces and bonding interfaces. The results indicate that no delamination phenomenon occurs during the compatible deformation of Invar/Cu in bending test and only one stress platform exists in the tensile stress?strain curve when the bonding strength is large. On the contrary, different mechanical properties of Invar and Cu lead to delamination phenomenon during the uniaxial tensile test, which determines that two stress platforms occur on the stress?strain curve of Invar/Cu clad strips when two elements experience necking. The average peeling strength can be increased from 13.85 to 42.31 N/mm after heat treatment at 800 °C for 1 h, and the observation of the Cu side at peeling interface shows that more Fe is adhered on the Cu side after the heat treatment. All above illustrate that heat treatment can improve the strength of the bonding interface of Invar/Cu clad strips.     

铝铜双金属管拉伸复合界面强度的研究

采用压剪切法来评价和测定铝铜双金属管拉伸复合界面强度,根据该原理设计并制作了一套复合界面强度检测装置。通过正交试验,研究了各工艺因素对复合界面强度的影响规律,为合理制订铝铜双金属管拉伸复合工艺提供了依据。     

铁/铝爆炸复合双金属管界面的结合性能

采用爆炸焊接法制备Fe/Al双金属复合管,为表征复合管界面的结合性能进行了压缩、压扁及压剪实验。实验结果表明,复合管结合良好,其界面强度大于纯铝层的抗剪强度,并且能够承受轴向和径向变形。利用扫描电子显微镜观察了原始界面形貌。测试结果表明,结合良好的复合管界面呈波状或直线状。采用液压胀形工艺以Fe/Al双金属复合管制备出复合管正三通,发现良好的界面结合对铁/铝双金属管的塑性成型具有重要作用。     

Interfacial pressure distribution and bonding characteristics in twin-roll casting of Cu/Al clad strip

The mechanical properties and product thickness specifications of bimetallic clad strip prepared by twin-roll casting are tightly related to the mechanical behavior of bonding interface interaction. The thermal?flow coupled simulation and the interface pressure calculation models are established with the cast-rolling velocity as the variable. The results show that the interface temperature decreases, the interface pressure and the proportion of the thickness of the Al side increase with the decrease in cast-rolling velocity. The thinning of Cu strip mainly occurs in the backward slip zone. The higher pressure and longer solid/semi-solid contact time make the interface bonded fully, which provides favorable conditions for atomic diffusion. The inter-diffusion zone with a width of 4.9 μm is attained at a cast-rolling velocity of 2.4 m/min, and the Cu side surface is nearly completely covered by aluminum. Therefore, the ductile fracture occurs on the Al side, which prevents the propagation of interface delamination cracks effectively. Meanwhile, shear effect becomes more significant at high interfacial pressure and large plastic strain, and the microstructure on Al side is composed of slender columnar crystals. Thus, the metallurgical bonding and refinement of grains on the Al side can result in higher bonding strength and tensile properties of the clad strip.     

Asymmetry in interface and bending property of Al/Cu/Al bimetallic laminates

This work was aimed to study the interfacial microstructures and three-point bending properties of Al/Cu/Al bimetallic laminates produced by the asymmetrical roll bonding and annealing. It is found that the microstructure and bonding strength of the Al/Cu interface are different with those of the Cu/Al interface. The interfacial microstructure of Cu/Al interface is improved due to the large interfacial plastic deformation caused by the different rotation speeds of roll in the asymmetrical roll bonding process. The bonding strength between Al and Cu layer can be enhanced by the moderate atomic diffusion, but is dramatically depressed by the formation of intermetallic compounds in the interface.The bending strength of bimetallic laminates is enhanced when the Cu/Al interface is loaded in tension because of the improvement of stress transition and damping by the Cu/Al interface during the three-point bending deformation. The bending fracture reveals that the interfacial cracks can be inhibited from the restricted stress concentration in the improved Cu/Al interface.     

Microstructure evolution,mechanical properties and tailoring of coefficient of thermal expansion for Cu/Mo/Cu clad sheets fabricated by hot rolling

The law of microstructure evolution and mechanical properties of hot roll bonded Cu/Mo/Cu clad sheets were systematically investigated and the theoretical prediction model of the coefficient of thermal expansion (CTE) of Cu/Mo/Cu clad sheets was established successfully. The results show that the deformation of Cu and Mo layers was gradually coherent with an increase in rolling reduction and temperature and excellent interface bonding was achieved under the condition of a large rolling reduction. The development of the microstructure and texture through the thickness of Cu and Mo layers was inhomogeneous. This phenomenon can be attributed to the friction between the roller and sheet surface and the uncoordinated deformation between Cu and Mo. The tensile strength of the clad sheets increased with increasing rolling reduction and the elongation was gradually decreased. The CTE of Cu/Mo/Cu clad sheets was related to the volume fraction of Mo. The finite element method can simulate the deformation and stress distribution during the thermal expansion process. The simulation result indicates that the terminal face of the clad sheets was sunken inward.     

钛/铝复合板爆炸焊接技术研究进展

通过爆炸焊接技术制备的钛/铝复合板可兼具钛合金耐腐蚀性和铝合金低成本的优点。对钛/铝复合板爆炸焊接技术的研究进展进行介绍,论述了炸药种类、质量比R、基覆板间距及爆炸焊接窗口等主要工艺参数对钛/铝复合板组织和性能的影响;分析了影响钛/铝复合板结合界面的主要因素——金属间化合物种类、扩散层和界面波形;对钛/铝复合板硬度、抗剪切强度、抗拉强度及拉伸断口的研究进行了汇总分析。最后,指出了钛/铝复合板爆炸焊接工艺研究的重点发展方向。     

轧制参数对钛/铝轧制复合板的结合强度和剥离面SEM形貌的影响

研究了钛/铝的轧制复合工艺对轧后结合强度和剥离面形貌的影响。试验结果表明,钛的变形程度是控制结合强度和剥离面形貌的主要因素;轧制时铝的温度对结合也有重要的影响。在钛和铝的热轧复合中并存着3种结合机制。     

Effect of immersion Ni plating on interface microstructure and mechanical properties of Al/Cu bimetal

A nickel-based coating was deposited on the pure Al substrate by immersion plating, and the Al/Cu bimetals were prepared by diffusion bonding in the temperature range of 450–550 °C. The interface microstructure and fracture surface of Al/Cu joints were studied by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The mechanical properties of the Al/Cu bimetals were measured by tensile shear and microhardness tests. The results show that the Ni interlayer can effectively eliminate the formation of Al-Cu intermetallic compounds. The Al/Ni interface consists of the Al₃Ni and Al₃Ni₂ phases, while it is Ni-Cu solid solution at the Ni/Cu interface. The tensile shear strength of the joints is improved by the addition of Ni interlayer. The joint with Ni interlayer annealed at 500 °C exhibits a maximum value of tensile shear strength of 34.7 MPa.