Co-Mn尖晶石涂层的制备

采用氯化物溶液在430不锈钢表面电沉积Co-Mn合金,重点研究了镀液pH值和电流密度对镀层微观结构及成分的影响。结果表明:pH值为2.5~6.5、电流密度为125~225mA/cm2时,镀层中的Mn含量随着pH值和电流密度的增大而增加;电流密度为125和175mA/cm2时,pH值是决定合金成分的主要因素,电流密度达到225mA/cm2时电流密度是影响合金成分的主要因素;电镀Co-Mn合金的优化工艺参数为pH值为4.5、电流密度为125mA/cm2,此时镀层质量良好,Mn含量可达20%(原子分数)以上;通过除氢处理及在800℃空气中的氧化处理,合金镀层转变为连续、与基体结合良好的MnCo2O4尖晶石涂层。     

脉冲电镀Ni-W-P镀层及其耐蚀性（英文）

采用脉冲电镀法在Cu基体上制备Ni-W-P合金镀层,并通过单因素方法探讨电解液pH(1~3)、温度(40~80°C)、平均电流密度(1~7 A/dm~2)及脉冲频率(200~1000 Hz)对沉积速度、镀层结构及耐蚀性能的影响。采用扫描电子显微镜、X射线衍射和X射线能谱仪对镀层表面微观形貌、结构及元素组成进行分析。在3.5%NaCl(质量分数)溶液及土壤溶液中采用动电位极化曲线及电化学阻抗谱对镀层的耐蚀性能进行研究。结果表明:脉冲电镀Ni-W-P镀层具有良好的耐蚀性能,且脉冲电镀参数对镀层结构及耐蚀性能具有十分重要的影响。最优脉冲电镀Ni-W-P镀层参数如下:pH 2.0、温度60°C、平均电流密度4 A/dm~2、脉冲频率600 Hz。在最优脉冲电沉积参数条件下制备的Ni-W-P合金镀层具有优良的耐腐蚀性能(276.8 k?),其表面致密,无任何明显缺陷。     

Al-Mg合金镀层的制备与性能

利用AlCl3 LiAlH4 MgBr2有机溶剂体系在碳钢基体上电沉积出Al-Mg合金镀层,并对不同沉积电流密度下Al-Mg镀层的表面形貌、成分、结构、厚度、结合力和耐蚀性进行了研究。结果表明:沉积出的铝镁合金镀层表面光滑、均匀、致密;膜层中的镁含量随沉积电流密度的增加而增大,且以Al-Mg固溶体形式存在,并按(200)面的结构生长;随沉积电流密度的增加,铝镁合金镀层的厚度与晶格常数呈线性增大;在3.5%NaCl溶液中的耐蚀性呈先增大后减小的规律;Al-Mg镀层与碳钢基体的结合力良好,均大于50 N;Al-Mg镀层的沉积速率、结合力和耐蚀性均高于相同沉积条件下的纯铝镀层;Al-Mg合金镀层沉积的最佳电流密度为0.75~1.50A/dm2。     

Co-Cu合金电镀工艺研究及其后续尖晶石涂层的制备探索

以柠檬酸盐为络合剂在铁素体不锈钢表面电镀Cu-Co合金,重点研究镀液pH值和沉积电位对电镀过程和镀层微观结构的影响。结果表明,在pH值为4~6镀液中Cu~(2+)与柠檬酸盐几乎完全络合,而Co~(2+)则以简单离子存在,络合Cu~(2+)与简单Co~(2+)的沉积电位相近,可实现Cu-Co合金共沉积。当pH值为4时镀层成分稳定性较佳。在pH值为4、沉积电位为-0.9~-1.1 VSCE时,随着电位值的增大镀层中Co/Cu(原子分数)相应增加。当沉积电位为-1 VSCE时,镀层中Co/Cu约为2。在800℃预氧化2 h后镀层转变为均匀致密、与基体之间结合良好的Cu-Co尖晶石涂层。涂层由三层结构组成:外层为一薄层Cu O;中间为一层较厚的Cu_(0.92)Co_(2.08)O_4尖晶石;内层为连续的Co_3O_4。     

金属连接体用Mn-Cu尖晶石涂层的制备及其高温氧化导电性能

为阻止Cr的外扩散、改善金属连接体的高温性能,采用高能微弧合金化(HEMAA)工艺,选用Mn-35Cu(原子分数%)合金电极在430SS基体上制备了Cu-Mn尖晶石涂层,然后在750℃空气中原位氧化得到Cu-Mn复合尖晶石涂层。结果表明:Cu-Mn复合尖晶石涂层致密,附着力良好;涂层的主要成分除了Cu-Mn尖晶石氧化物外,还含有一定量的Mn2O3,氧化层中基体元素Cr、Fe含量较低。涂层在800℃时的面比电阻测试结果显示,氧化100h后得到的复合Cu-Mn尖晶石涂层的电阻值为10mΩ·cm2。高能微弧合金化原位氧化后的复合Cu-Mn尖晶石涂层是一种很有前景的金属连接体涂层。     

离子液体AlCl_3-[bmim]Cl中电沉积铝的研究

在摩尔比为2:1的AlCl_3-[bmim]Cl离子液体中,加入一定量的甲苯,控制阴极电流密度,在基体铁片上获得银白色和平整致密的铝镀层。循环伏安实验表明离子液体中沉积铝源于Al_2Cl_7~-的还原,还原峰电位为-0.34V;当电流密度为20mA/cm~2时,最大电流效率达97%;所得铝镀层的厚度与电镀时间呈抛物线关系;在电流密度小于35mA/cm~2时,镀层厚度随电流密度增大呈逐渐递增趋势;扫描电镜、X射线能谱对铝镀层分析结果表明(45±2)℃温度得到平整致密纯度高的铝镀层;当电流密度为20mA/cm~2时,铝镀层呈薄片状生长,随电流密度的增大,镀铝层形貌由片状向粒状过渡,并伴随着晶粒的细化。     

烧结钕铁硼磁体表面Zn-Co合金镀层制备工艺与耐蚀性能

采用氯化物镀液体系在钕铁硼磁体表面制备Zn-Co合金镀层,优化了Zn-Co合金镀层制备过程中的电镀工艺参数(镀液pH值、镀液温度、电流密度以及添加剂浓度),通过中性盐雾试验(NSS)、扫描电子显微镜(SEM)和动电位极化曲线,系统研究了Zn-Co合金镀层的显微组织及耐蚀性能。结果表明:烧结钕铁硼电镀Zn-Co合金镀层的最佳电镀工艺参数为:添加剂浓度为15 mL/L,pH值为4,电镀温度为25℃,电流密度为1 A/dm~2。在最佳工艺条件下制备的Zn-Co合金镀层经钝化后其耐中性盐雾时间可达120 h。合金镀层结构致密,有效填补了钕铁硼磁体的固有缺陷,为后期钝化形成致密钝化膜提供了材料基底基础。钝化后的Zn-Co合金镀层表面平整光亮,动电位极化曲线测试表明,相比Zn镀层,钝化后的Zn-Co合金镀层的自腐蚀电流密度下降了一个数量级,表明Zn-Co合金镀层钝化后具有更加优异的耐腐蚀性能。     

电流密度对脉冲电镀Zn-Ni-Mn合金镀层的影响

通过脉冲电镀技术在Q235钢基体上制备出Zn-Ni-Mn合金镀层。研究了电流密度对镀层表面形貌、成分、沉积速率及耐蚀性的影响。结果表明,随着电流密度的增大,沉积速率先增大再减小;镀层中锰含量升高,锌、镍含量降低。随电流密度增加,该镀层随耐蚀性先增强后减弱。电流密度为3.0 A·dm~(-2)时,所得Zn-Ni-Mn合金镀层平整致密,耐蚀性最好。Zn-Ni-Mn合金镀层在3.5%NaCl溶液中的耐蚀性比在5.0%NaOH溶液中更好。     

CLAM钢表面室温离子液体电镀铝

采用AlCl_3-EMIC离子液体在室温下对国产低活性铁素体/马氏体钢(CLAM钢)表面进行镀铝处理。研究了镀前处理对镀层-基体界面的影响。采用SEM、EDS分析了不同电流密度对镀层表面形貌与界面形貌的影响,同时与脉冲电镀所得结果进行了比较。结果表明:在电化学前处理过程中,增大电流密度会增强镀层与基底结合力;电流脉冲的加入可以减弱溶液浓差极化现象,增加表面组织致密性;镀层晶粒大小随电流密度增大而减小,镀层球状组织随电流密度增大而增大。在优化的电镀工艺下(前处理电流密度控制在10 mA/cm~2以上,电镀电流密度控制在10~20 mA/cm~2,对应的电镀时间45~95 min,优选脉冲电流电镀),得到的铝镀层表面光滑,致密,结合力强,厚度可控。     

硬质合金Ni-Cu-P化学镀工艺及镀层组织性能研究

采用化学镀法在YT15硬质合金表面制备Ni-Cu-P三元合金镀层,研究不同施镀工艺参数对镀速及镀层组织性能的影响.通过称重法测定镀层沉积速率,采用划痕法定性分析镀层与基体之间的结合强度,并利用扫描电子显微镜(SEM)分析比较不同pH值镀层表面和截面的组织形貌及成分.结果表明:最佳工艺参数为硫酸铜浓度1.25 g/L,pH=11,镀覆温度90 ℃,镀速为0.61 s/m2·min,镀层均匀致密,主要成分为Ni和Cu,镀层与基体的结合紧密,与焊锡浸润性良好,可焊性较强.     

Characterisation and corrosion resistance of Zn–Mn coatings electrodeposited from acidic chloride bath

Zn–Mn alloy coatings were galvanostatically electrodeposited from an acidic chloride bath. Effects of deposition current density, pH and temperature on surface morphology, microstructure and corrosion resistance of Zn–Mn coatings were studied. The coatings deposited at 10, 50 and 100 mA cm^?2 had a single η-Zn phase structure. However, a dual phase structure of η-Zn and ?-Zn–Mn with higher Mn content was found for the coatings deposited at 200 mA cm^?2. The dual structure degraded the corrosion resistance of the coatings. The highest corrosion resistance was achieved for the Zn–Mn coating deposited at 100 mA cm^?2, pH 4·9 and 25°C. This coating contained 4·1 wt-%Mn and showed a unique surface morphology consisting of randomly arranged packs of very thin platelets, laid perpendicular to the surface and provided a high compactness deficient free structure.     

锌镍合金镀工艺优化及镀层耐腐蚀性的研究

目的研究锌镍合金镀层的耐腐蚀性能。方法通过正交试验法,对锌镍合金电镀工艺进行优化,获得镀液配方。通过中性盐雾试验评判优化后的锌镍合金镀层的耐腐蚀性能,并与镀锌层和镀镉层进行对比。分析主盐、络合剂、p H值、电流密度、温度等对镀层耐腐蚀性的影响。结果最优配方为:氧化锌6~14 g/L,硫酸镍20~30 g/L,氢氧化钠100~140 g/L,光亮剂4~6 g/L,络合剂50~70 g/L。该配方获得的锌镍合金镀层在中性盐雾实验中,出白锈的时间可以达到720 h以上。结论锌镍合金镀层的耐腐蚀性优良,优于镀锌层和镀镉层。     

Studies on the Electrodeposition of Ternary Copper-Zinc-Tin Alloys

The colour of Cu-Zn-Sn alloy coatings obtained by electrodeposition may differ-white, gold, dark gold, pink, and so on—depending on the specific combination of deposition conditions such as electrolyte composition, temperature, pH value and current density. Effects of pH and current density on the colour of the deposits and the associated electrode processes at the cathode and anode during deposition have been investigated. It was found that increasing either pH or current density causes an increase in the Zn content of the deposit and results in a colour trend away from pink and towards yellow. It was also found that cathodic deposition takes place in the sequence Sn, Cu, Zn, followed by Cu-Zn-Sn alloy. Anodic dissolution occurs at—1.0 V. From this study a reproducible gold-coloured coating was achieved, which could be of considerable practical importance.     

Electrodeposition and mechanical properties of Ni-W-B composites from tartrate bath

Electrodeposition of Ni-W-B alloys from plating baths containing tartrate in the absence of ammonia is studied. Detailed studies on the effects of bath temperature, pH, cathode current density and plating time have led to optimum operational conditions for obtaining satisfactory alloy deposits. The operational conditions for deposition the alloy with high hardness are; current density 30 mA cm^?2, pH 6.0 and bath temperature of 60°C. The results have shown that the adherence of Ni-W-B is better than the Ni and Chromium on Cu substrate. It adheres to Cu substrates better than electrodeposited Ni and chromium. The morphology of the deposits was studied by SEM and the analysis of composition performed by EDX and inductively coupled plasma (ICP). The as-deposited alloy contained 21.66 wt % W and the highest cathode current efficiency for deposition of the alloy was about 38%. The deposit obtained under these conditions had an amorphous character with a hardness of about 800 HV, which is comparable to the hardness of chromium, occurred at a heat treatment temperature of 400°C. When heat treated up to this temperature, the initial metastable structure decomposed into fine particles of Ni₄W in a nickel solid solution.     

Effect of initial deposition behavior on properties of electroless Ni–P coating on ZK60 and ME20 magnesium alloys

The composition of magnesium alloys is greatly associated with initial deposition behavior of electroless Ni–P coatings. Thus, the initial deposition behavior of electroless Ni–P coatings on ZK60 and ME20 alloys was investigated. The results indicated that differences in the alloy compositions significantly influenced the initial deposition process and the adhesive strength, corrosion resistance, and crystal structure. The initial deposition of coatings on ZK60 and ME20 alloys preferentially occurred on the precipitates. The precipitates in ZK60 alloy had higher chemical activity after HF activation and controlled the initial deposition rate of the coating. The initial deposition rate of the coating on ME20 alloy mainly depended on the density of the MgF₂ film formed by HF activation rather than on the precipitates. Owing to differences in the initial deposition process, the coating on ZK60 alloy had higher adhesive strength and better corrosion resistance than that on ME20 alloy. The coatings on ZK60 and ME20 alloys mainly had crystalline structures, and the coating on ME20 alloy had also a slight microcrystalline structure.     

电镀电流密度对铝锰合金镀层耐蚀性的影响

目的提高钢铁材料的耐腐蚀性能。方法采用添加了质量分数1.0%MnCl2作为锰源的Al Cl3-NaCl-KCl熔盐体系,在电流密度分别为13.3、26.7、48.0、50.0、55.6 m A/cm~2的条件下在Q235钢表面进行电镀,测试了该熔盐体系中电镀过程的循环伏安曲线。采用X射线衍射仪(XRD)、电子能谱仪(EDS)与扫描电子显微镜(SEM)对镀层表面与横剖面进行检测,并在1.0 mol/L NaCl溶液中,用电化学工作站对镀层进行了动电位极化曲线测试。结果电镀过程中Al与Mn存在共沉积现象,不同电镀电流密度条件下得到的Al-Mn合金镀层均为非晶态,镀层的剖面分析表明镀层均匀、界线清晰,成分为Al与Mn两种金属。电流密度较小时镀层平整光滑,达到48.0 m A/cm~2时,镀层中开始有胞状物质形成,且随电流密度的增大变得显著。平衡电位、线性极化电阻与腐蚀电流密度均随电镀电流密度先增大后减小,并且在电流密度为48.0m A/cm~2时达到最小腐蚀电流密度与最大线性极化电阻。结论 Al-Mn合金镀层为非晶态,电镀电流密度为48.0 m A/cm~2得到的镀层在1.0 mol/L NaCl溶液中具有较好的耐腐蚀性。     

Initial corrosion protection of Zn–Mn alloys electrodeposited from alkaline solution

The effects of a deposition current density (c.d.) on the corrosion behaviour of Zn–Mn alloy coatings, deposited from alkaline pyrophosphate solution, were investigated by atomic absorption spectrophotometry (AAS), X-ray diffraction (XRD), atomic force microscopy (AFM), optical microscopy, electrochemical impedance spectroscopy (EIS) and measurement of corrosion potential (E_corr). XRD analysis disclosed that zinc hydroxide chloride was the main corrosion product on Zn–Mn coatings immersed in 0.5 mol dm⁻³ NaCl solution. EIS investigations revealed that less porous protective layer was produced on the alloy coating deposited at c.d. of 30 mA cm⁻² as compared to that deposited at 80 mA cm⁻².     

工艺参数对连续碳纤维表面电磁搅拌化学镀镍的影响

目的解决连续碳纤维在镀覆过程中易出现黑心现象以及无法完全浸泡于镀液中的问题,制备镀层均匀的连续碳纤维镍镀层。方法引入外加电磁搅拌对连续碳纤维进行化学镀镍,研究了施镀时间、镀液温度、镀液pH值以及电磁搅拌转速对连续碳纤维表面微观形貌及镀层沉积速率的影响规律。结果当搅拌转速一定时,随着施镀时间、镀液温度、镀液pH值的不断增加,碳纤维表面镀层逐渐变得均匀完整,且镀层厚度逐渐增大。但当施镀时间超过20 min,镀液温度超过75℃,镀液pH值超过8时,镀层表面沉积了大量形状不一的胞状镍颗粒,形成粗糙的表面形貌。镀层的沉积速率随着镀液温度、镀液pH值的升高而增大。当搅拌转速由200 r/min增加到300 r/min时,镀层的沉积速率随着搅拌转速的增加而不断增大;当搅拌转速由300 r/min增加到400 r/min时,镀层的沉积速率随着搅拌转速的增加而不断减小。结论电磁搅拌辅助连续碳纤维化学镀镍的最佳施镀工艺参数为:施镀时间15~20 min,镀液温度75℃,镀液pH为8,搅拌转速200~250 r/min。采用此工艺参数能获得表面致密、均匀完整的镍镀层。     

快速化学镀 Ni-Zn-P 合金工艺及镀层性能

目的确定快速化学镀Ni-Zn-P合金的工艺。方法通过一系列实验,研究主盐含量、pH值、温度、时间等对镀层沉积速度及镀层锌镍比的影响,确定最优工艺条件。借助SEM,EDS,XRD及电化学方法分析镀层微观形貌、成分及耐蚀性。结果在ZnSO4·7H2O8 g/L,NiSO4·6H2O 35 g/L,NaH2PO2·H2O20 g/L,NH4Cl 50 g/L,C6H5Na3O7·2H2O 70 g/L,稳定剂1.5 mg/L,p H=9.0,温度90~95℃的条件下,化学镀Ni-Zn-P合金沉积速度为5~6μm/h,镀层中Zn质量分数为8%~10%,P质量分数为6%左右,Ni质量分数为80%~85%。Zn的存在使Ni呈现出晶态结构,在XRD谱图上2θ=45°及2θ=52°位置分别出现了Ni(111),Ni(200)衍射峰。施镀时间不会影响镀层成分,但会影响镀层耐蚀性。施镀1.5 h时,镀层厚度约为9~10μm,其耐蚀性略好于相同厚度的Ni-P镀层。结论 Ni-Zn-P化学镀沉积速度较快,8%~10%的Zn使镀层中Ni呈晶态结构,且改善了镀层耐蚀性。