基于有源网络和受控辅助电阻支路的有源电感

针对传统共漏-共栅-共源(CD-CG-CS)有源电感的不足,结合有源网络和受控辅助电阻支路,设计了一款具有大电感值,且可在不同频率下获得高Q峰值和在同一频率下对Q峰值进行大范围调谐的新型有源电感.基于TSMC 0.18μm CMOS工艺,利用安捷伦公司的射频电路设计工具ADS软件对其进行仿真验证.仿真结果表明:当调节有源网络偏置时,在2.48～2.87 GHz的工作频带内,取得了10.89～ 13.16 nH的大电感值,在2.48,2.74和2.87 GHz三个不同频率下,分别取得了9 997,4 015和2 717的高Q峰值.当调节受控辅助电阻支路偏置时,在工作频率为3.10 GHz下,取得了11.65～17.61 nH的大电感值,Q峰值可在616～3 823之间进行大范围调谐.用Cadence Virtuoso工具进行版图设计,新型有源电感的版图面积较小,仅为21.5 μm×34.4 μm.     

一种改进型共源-共栅-共漏有源电感

在传统共源-共栅-共漏(CS-CG-CD)有源电感的基础上，提出一种改进型有源电感。在负跨导器的CG晶体管与正跨导器的CD晶体管之间引入带有并联电阻的第一反馈回路和具有小尺寸晶体管的第二反馈回路；另外，在负跨导器的CS晶体管与正跨导器的CD晶体管之间引入调控支路；最终，通过不同模块的相互配合及其他三个外部调控端电压的联合调节，实现了对电感性能的两种重构：1)在同一频率下取得高的Q峰值且Q峰值相对L值可大范围独立调节；2)在不同频率下取得高的Q峰值且Q峰值保持基本不变。验证结果表明，在频率5.81 GHz下，Q峰值可从1 132调谐到15 491,调谐范围高达1 268.5%,而电感值在7.65～7.67 nH之间变化，变化率仅为0.26%;在频率5.72 GHz、7.12 GHz和7.93 GHz下，分别取得了1 274、1 317和1 310的高Q峰值，Q峰值变化率仅为3.38%,同时分别取得了大的电感值7.62 nH、8.08 nH和8.81 nH;有源电感的直流功耗约为38.61 mW。     

一种Q值高且可独立调节的新型宽带有源电感

基于回转器原理,提出了一种可在较宽频带内工作、具有大电感值和高Q值、Q值相对于电感值可以独立调节的新型有源电感。在回转器的负跨导器中,引入了调制MOS管。一方面,增加了一个新的回转通路,进而增加了回转次数,实现了大电感值。另一方面,创建了一个反馈支路,减小了等效串联电阻,实现了高Q值。将为正跨导器提供偏置的电流源与负跨导器交叉耦合连接,形成负阻结构,增大了等效并联电阻,进一步提高Q值。在有源电感的输入端串接小尺寸MOS管,减小了等效输入电容,实现了高的谐振频率和宽的工作频带。对有源电感进行验证,结果表明,Q峰值可高达1 996,电感峰值可高达54 nH,工作频带为0~12 GHz。协同调节有源电感的两个外部偏置电压时,实现了Q值相对于电感值的独立调节。Q值峰值从52到995大幅度变化时,电感峰值的变化幅度仅为5.3%。     

一种Q-f与L-f特性增强的高线性有源电感

提出了一种品质因数(Q)-频率(f)特性与电感值(L)-频率(f)特性增强的新型高线性有源电感,主要由负跨导器、新型正跨导器、Q值增强调制模块、反馈电阻、两级电平转换电路和负跨导器分流支路组成。通过多个电路单元间的协同配合和所设置的三个外部偏置端电压的联合调谐,该有源电感不但具有高Q值,Q值相对于电感值可独立调节,而且高Q峰值及电感值在不同频率下能够基本保持不变,同时也有高的线性度。验证结果表明,在6 GHz下,Q值可在275~4 471之间变化,调谐率为176.8%,而电感值的变化率仅为1.5%；在4.8 GHz、5.2 GHz、5.6 GHz和6 GHz的4个频点下,分别获得了4 480、4 469、4 473和4 471的高Q峰值,变化率仅为0.24%,且电感值分别为7.532 nH、7.467 nH、7.909 nH、7.977 nH,变化率仅为6.3%；电感值的-1 dB压缩点为-13 dBV。     

一种Q-f特性和对工作电压波动鲁棒性增强的有源电感

提出一种品质因数(Q)-频率特性(Q-f特性)和对工作电压波动鲁棒性增强的新型有源电感。首先,通过回转器、直流偏置电路、分流支路三个构成模块的相互配合和它们的外部偏置端电压的协同调节,增强了Q-f特性,即实现了在同一频率下Q峰值相对于电感值可大范围独立调节以及在不同频率下Q峰值保持基本不变的2种Q值特性;其次,通过设置由感知单元与放大单元构成的稳压模块,增强了电感值和Q峰值对工作电压波动的鲁棒性。结果表明,在频率3.84 GHz下,Q值可从636调节到4032,调节率高达533%,而电感值变化率仅为0.13%;在3.84 GHz、2.40 GHz和1.54 GHz不同频率下,分别取得4032、4039和4043的高Q峰值,Q峰值变化率仅为0.2%;电感值和Q峰值的工作电压敏感度分别为0.011 nH/mV和20.0 /mV。     

一种双回转器有源电感

针对基于共源-共栅负跨导器的传统单回转器有源电感(TSAI-CS-CG)的不足,联合采用双回转器结构、负阻网络和负反馈网络,提出了一款兼有大电感值、高Q值、高线性度、宽频带、可调谐特性的双回转器有源电感(DGAI)。基于TSMC 0.13μm RF CMOS工艺,利用是德科技公司的射频高级设计系统（ADS）进行验证。结果表明：电感工作频率范围为0~22.5GHz;Q峰值可达6883;电感的-1dB压缩点高达-17dBm;调节外部偏置,在频率为15GHz下,在频率为15GHz下,电感值可从19.59nH到73.41nH之间进行大范围调节。     

射频前端宽带高Q值可调节集成有源电感

针对传统接地有源电感的电感值低、Q值低等缺点,提出了一种改进型的有源电感,并给出了等效电路图及等效阻抗的表达式。基于TSMC 0.35μm SiGe BiCMOS工艺,利用Cadence软件,完成了电路和版图设计。提出的有源电感,在频率小于5GHz时,其等效电感值随频率变化很小,大于5GHz后,随频率变化略有增大。通过改变外加偏置电压,实现了电感值和Q值的可调,电感值可调范围为1.035～5.631nH,Q值最大值可达到1 557;同时,也可调节有源电感Q值达到最大值时所对应的工作频率。     

一种电感值和Q峰值可相互独立调谐的高线性有源电感

设计了一种电感值和Q峰值可相互独立调谐的高线性有源电感。该电感主要由跨导增强模块、互补共源级模块以及单端负阻模块构成。其中,跨导增强模块不仅可以作为正跨导器,并且可实现对电感值的大范围调谐；互补共源级模块不仅可以作为负跨导器,并且可改善有源电感的线性度；单端负阻模块不仅提高了Q值,并且补偿由电感值的调谐导致的Q峰值的变化。最终,通过以上模块的相互配合及其外部端口电压的协同调控,改善了有源电感的线性度,而且实现了在同一频率下Q峰值相对于电感值可大范围独立调谐以及在不同频率下电感值相对于Q峰值可大范围独立调谐的优秀性能。验证结果表明,该有源电感电感值的-1 dB压缩点为-7 dBm；在2.07 GHz的频率下,Q峰值可从240调节到1573,而电感值从11.89 nH仅变化到12.11 nH；在0.989 GHz、2.070 GHz和3.058 GHz的不同频率下,取得了493.7、501.2和508.4的高Q峰值,变化率仅为3%,而相应频率下的电感值分别为16.1 nH、13.4 nH和6.8 nH,变化率为136.7%。     

一种同时具有优秀电感值和 Ｑ 值特性的压控有源电感

提出了一种同时具有优秀电感值和Q值特性的新型压控有源电感（VCAI）,主要由回转器单元、Q值增强单元、调控补偿单元和噪声抑制单元等4个模块组成,其中回转器单元和调控补偿单元分别设置了两个外部调控电压。通过4个电路单元的相互配合和协同调节4个外部调控电压,使得VCAI不但具有高Q值、大电感值、低噪声,而且在不同工作频率下同时获得了大的电感峰值以及高的Q峰值,同时频带也可相对于电感峰值独立调谐。基于TSMC 0.13 μm CMOS进行工艺验证,结果表明,该VCAI在9.1 GHz的高频下,电感峰值和Q峰值可分别高达62052 nH和895.6;在9.4 GHz的高频下,电感峰值和Q峰值可分别高达55847 nH和861.2;工作频带可从6.12 GHz调谐到10.31 GHz,调谐比率高达68.46%,而电感峰值只在1271.1 nH ~ 1271.2 nH之间变化,变化率仅为0.0079%;最大噪声仅为3.61 nV/。     

一种采用LC谐振电路的高频差分有源电感

提出了一种采用LC并联谐振电路的新型差分有源电感,实现了宽的工作频带、高的Q值、较大的电感值和可调谐功能。采用无源电感和MOS晶体管可变电容构成LC谐振电路,减小了等效串联电阻和等效并联电容,在增大电感值、Q值的同时,扩大了工作频带。仿真结果表明,在2~7.6 GHz频率范围内,该新型差分有源电感的电感值大于26 nH,Q值大于138;在7.6 GHz高频下,电感值达130 nH,Q值达418,实现了宽工作频带范围内的高Q值和高电感值。与传统差分有源电感和带LC谐振电路的单端有源电感相比,该新型差分有源电感的性能较好。     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Nanoimprint Lithography -A Next Generation High Volume Lithography Technique

IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

Influence of PVK ： NPB hole transporting layer on the characteristics of organic light-emitting devices

A doping system consisting of NPB and PVK is employed as a composite hole transporting layer （CHTL）. By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK ： NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK ： NPB at 1：3.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.     

Analysis of error performance on Turbo coded FDPIM

Due to variable symbol length of digital pulse interval modulation（DPIM）, it is difficult to analyze the error performances of Turbo coded DPIM. To solve this problem, a fixed-length digital pulse interval modulation（FDPIM） method is provided. The FDPIM modulation structure is introduced. The packet error rates of uncoded FDPIM are analyzed and compared with that of DPIM. Bit error rates of Turbo coded FDPIM are simulated based on three kinds of analytical models under weak turbulence channel. The results show that packet error rate of uncoded FDPIM is inferior to that of uncoded DPIM. However, FDPIM is easy to be implemented and easy to be combined, with Turbo code for soft-decision because of its fixed length. Besides, the introduction of Turbo code in this modulation can decrease the average power about 10 dBm, which means that it can improve the error performance of the system effectively.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.