共查询到18条相似文献,搜索用时 265 毫秒
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固化剂对酚醛树脂灌封胶性能的影响 总被引:1,自引:0,他引:1
为满足灌封胶黏剂中温固化耐高温的要求,研制新型耐高温灌封胶黏剂体系是十分重要的。研究了酚醛树脂固化剂对酚醛树脂挥发份、粘接强度、玻璃化转温度、固化温度等的影响,确定了固化剂和酚醛树脂最佳固化比例。表明采用的酚醛树脂固化剂可以显著降低酚醛树脂的挥发份,降低酚醛树脂固化温度,提高常温粘接强度,缺点是使酚醛树脂的玻璃化转变温度和高温剪切强度稍有下降,显示了固化剂的优异性能。该胶黏剂作为中温固化耐高温灌封胶黏剂可以满足航空工业耐高温的技术要求。 相似文献
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采用耐热酚醛树脂杂化了磷酸盐胶黏剂,以纳米氧化铝、氧化锆和氧化锌为固化剂,制备了一种对C/C和C/SiC复合材料具有良好粘接性能的胶黏剂。通过不同测试温度下的剪切强度,差示扫描量热仪(DSC),热失重(TG)以及扫描电子显微镜(SEM)探究了杂化胶黏剂的力学性能、固化行为、耐热性能以及高温下胶黏剂结构的变化。结果表明:酚醛树脂的加入,保持了耐热性能,降低了体系固化的固化温度,有效地提高了磷酸盐胶黏剂对C/C、C/SiC两种复合材料力学性能,室温下剪切强度均高于10MPa。 相似文献
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研究了端胺基液体丁腈橡胶(ATBN)改性环氧-醚胺体系的固化反应及胶黏剂的粘接性能。根据Ellerstein法计算固化反应活化能为77.3kJ/mol^-1,根据峰值法计算固化反应活化能为63.7kJ/mol,该体系最佳固化温度为39~82℃。经过对胶黏剂的粘接性能和和增韧相态的研究,发现在该固化体系中所形成橡胶相的粒径大小对胶黏剂的性能有较大影响,实验证明该体系在60℃固化温度时分散相粒子平均粒径为1~2μm,在室温固化条件下分散相粒子平均粒径为2~4μm,分散相中橡胶粒子粒径小于2μm时体系增韧效果最佳,胶黏剂具有优异的粘接性能。 相似文献
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《Journal of Adhesion Science and Technology》2013,27(13):1483-1495
Three phenolic resins were used to study the effect of resin structure and its percentage content on the bonding properties of nitrile rubber-based adhesives. The phenolic resins studied are derived from phenol, resorcinol and para-t-butyl phenol, and are of novalac type. These resins were characterized by infra-red and thermal studies. Several formulations were prepared by varying the phenolic resin/nitrile rubber ratio and these formulations were tested for viscosity and bonding properties. At a given resin-to-rubber ratio, the viscosity for resorcinol-formaldehyde resin was higher than phenol-formaldehyde resin followed by para-t-butyl phenol-formaldehyde resin. The peel strength of nitrile rubber-based adhesive prepared from resorcinol-formaldehyde resin was higher than adhesives that from para-t-butyl phenol-formaldehyde resin followed by phenol-formaldehyde resin. The lap shear strength of nitrile rubber-based adhesive containing para-t-butyl phenol-formaldehyde resin was higher than of adhesives containing the other two resins. The trend observed in peel strength could be explained on the basis of hydrogen bonding between hydroxyl groups of phenolic resin (adhesive) and hydroxyl groups of the starch-coated canvas cloth (adherend), whereas the trend observed in lap shear strength could be explained on the basis of extent of linearity in the resin structure. 相似文献
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高流动性快速固化酚醛注塑料的研制 总被引:2,自引:0,他引:2
介绍了一种高流动性快速固化酚醛注塑料的配方、制备工艺及其成型时间和流动特性。采用高邻位酚醛树脂为基质,复配复合稳定剂,优化辊炼工艺,制备了高流动性快速固化酚醛注塑料。该注塑料具有优异的流动性能,同时可快速成型,且不损失酚醛注塑料固有的力学性能、热性能及电性能。 相似文献
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Reactive interfacial agents are often used to homogenise the morphology of immiscible polymer blends and to improve the level of adhesion between the phases to achieve enhanced properties. This paper demonstrates the ability of hydroxyl methyl bisphenol A (HMBPA) to function as a reactive interfacial agent (compartibilizer) in a nitrile-epoxy film adhesive made from nitrile rubber (NBR) and solid epoxy resin blend. The curing of the adhesive film was achieved at 170° C by adding dicyandiamide, a latent curing agent for epoxy resin, and rubber vulcanising agents. Hydroxyl methyl bisphenol A resins with different hydroxyl methyl content, synthesised by the base-catalysed reaction of bisphenol A and formaldehyde in various mole ratios, were used to compatibilize a blend of nitrile rubber (NBR) and epoxy resin 50/50wt/wt. The effect of addition of HMBPA on the morphology, adhesive, thermal, and mechanical properties of the adhesive film was investigated. The nitrile-epoxy adhesive films were characterised by measurements of adhesive joint strength, stress-strain properties, DSC, TGA, TMA, DMA, and SEM. Results revealed that significant improvement in joint strength occurred at low levels of HMBPA, and the optimum strength was obtained at about 15 wt% of HMBPA in the blend. The hydroxyl methyl content in HMBPA was found to influence the properties of the adhesive film. The concept of strengthening the interphase between NBR and epoxy through the coupling reactions of HMBPA was used for interpreting the results. The effect of addition of silica, alumina, and aluminium fillers on the properties of the nitrile-epoxy adhesive film was also studied, and a comparison of properties with and without HMBPA is presented. 相似文献
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Reactive interfacial agents are often used to homogenise the morphology of immiscible polymer blends and to improve the level of adhesion between the phases to achieve enhanced properties. This paper demonstrates the ability of hydroxyl methyl bisphenol A (HMBPA) to function as a reactive interfacial agent (compartibilizer) in a nitrile-epoxy film adhesive made from nitrile rubber (NBR) and solid epoxy resin blend. The curing of the adhesive film was achieved at 170° C by adding dicyandiamide, a latent curing agent for epoxy resin, and rubber vulcanising agents. Hydroxyl methyl bisphenol A resins with different hydroxyl methyl content, synthesised by the base-catalysed reaction of bisphenol A and formaldehyde in various mole ratios, were used to compatibilize a blend of nitrile rubber (NBR) and epoxy resin 50/50wt/wt. The effect of addition of HMBPA on the morphology, adhesive, thermal, and mechanical properties of the adhesive film was investigated. The nitrile-epoxy adhesive films were characterised by measurements of adhesive joint strength, stress-strain properties, DSC, TGA, TMA, DMA, and SEM. Results revealed that significant improvement in joint strength occurred at low levels of HMBPA, and the optimum strength was obtained at about 15 wt% of HMBPA in the blend. The hydroxyl methyl content in HMBPA was found to influence the properties of the adhesive film. The concept of strengthening the interphase between NBR and epoxy through the coupling reactions of HMBPA was used for interpreting the results. The effect of addition of silica, alumina, and aluminium fillers on the properties of the nitrile-epoxy adhesive film was also studied, and a comparison of properties with and without HMBPA is presented. 相似文献
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以端羧基丁腈橡胶(CTBN)和环氧树脂(CYD)的预聚物为热不稳定聚合物,酚醛树脂(PF)作为炭前驱体聚合物,采用化学共聚方法制备出酚醛树脂基三元共聚物(PF+CYD+CTBN)体系。通过红外光谱分析证实CYD中的部分环氧基与CTBN中的羧基反应生成酯键,而剩余的环氧基与酚醛树脂中的酚羟基反应生成醚键,CTBN-CYD预聚物以接枝或嵌段的形式接入到酚醛树脂的固化体系中。通过对不同热处理温度下的三元共聚物进行红外、热重分析及对热解产物的孔径分析表明,三元共聚物中的酯键在450℃时发生断裂,CTBN链段率先从三元共聚物体系中热解选出,并在所得多孔炭材料中形成了孔径主要分布在1~2nm左右的微孔。 相似文献
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Adhesive resins with high adhesive strength and high heat resistance have been studied in developing a novel iron-core printed circuit board with high mechanical strength and high heat radiation capability. A reticular pattern formed on the surface of an adhesive resin composed of nitrile rubber, phenolic resin and epoxy resin. It caused blisters in the plating or reduced the heat resistance of the printed board. This pattern was formed as a result of phase separation of epoxy resin or phenolic resin from the nitrile rubber. Using a high-molecular-weight epoxy resin led to high adhesive strength and high heat resistance, without phase separation. The relationships between the composition of adhesive resins and their characteristics were discussed on the basis of the state of their surface after being roughened by chemical etching. © 1996 John Wiley & Sons, Inc. 相似文献