高电子迁移率GaAs／Al_xGa_（1－x）As二维电子气（2DEG）异质结结构参数优化研究

本文采用三角附近似，考虑了ＧａＡｓ／ＡｌｘＧａ（１－）ｘＡｓ二维电子气（２ＤＥＧ）异质结中七种主要的散射机制，计算了２ＤＥＧ电子迁移率与隔离层厚度（ｄ）和Ａｌ组分（ｘ）的关系，对ＧａＡｓ／ＡｌｘＧａ（１－ｘ）ＡＳ异质结的结构参数进行了优化分析．就作者所知，本文首次计算了２ＤＥＧ电子迁移率与Ａｌ组分ｘ的关系，得到了与实验规律一致的结果．     

Al_xGa_（1－x）As／GaAs价带偏移的理论计算

ＡｌｘＧａ１－ｘＡｓ／ＧａＡｓ合金型异质结价带偏移的研究中，采用以平均键能为参考能级的ΔＥｖ理论计算方法，得到ΔＥｖ（ｘ）＝０．５３１ｘ＋０．００１ｘ２的理论计算结果．该计算结果与目前的一些实验结果符合较好．     

高电子迁移率GaAs／AlxGa1—xAs二维电子气（2DEG）异质结结构参数优…

本文采用三角阱近似，考虑了ＧａＡｓ／ＡｌｘＧａ１－ｘＡｓ二维电子气（２ＤＥＧ）异质结中七种主要的散射机制，计算了２ＤＥＧ电子迁移主经与隔离层厚度（ｄ）和Ａｌ组分（ｘ）的关系，对ＧａＡｓ／ＡｌｘＧａ１－ｘＡｓ异质结的结构参数进行了优化分析。就作者所知，本文首次计算了２ＤＥＧ电子迁移率与Ａｌ组分ｘ的关系，得到了与实验规律一致的结果。     

Two-Dimensional Quantum Well Wire Semiconductor Laser Arrays

ＡｌｘＧａ１－ｘＡｓ／ＧａＡｓ合金型异质结价带偏移的研究中，采用以平均键能为参考能级的ΔＥｖ理论计算方法，得到ΔＥｖ（ｘ）＝０．５３１ｘ＋０．００１ｘ２的理论计算结果．该计算结果与目前的一些实验结果符合较好．     

GaAs－Al_xGa_（1－x）As异质结构界面光激光发过剩电子的热辅助隧穿俘获

在７１—１６３Ｋ的不同稳定温度下，对ＧａＡｓ－Ａｌ０．３Ｇａ０．７Ａｓ调制掺杂异质结构界面的光激发过剩电子的浓度，作了１０－５－１０３秒时间范围的瞬变测量．一个包含了热声子辅助隧穿，Ｓｉ掺杂的ＡｌｘＧａ１－ｘＡｓ层ＤＸ中心俘获势垒分布和隧穿后电子的能量弛豫过程的理论计算可以定量地解释实验结果．     

AlxGa1—xAs／GaAs价带偏移的理论计算

ＡｌｘＧａ１－ｘＡｓ／ＧａＡｓ合金型异质结价带偏移的研究中，采用以平均键能为参考能级的ΔＥＶ理论计算方法，得到ΔＥｖ（ｘ）＝０．５３１ｘ＋０．００１ｘ＾２的理论计算结果。该计算结果与目前的一些实验结果符合较好。     

GaAs／AlxGa1—xAs和AlxGa1—xAs／AlAs超晶格的喇曼散射对比研究

报道不同层厚的ＡｌＡｓ／ＡｌｘＧａ１－ｘＡｓ及ＧａＡｓ／ＡｌｘＧａ１－ｘＡｓ短周期超晶格的纵光学声子模的室温喇曼散射测量结果．在非共振条件下,观察到ＡｌＡｓ／ＡｌｘＧａ１－ｘＡｓ中限制在ＡｌｘＧａ１－ｘＡｓ混晶层中的类ＧａＡｓＬＯ限制模和限制在ＡｌＡｓ层中的ＡｌＡｓＬＯ限制模,还观察到ＧａＡｓ／ＡｌｘＧａ１－ｘＡｓ中限制在ＡｌｘＧａ１－ｘＡｓ混晶层中的类ＡｌＡｓＬＯ限制模和限制在ＧａＡｓ层中的ＧａＡｓＬＯ限制模．在近共振条件下,还观察到了ＡｌＡｓ／ＡｌｘＧａ１－ｘＡｓ中ＡｌＡｓ的界面模．根据线性链模型,把测量的ＬＯ限制模的频率按照ｑ＝ｍｎ＋１２πα０展开,给出了ＡｌｘＧａ１－ｘＡｓ混晶的类ＡｌＡｓ支和类ＧａＡｓ支光学声子色散曲线．     

AlxGa1—xAsl和GaAs材料的物理参数模型

本文较系统和全面地总结了ＧａＡｓ和ＡｌｘＧａ１－ｘＡｓ材料的物理参数模型，包括介电常数、能带参数、载流子迁移率以及复合机制和寿命等，给出了易于应用的数学公式，其中ＡｌｘＧａ１－ｘＡｓ重掺杂能带窄变公式为本文首次推导。这些物理参数模型对于ＡｌｘＧａ１－ｘＡｓ／ＧａＡｓ异质结器件的研究有着十分重要的意义。     

1－MeV电子辐照对Al_xGa_（1－x）As／GaAs异质面太阳电池性能的影响

对ＡｌｘＧａｌ－ｘＡｓ／ＧａＡｓ异质面太阳电池经ｌ－ＭｅＶ电子辐照前后的性能变化进行实验研究和数值拟合分析．讨论了电池性能衰退的主要原因，并提出了如何提高ＡｌｘＧａ１－ｘＡｓ／ＧａＡｓ异质面太阳电池的抗电子辐照能力的方法．     

InGaAs／GaAs应变层量子阱激光器深中心行为

应用深能级瞬态谱（ＤＬＴＳ）技术研究分子束外延（ＭＢＥ）和二次液相外延（ＬＰＥ）生长的ＩｎＧａＡｓ／ＧａＡｓ应变层量子季阱激光器深中心行为．在ＭＢＥ激光器的ｎ－ＡｌｘＧａ１－ｘＡｓ组分缓变层和限制层里，除众所周知的ＤＸ中心外，还观察到有较大俘获截面的深（空穴、电子）陷阱及其相互转化．这些陷阱可能分布在ｘ从０到０．４０和ｘ—０．４０的ｎ－ＡｌｘＧａ１－ｘＡｓ层里ｘ值不连续的界面附近．而在ＬＰＥ激光器的ｎ－ＡｌｘＧａ１－ｘＡｓ组分缓变层和限制层里，ＤＸ中心浓度明显减少，且深（空穴、电子）陷阱消失     

Influence of the cap layer thickness on photoluminescence properties in strained InGaAs/GaAs single quantum wells

The influence of the GaAs cap layer thickness on the luminescence properties in strained In_0.20Ga_0.80As/GaAs single quantum well (SQW) structures has been investigated using temperature-dependent photoluminescence (PL) spectroscopy. The luminescence peak is shifted to lower energy as the GaAs cap layer thickness decreases, which demonstrates the effect of the GaAs cap layer thickness on the strain of InGaAs/GaAs single quantum wells (SQW). We find the PL quenching mechanism is the thermal activation of electron hole pairs from the wells into the GaAs cap layer for the samples with thicker GaAs cap layer, while in sample with thinner GaAs cap layer exciton trapping on misfit dislocations is dominated.     

Physical Understanding of Gate-Depletion Phenomena in Poly-Si/HfSiON Stacks Based on C–V Differentiation Analysis

We propose sub-1-A-resolution analysis of gate surface layer In scaled-T_inv (capacitance equivalent thickness at substrate inversion) gate stacks by differentiating their C-V curves. By introducing the universal derivative-of-capacitance curve, gate stacks with different equivalent oxide thickness of gate insulator and substrate-impurity concentration JVSub can be analyzed in one and the same plot. By applying this analysis technique to p+ poly-Si/HfSiON stack, it is found that gate depletion increases due to both lower poly impurity concentration N_poly and high pinning charge density N_ox inside the dielectric. Ultrathin SiN cap insertion onto HfSiON recovers the degradation in N_poly and N_ox leading to suppression of gate depletion and flatband voltage shift.     

Process parameter dependence of impurity-free interdiffusion in GaAs/AlxGa1−xAs and InxGa1−yAs/GaAs multiple quantum wells

The dependence of the impurity-free interdiffusion process on the properties of the dielectric cap layer has been studied, for both unstrained GaAs/Al_xGa_1−xAs and pseudomorphic In_y Ga_1−yAs/GaAs MQW structures grown by molecular beam epitaxy. The influence of the cap layer thickness, composition, and deposition technique on the degree of interdiffusion were all systematically investigated. Electron-beam evaporated SiO₂ films of varying thickness, chemical-vapor-deposited SiO_xN_y films of varying composition, and spin-on SiO₂ films were used as cap layers during rapid thermal annealing (850-950°C). Photoluminescence at 10K has been employed to determine the interdiffusioninduced bandgap shifts and to calculate the corresponding Al-Ga and In-Ga interdiffusion coefficients. The latter were found to increase with the cap layer thickness (e-beam SiO₂) up to a limit determined by saturation of the outdiffused Ga concentration in the SiO₂ caps. A maximum concentration of [Ga] = 4–7 ×10¹⁹ cm⁻³ in the SiO₂ caps was determined using secondary ion mass spectroscopy profiling. Larger band-edge shifts are also obtained when the oxygen content of SiO_xN_y cap layers is increased, although the differences are not sufficiently large for a laterally selective interdiffusion process based on variations in cap layer composition alone. Much larger differences are obtained by using different deposition techniques for the cap layers, indicating that the porosity of the cap layer is a much more important parameter than the film composition for the realization of a laterally selective interdiffusion process. For the calculated In_0.2Ga_0.8As/GaAs interdiffusion coefficients, activation energies E_A and prefactors D_o were estimated to ranging from 3.04 to 4.74 eV and 5 × Kh⁻³ to 2 × 10⁵ cm²/s, respectively, dependent on the cap layer deposition technique and the depth of the MQW from the sample surface.     

LP-MOCVD grown (lnAs)m(GaAs)m short period superlattices on InP

(InAs)_m(GaAs)_m (1 ≤ m ≤ 12) short period superlattices (SPSs) have been grown on semi-insulated InP substrates with a 200 nm InP cap layer using low pressure metalorganic chemical vapor deposition (MOCVD). According to double crystal x-ray diffraction and transmission electron microscopy results, the critical layer thickness of (InAs)_m(GaAs)_m SPS was observed to be ～30Å (m = 5). For the SPS below the critical layer thickness, mirror-like surface morphology was found without defects, and strong intensity Fourier transformed photoluminescence (FT-PL) spectra were also obtained at room temperature. The SPS with m = 4 showed a drastic improvement in photoluminescence intensity of order of two compared to an InGaAs ternary layer. However, the SPS with a large value of m (m ≥ 6), rough surface was observed with defects, with broad and weak FT-PL spectra. The surface morphology of SPS was greatly affected by the substrate orientation. The SPS with m = 5 was grown on two degree tilted substrate from (100) direction and showed poor surface morphology as compared to the one grown on (100) exact substrate Moreover, the SPS grown on a (111)B substrate showed a rough triangular pattern with Nomarski optical microscopy. In-situ thermal annealed SPS with m = 4 showed a 18 meV increase in PL peak energy compared to the as-grown sample due to phase separation resulting from thermal interdiffusion.     

p型4H-SiC同质外延有效层厚度

通过化学气相沉积法,采用不同生长工艺在4°偏角4H-SiC衬底上制备p型4H-SiC同质外延片。提出了p型4H-SiC同质外延中有效层厚度的概念,研究发现导致外延有效层厚度减少的直接原因是自掺杂效应的存在。采用傅里叶红外光谱仪(FT-IR)、汞探针电容电压(Hg-CV)和表面缺陷测试仪对p型4H-SiC同质外延片进行表征,讨论了不同工艺对外延有效层厚度的影响。结果表明,采用隔离法和阻挡层法均能提高外延有效层厚度,且掺杂浓度随距表面深度变化斜率值由1.323减小到0.073。然而,阻挡层法斜率值能进一步优化至0.050,是由于有效抑制了外延中固相和气相自掺杂。对比于优化前工艺,采用阻挡层法制备的p型4H-SiC同质外延片厚度不均匀性和表面总缺陷数量处于同一水平,掺杂浓度不均匀性由2.95%改善到2.67%。综上,采用阻挡层法能够制备出高有效层厚度、高一致性和高质量的p型4H-SiC同质外延片。     

蓝宝石图形衬底上GaN低温缓冲层的研究

低温下,在蓝宝石图形衬底上使用金属有机化学气相沉积(MOCVD)生长低温GaN(LT-GaN)缓冲层,并对其表面形貌进行了细致的观察,发现了不同于已报道的GaN选择性成核生长现象。基于不同厚度的低温GaN缓冲层生长了n型GaN(n-GaN),发现过厚或者过薄的缓冲层都会对n-GaN晶体质量产生负面影响,并结合初始成核阶段进行了原因分析。制备了基于不同厚度的n-GaN的发光二极管(LED)样品,分析了GaN晶体质量对LED输出功率的影响。同时发现,晶体质量较差的时候,光提取效率可能主导着对LED器件性能的影响。     

An X-ray diffraction and electron-microscopic study of the influence of gamma radiation on multilayer AlGaAs/InGaAs/GaAs heterostructures

The influence of gamma radiation on multilayer AlGaAs/InGaAs/GaAs transistor heterostructures has been studied by means of X-ray diffraction analysis and transmission electron microscopy. It was found that irradiation with doses exceeding ～3 × 10⁷ rad leads to destruction of the GaAs layer on the surface of these structures. An irradiation dose of 10⁸ rad significantly deteriorates the surface planarity, with the surface roughness reaching values of several nanometers. In addition, dislocations are formed in the cap layer of the structure. Such a behavior of the cap layer may be due to the existence of an oxide layer on its free surface and to the possible chemical reactions, induced by gamma radiation, between atoms of the cap layer and free radicals formed in the oxide and in the ambient atmosphere. No noticeable changes in the structure and composition of the thin InGaAs channel layer occur at doses lower than 10⁸ rad.     

Nitride-based LEDs with 800/spl deg/C grown p-AlInGaN-GaN double-cap layers

GaN-based light-emitting diodes (LEDs) with various p-cap layers were prepared. It was found that surface morphologies of the LEDs with 800/spl deg/C grown cap layers were rough due to the low lateral growth rate of GaN. It was also found that 20-mA forward voltage of the LED with 800/spl deg/C grown p-AlInGaN-GaN double-cap layer was only 3.05 V. Furthermore, it was found that we could achieve a high output power and a long lifetime by using the 800/spl deg/C grown p-AlInGaN-GaN double-cap layer.     

InGaN–GaN MQW Metal–Semiconductor–Metal Photodiodes With Semi-Insulating Mg-Doped GaN Cap Layers

InGaN-GaN multiple-quantum-well metal-semiconductor-metal photodiodes (PDs) with in situ grown 40-nm-thick unactivated semi-insulating Mg-doped GaN cap layer were successfully fabricated. The dark leakage current of this PD was comparably much smaller than that of conventional PD without the semi-insulating layer, because of a thicker and higher potential barrier of semi-insulating cap layer, and also a smaller number of surface states involved. For the PDs with the semi-insulating Mg-doped GaN cap layers, the responsivity at 380nm was 0.372A/W when biasing at 5 V. In short, incorporating a semi-insulating Mg-doped GaN cap layer into the PDs beneficially leads to the suppression of dark current and a corresponding improvement in the ultraviolet-to-visible rejection ratio     

硅锗合金氧化后生成的锗纳米结构的特性研究

我们将SiGe合金在干氧吹气环境下以不同的温度和不同的时值进行氧化处理，用卢摄福散射仪RBS和高精度椭偏仪HP-ESM测量样品，获得10～80nm厚的硅氧化层和1nm厚的富锗层．新发现快速氧化生成的氧化膜表面有1～2nm厚的锗层．分析了锗纳米结构对应的PL发光谱，注意到锗纳米层对应的541nm波长的尖锐的发光峰和不同尺寸的锗原子团对应的从550～720nm波长的发光带．从量子受限模型和局域密度泛函计算出发。合理地解释了实验的结果．