用表面粗化ITO的欧姆接触提高GaN基LED性能

应用ICP干法刻蚀工艺和自然光刻技术,制备了ITO表面粗化的GaN基LED芯片。聚苯乙烯纳米颗粒在干法刻蚀中作为刻蚀掩膜。通过扫描电镜(SEM)观察ITO薄膜的粗糙度,并且报道了优化的粗化工艺参数。结果表明,ITO表面粗化的GaN基LED芯片同传统的表面光滑的芯片相比在20 mA的驱动电流下,发光强度提高了70%。     

ZnO∶Al替代ITO作透明导电膜的应用

研究了AZO(ZnO∶Al)替代ITO透明导电膜在GaN基LED中的应用,通过脉冲激光沉积和磁控溅射法制作了AZO薄膜,分析了AZO与p型GaN不良的欧姆接触的物理机理,并利用插入ITO薄层来改善接触电阻,实验用ITO 20nm/AZO 500nm的复合导电薄膜做透明导电薄膜,成功得到了波长为525.74nm、亮度为380.88mcd、电压为3.35V的GaN基绿光LED芯片,相当于单一ITO透明导电膜的性能,整个试验工艺中减少了ITO的使用量,降低了LED芯片的制造成本。     

远程荧光LED球泡灯热仿真分析

采用FloEFD流体分析软件分析了改变LED散热器翅片数和基板厚度对LED球泡灯热量的影响。首先对LED芯片进行仿真,然后用蓝宝石替换LED芯片其他部分简化后仿真,将两者进行了对比。接着对远程荧光LED集成封装光源进行了热模拟,发现将大功率芯片集成在铝基板上,工作时产生的热量非常大,模拟时芯片的结温在159.9℃,超过了LED正常工作结温,所以仅仅依靠铝基板难以达到散热要求。最后对LED球泡灯散热器不同翅片数和不同基板厚度分别进行了热仿真,得出当翅片数为16,基板厚度为2mm时,LED球泡灯的整体散热良好,模拟结果显示LED芯片的温度只有83.8℃,完全满足散热要求。     

基于高反射率DBR薄膜的倒装LED电极结构优化设计

为提升LED芯片的光提取效率和电流扩展能力,设计了双金属层环形叉指结构ITO/DBR电极的大功率倒装LED芯片,并对分布式布拉格反射镜(DBR)薄膜和环形叉指电极结构进行了仿真优化计算。利用TFcalc软件仿真计算了DBR堆栈方式、堆栈周期和参考波长对DBR反射率的影响。仿真结果表明,优化设计的双堆栈DBR薄膜在234nm宽波长范围内反射率均高于95%,对应蓝黄光区域(440~610nm)平均反射率高达98.95%,参考波长红移可以缓解DBR反射偏振效应。利用SimuLED软件仿真计算了电极结构对芯片电流扩展能力的影响。仿真结果表明,350mA电流输入情况下,单金属层电极电流密度均方差为44.36A/cm²,而双金属层环形叉指数目为3×3时,电流密度均方差降至14.37A/cm²。双金属层环形叉指电极降低了p、n电极间距,减小了电流流动路径,芯片电流扩展性能明显提升。     

ITO掩膜干法粗化GaP提高红光LED的提取效率

采用氧化铟锡(ITO)颗粒掩膜,经感应耦合等离子体(ICP)刻蚀后制作了表面粗化的红光发光二极管(LED),并且研究了ITO腐蚀时间对粗化表面形貌的影响。测试结果表明,当粗化颗粒的大小为200～500 nm、腐蚀深度约200～400 nm时,能使制作的表面粗化红光LED在20 mA注入电流下光提取效率提高30%以上。并且,表面粗化不会影响LED的发光强度角度分布。     

发光二极管芯片快速检测方法的研究

介绍了一种新的发光三极管(LED)芯片的检测方法及应用.该方法利用自行研制的掩埋双pn结(BDJ)光波长探测器同时测量LED芯片的有效波长及辐射强度,具有简单、快捷、动态范围宽、探测器体积小和便于系统集成的优点,在半导体照明最感兴趣的398～780 nm波长范围内,波长测量的重复精度及分辨率优于1 nm.据此方法,对红、绿、蓝、紫四种LED芯片发光的波长及辐射强度进行了实际测量,对红绿蓝三基色发光二极管合成白光的偏色进行了检测,并与光纤光谱仪测量得到的结果进行了比较.     

长寿命紫外发光二极管

加拿大Bivar公司最近研制成功了一种大功率紫外发光二极管 (LED)。该LED以多芯片和组合阵列器件构成。LED每块芯片的标准辐射通量为 1 2mW ,标准稳定波长为 40 0nm。整个器件封装在全金属和玻璃TO 92壳体内。在工作电流为 30mA条件下 ,这种LED可连续工作 2 00 0 0多小时。 (No .2 3)长寿命紫外发光二极管     

GaN基功率LED高低温特性研究

首次对自制的GaN基大功率白光和蓝光发光二极管在-30~100°C的温度下进行了在线的光电特性测试,对两种不同LED的正向电压、相对光强、波长、色温等参数随温度变化的关系进行了数据曲线拟合,对比分析了参数变化的原因,以及这些变化对实际应用的影响。结果表明,温度对大功率LED的光电特性有很大影响,通过对比发现白光LED的部分光参数随温度的变化不仅与GaN芯片有关,同时受到荧光粉的影响。低温环境下,要考虑LED的正向电压升高和峰值波长蓝移对应用的影响;而高温条件下要考虑光功率降低和峰值波长红移对应用的影响。     

集成阵列叉指电极介电泳芯片粒子分离北大核心

制备了用于粒子分离的集成阵列叉指电极介电泳微流控芯片,该芯片由以玻璃为基底的氧化铟锡(ITO)电极以及聚二甲基硅氧烷(PDMS)微流通道构成。采用该芯片测定了聚苯乙烯微球在电导率为1μS/cm的悬浮溶液中在不同频率下的介电泳响应。聚苯乙烯微球产生正负介电泳响应的临界频率为20 kHz。当交流电压和频率分别为8Vp-p(峰峰值)和2 MHz时获得最优的粒子分离条件,在此条件下对聚苯乙烯微球和酵母菌细胞进行分离实验。实验结果表明,酵母菌细胞受到正介电泳力的作用,被富集到电极的边缘,而聚苯乙烯微球受到负介电泳力的作用被排斥而远离电极,其分离效率能够达到90%。     

垂直沉积法制备高质量胶体光子晶体

利用乳液聚合方法制备了粒径约为262 nm的单分散聚苯乙烯(PS)微球。通过控制溶剂蒸发温度和液体表面下降的速度,用垂直沉积法较快速地制备出了在较大范围呈现很好有序性的密排结构聚苯乙烯胶体光子晶体,其在626 nm波长处存在光子带隙。在扫描电子显微镜(SEM)下,观察到该胶体光子晶体是面心立方(fcc)密排结构。实验结果表明,对于粒径为262 nm的聚苯乙烯微球,在温度为55℃,质量分数为0.3%的情况下,当液体表面下降的速度约为每天3 mm时,可以得到高质量的胶体光子晶体。这种高质量的胶体光子晶体可以为利用模板技术制备具有完全带隙的有序孔结构提供较理想的模板。     

Properties of the ITO layer in a novel red light-emitting diode

An optically transparent electrode, indium tin oxide (ITO) film is fabricated by vacuum E-beam evaporation. The thermal annealing effects on the ITO/GaP contact have been investigated by means of the transmission line model method. Under 435℃, with rapid thermal annealing for 40 s in N2 ambient, the ITO contact resistance reaches the minimized value of 4.3 × 10-3 Ω·cm2 . The results from Hall testing and Auger spectra analysis indicate that the main reasons for the change of the contact resistance are the difference in the concentration of carriers and the diffusion of In, Ga, O. Furthermore, the reliability of AlGaInP LEDs with a 300-nm thickness transparent conducting ITO film is studied. The increase of LED chip voltage results from the degradation of ITO film. Moreover the difference between the thermal expansion coefficient of GaP and ITO results in the invalidation of the LED chip.     

关于LED单灯正向电压VF不良的探讨

文章基于LED芯片和LED单灯的工作原理和制程工艺,探讨了LED芯片封装以后正向电压K升高和降低的常见原因,并提出了改善措施。对于GaN基双电极芯片,由于芯片工艺制程或后续封装工艺因素,造成芯片表面镀层（ITO或Ni／Au）与P—GaN外延层之间的结合被破坏,欧姆接触电阻变大。对于GaAS基单电极芯片,由于封装材料和工艺因素,导致芯片背金（N—electrode）与银胶,或银胶与支架之间的接触电阻变大,从而LED正向电压VF升高。LED正向电压VF降低最常见的原因为芯片PN结被ESD或外界大电流损伤或软击穿,反向漏电过大,失去了二极管固有的I-V特性。     

Highly Reliable High-Brightness GaN-Based Flip Chip LEDs

The properties of indium-tin-oxide (ITO)/Ni films as transparent ohmic contacts of nitride-based flip chip (FC) light emitting diodes (LEDs) were studied. It was found that 300degC rapid thermal annealed (RTA) ITO(15 nm)/Ni(1 nm) could provide good electrical and optical properties for FC LED applications. It was also found that 20-mA operation voltage and output power of the 465-nm FC LEDs with ITO/Ni/Ag reflective mirror were 3.16 V and 21 mW, respectively. Furthermore, it was found that output intensity of the proposed LED only decayed by 5% after 1200 h under 30-mA current injection at room temperature.     

具有ODR结构的高压倒装氮化镓基发光二极管

通过在传统ITO+DBR膜系结构基础上令电极金属与DBR层形成ODR(全角反射镜)膜系结构的方法,设计并制备了具有ODR结构的高压倒装氮化镓基发光二极管,有效提高了LED芯片的光效。ODR结构由DBR(分布布拉格反射镜)层上联接芯粒的电极金属和DBR层组成,经过理论分析和计算,与传统ITO+DBR结构器件相比,在400～550nm波长范围、全角度入射时平均反射率Rave从86.25%提升到了96.71%。实验制备了传统ITO+DBR结构和ODR结构的3颗芯粒串联的高压倒装氮化镓基LED器件,尺寸为0.2mm×0.66mm,ODR结构器件的有效反射结构面积增加了4.8%,饱和电流增加了12mA,用3030支架封装后在30mA的测试电流下,电压降低了0.163V,辐射功率提升了3.78%,在显色指数均为71时光效提升了5.42%。     

High Light-Extraction GaN-Based Vertical LEDs With Double Diffuse Surfaces

High light-extraction (external quantum efficiency ~40%) 465-nm GaN-based vertical light-emitting diodes (LEDs) employing double diffuse surfaces were fabricated. This novel LED structure includes one top transmitted diffuse surface and another diffuse omnidirectional reflector (ODR) on the bottom of a LED chip. The diffusive ODR consists of a roughened p-type GaN layer, an indium-tin-oxide (ITO) low refractive index layer, and an Al layer. The surface of the p-type GaN-layer was naturally roughened while decreasing the growth temperature to 800 degC. After flip-bonding onto a Si substrate by AuSn eutectic metal and laser lift-off processes to remove the sapphire substrate, an anisotropic etching by dilute potassium hydroxide (KOH) was employed on the N-face n-GaN layer to obtain transmitted diffuse surfaces with hexagonal-cone morphology. The double diffused surfaces LEDs show an enhancement of 56% and 236% in light output power compared to single side diffused surface and conventional LEDs, respectively. The devices also show a low leakage current in the order of magnitude of 10 ^-8 A at -5 V and a calculated external quantum efficiency of about 40%. The high scattering efficiency of double diffused surfaces could be responsible for the enhancement in the device light output power     

Reliability of AlGaInP light emitting diodes with an ITO current spreading layer

Three aging experiments were performed for AlGalnP light emitting diodes (LED) with or without indium tin oxide (ITO), which is used as a current spreading layer. It was found that the voltage of the LED with an ITO film increased at a high current stressing, while there was little change for that of the LED without the ITO. The results of the LEDs with different thicknesses of the ITO film show that the LED with a thicker ITO has a higher reliability. The main reason for the voltage increase of the LED with the ITO film might be the current crowding in the ITO film around the P-type electrode.     

ITO作为电流扩展层的AlGaInP 发光二极管可靠性研究

Three aging experiments were performed for AlGaInP light emitting diodes（LED） with or without indium tin oxide（ITO）,which is used as a current spreading layer.It was found that the voltage of the LED with an ITO film increased at a high current stressing,while there was little change for that of the LED without the ITO.The results of the LEDs with different thicknesses of the ITO film show that the LED with a thicker ITO has a higher reliability.The main reason for the voltage increase of the LED with the ITO film might be the current crowding in the ITO film around the P-type electrode.     

Improvement of InGaN-GaN light-emitting diodes with surface-textured indium-tin-oxide transparent ohmic contacts

Presents a surface-textured indium-tin-oxide (ITO) transparent ohmic contact layer on p-GaN to increase the optical output of nitride-based light-emitting diodes (LED) without destroying the p-GaN. The surface-textured ITO layer was prepared by lithography and dry etching, and dimensions of the regular pattern were approximately 3 /spl times/ 3 /spl mu/m. The operating voltage of the surface-textured LED was almost the same as that of the typical planar LED since the ITO layer was in ohmic contact with the p-GaN. The experimental results indicate that the surface-textured ITO layer is suitable for fabricating high-brightness GaN-based light emitting devices.     

GaP表面粗化对AlGaInP发光二极管光电特性的影响

采用湿法溶液粗化AlGaInP基红光LED表面GaP层 ,并在粗化后的GaP表面沉积ITO,研究了粗化时间对GaP表面形貌的影响,并利用SEM、半导 体 芯片测试机、X射线衍射仪、X射线光电子能谱对LED器件表面形貌、光电特性曲 线、界面晶向、元素特性进行表征,比较了粗化前后的LED亮度和光电特性变 化。测试结果表明:采用HIO₄、I₂、HNO₃系列粗化液在室温、粗化时间为30 S 时,有效增加了光在通过GaP面与ITO界面时的出光角度,使AlGaInP发光二极管 的发光效率提高21.4%,同时引起界面处的缺陷密度升高,费米能级 远离价带,主波长蓝移0.36 nm,正向电压上升0.04 V。