磁场引起弱耦合超晶格中隧穿电流的增加

在n-型掺杂弱耦合GaAs/AlAs超晶格中,沿着垂直于超晶格平面方向加一个静态磁场,研究电子的隧穿过程.随着磁场的增加,相邻量子阱基态间的隧穿电流增加.这是由于磁场导致电子的隧穿机制发生了变化,即由低磁场下电子的非共振隧穿或跳跃电导向高磁场下电子的共振隧穿的转变.     

室温下高峰谷电流比、高峰电流密度的双势垒共振隧穿二极管

在半绝缘GaAs衬底上制作了AlAs/GaAs/In0.1Ga0.9As/GaAs/AlAs双势垒共振隧穿二极管.在GaAs层中加入In0.1Ga0.9As层用以降低势垒两边的势阱深度,从而提高了器件的峰谷电流比和峰电流密度.为了减小器件的接触电阻和电流的非均匀性,使用了独特形状的集电极,总的电流密度也因此提高.薄栅也有助于提高器件的PVCR和峰电流密度.在室温下测得其峰谷电流比高达13.98,峰电流密度大于89kA/cm2.     

室温下高峰谷电流比、高峰电流密度的双势垒共振隧穿二极管

在半绝缘GaAs衬底上制作了AlAs/GaAs/In0.1Ga0.9As/GaAs/AlAs双势垒共振隧穿二极管.在GaAs层中加入In0.1Ga0.9As层用以降低势垒两边的势阱深度,从而提高了器件的峰谷电流比和峰电流密度.为了减小器件的接触电阻和电流的非均匀性,使用了独特形状的集电极,总的电流密度也因此提高.薄栅也有助于提高器件的PVCR和峰电流密度.在室温下测得其峰谷电流比高达13.98,峰电流密度大于89kA/cm2.     

磁场引起弱耦合超晶格中隧穿电流的增加

在n-型掺杂弱耦合GaAs/AlAs超晶格中,沿着垂直于超晶格平面方向加一个静态磁场,研究电子的隧穿过程.随着磁场的增加,相邻量子阱基态间的隧穿电流增加.这是由于磁场导致电子的隧穿机制发生了变化,即由低磁场下电子的非共振隧穿或跳跃电导向高磁场下电子的共振隧穿的转变.     

共振隧穿二极管型光探测器和光调制器

将共振隧穿二极管(RTD)的核心结构——双势垒系统与光探测器和调制器的原理相结合可构成共振隧穿光探测器和共振隧穿光调制器。这些器件既保持了RTD高频、高速的特点,同时又具备了光探测器和光调制器原有的功能,可用于光电集成电路。介绍了这种具有代表性的RTD型光电器件的工作原理、器件结构、制造工艺、器件参数测试等,为此类器件在国内的设计和研制奠定基础。     

不对称双势垒结构中的非共振磁隧穿现象

本文系统研究了不对称GaAs/AlAs双势垒共振隧穿结构中非共振磁隧穿谱在正反偏压方向上的特征差异,并且用渡越电子沿正反方向隧穿通过双势垒结构时在势阱中停留时间的不同合理解释了实验结果。     

GaAs-AlxGa1-xAs双势垒结构中电子共振隧穿寿命

采用转移矩阵和数值计算相结合的方法求解含时Schrodinger方程,计算了电子在双势垒结构中的构建时间和隧穿寿命.结果表明:构建时间和隧穿寿命对于描述电子隧穿时间特性同等重要.通过研究隧穿时间对结构参数的依赖情况发现,隧穿寿命随阱宽和垒厚的增加而迅速增大.     

抛物形量子阱的共振隧穿

文中通过求解薛定谔方程得到抛物型形量子阱的变换矩阵与透射系数。利用这一结果计算透射系数可以达到任意高的精度，最后，讨论了结构变化对抛物型量子阱的共振隧穿的影响。     

共振隧穿二极管

设计并研制出室温工作的共振隧穿二极管,室温电流峰谷比达到7.6:1,最高振荡频率为54GHz。本文对RTD的设计、研制过程、参数和特性测试进行了系统的分析和说明。     

GeSi/Si共振隧穿二极管

GeSi/Si共振隧穿二极管主要包括空穴型GeSi/SiRTD、应力型GeSi/SiRTD和GeSi/Si带间共振隧穿二极管三种结构。着重讨论了后两种GeSi/Si基RTD结构;指出GeSi/Si异质结的能带偏差主要发生在二者价带之间(即ΔEv>ΔEc),形成的电子势阱很浅,因此适用于空穴型RTD的研制;n型带内RTD只有通过应力Si或应力GeSi来实现,这种应力型RTD为带内RTD的主要结构;而带间GeSi/SiRITD则将成为更有应用前景的、性能较好的GeSi/SiRTD器件结构。     

A DBRTD with a High PVCR and a Peak Current Density at Room Temperature

AlAs/GaAs/In0.1Ga0.9As/GaAs/AlAs double-barrier resonant tunneling diodes(DBRTDs) grown on a semi-insulated GaAs substrate with molecular beam epitaxy is demonstrated.By sandwiching the In0.1Ga0.9As layer between GaAs layers,potential wells beside the two sides of barrier are deepened,resulting in an increase of the peak-to-valley current ratio (PVCR) and a peak current density.A special shape of collector is designed in order to reduce contact resistance and non-uniformity of the current;as a result the total current density in the device is increased.The use of thin barriers is also helpful for the improvement of the PVCR and the peak current density in DBRTDs.The devices exhibit a maximum PVCR of 13.98 and a peak current density of 89kA/cm2 at room temperature.     

Power and stability limitations of resonant tunneling diodes

Stability criteria for resonant tunneling diodes are investigated. Details of how extrinsic elements, such as series inductance and parallel capacitance, affect the stability are presented. A GaAs/AlAs/InGaAs/AlAs/GaAs double-barrier diode is investigated, showing the effect of different modes of low-frequency oscillation and the extrinsic circuit required for stabilization. The effect of device stabilization on high-frequency power generation is described. The main conclusions of the paper are: (1) stable resonant tunneling diode operation is difficult to obtain, and (2) the circuit and device conditions required for stable operation greatly reduce the amount of power that can be produced by these devices     

Well-defined electrical properties of high-strain resonant interband tunneling structure

The GaAs/InAs high-strain resonant interband tunneling diodes (HSRITDs) have been implemented by metal organic chemical vapor deposition (MOCVD). The current-voltage characteristics of variable quantum well and barrier thickness grown on (1 1 1) GaAs substrates are investigated. Experimental results reveal that the quantum barrier and well layer will influence current-voltage properties such as the peak current density, valley current density, and peak-to-valley current ratio (PVCR). Both peak current and valley current density decrease with increasing layers width. This result also exhibits the variation of PVCR with layers width.     

InP基谐振隧穿二极管的研究

谐振隧穿二极管(RTD)具有高频、低功耗、负阻、双稳态、自锁等优点,在超高速数字电路领域具有非常好的应用前景.加之InP材料固有的优越特性,使得InP基谐振隧穿器件成为目前研究的重点.研究并试制了InP基RTD实验样品,对其直流特性进行了测试分析,器件的最大电流峰谷比(PVCR)达到了17.8.     

Fabrication of an AlAs/In0.53Ga0.47As/InAs Resonant Tunneling Diode on InP Substrate for High-Speed Circuit Applications

在InP衬底上采用感应耦合等离子体刻蚀技术制备了高性能的AlAs/In0.53Ga0.47As/InAs共振隧穿二极管.正向偏压下PVCR=7.57,Jp=39.08kA/cm2;反向偏压下PVCR=7.93,Jp=34.56kA/cm2.在未去除测试电极和引线等寄生参数影响下,面积为5μm×5μm的RTD的阻性截止频率为18.75GHz.最后对非对称的I-V特性进行了分析讨论.     

High performance aluminum arsenic intraband resonant microwave devices

We report on GaAs/AlAs triple-barrier quantum well intraband (TBQWI) heterostructures grown by molecular beam epitaxy (MBE) on n⁺ GaAs substrate. Heterostructure quality was evaluated by X-ray diffraction and photoluminescence spectrum measurements. The position of the broad peak near 65.84° corresponds well to the diffraction from the (4 0 0) face of AlAs layers assuming intensity of total AlAs spacers and barriers. The 10K photoluminescence (PL) data has a strong peak at 8140 Å. The PL spectrum is dominated by a sharp peak centered at the emission energy of 1.52 eV attributed to the energy of e1-hh bond exciton of GaAs layer. TBQWI heterostructures were grown and processed into resonant tunneling diode (RTD). Room temperature electrical measurement of the TBQWI RTD yielded maximum peak to valley current ratio (PVCR) of 120 with peak current density (J_p) of 2.1 kA/cm². The high PVCR of this GaAs/AlAs TBQWI RTD is, to the better of our knowledge, one of the higher PVCRs obtained in any intraband tunnel device.     

纳米电子器件及其集成

对基于Top-Down加工技术的纳米电子器件如：单电子器件、共振器件、分子电子器件等的研究现状、面临的主要挑战等进行了讨论. 采用CMOS兼容的工艺成功地研制出单电子器件，观察到明显的库仑阻塞效应；在半绝缘GaAs衬底上制作了AlAs/GaAs/In0.1Ga0.9As/GaAs/AlAs双势垒共振隧穿二极管,采用环型集电极和薄势垒结构研制的共振隧穿器件，在室温下测得其峰谷电流比高达13.98，峰电流密度大于89kA/cm2；概述了交叉阵列的分子存储器的研究进展.     

用于高速电路的InP基共振隧穿二极管制作

在InP衬底上采用感应耦合等离子体刻蚀技术制备了高性能的AlAs/In0.53Ga0.47As/InAs共振隧穿二极管.正向偏压下PVCR=7.57,Jp=39.08kA/cm2;反向偏压下PVCR=7.93,Jp=34.56kA/cm2.在未去除测试电极和引线等寄生参数影响下,面积为5μm×5μm的RTD的阻性截止频率为18.75GHz.最后对非对称的I-V特性进行了分析讨论.     

带间共振隧穿二极管(RITD)

带间共振隧穿二极管(RITD)是导带与价带间发生共振隧穿的两端器件,其特点是启始电压VT和峰值电压Vp较低,电流峰谷比PVCR较大。在导出RITD物理模型和其电流密度方程的基础上重点介绍了InAs/AlSb/GaSbⅡ类异质结RITD、n+InAlAs/InGaAs/InAlAs/In-GaAs/p+InAlAsp-n结双势阱Ⅰ类RITD以及δ掺杂RITD三种RITD的器件结构、材料结构、工作原理、器件特性和参数等,并对这三种RITD的特点进行了比较和讨论。