CdTe/Si复合衬底Ex-situ退火研究

复合衬底CdTe/ZnTe/Si的晶体质量是导致随后外延的HgCdTe外延膜高位错密度的主要原因之一,因此如何提高复合衬底CdTe/Si晶体质量是确保硅基碲镉汞走上工程化的关键所在。降低复合衬底CdTe/Si位错密度方法一般有:生长超晶格缓冲层、衬底偏向、In-situ退火和Ex-situ退火等,本文主要研究Ex-situ退火对复合衬底CdTe/Si晶体质量的影响。研究表明复合衬底经过Ex-situ退火后位错密度最好值达4.2×105cm-2,双晶半峰宽最好值达60arcsec。     

低温缓冲层对MBE生长ZnTe材料性能的改善

研究了低温缓冲层对在GaAs(001)衬底上用分子束外延(MBE)生长ZnTe薄膜晶体质量的影响。发现插入低温缓冲层后ZnTe的结晶质量、表面形貌和发光质量都得到了显著的提高,双晶X射线摇摆曲线(DCXRC)的ZnTe(004)衍射峰半峰宽(FWHM)从529 arcsec减小到421 arcsec,表面均方根(RMS)粗糙度从6.05 nm下降到3.93 nm。而作为对比,插入高温缓冲层并不能对ZnTe薄膜的质量起到改善作用。基本上实现了优化工艺的目标并为研制ZnTe基光电器件微结构材料奠定了很好的实验基础。     

基于正交设计的Si基复合衬底优化工艺试验

在正交设计的基础上,通过一系列工艺测试实验,研究了MEE外延温度、MEE退火温度、CdTe外延温度、CdTe退火温度对Si基复合衬底的两个关键质量因素FWHM和表面粗糙度的影响。通过统计技术对测得的实验数据进行了方差分析,结果表明,CdTe退火温度是影响FWHM的关键因子,MEE退火温度和CdTe外延温度对Ra值来说影响是显著的。通过该系列实验得到最优的外延工艺条件。     

Si基CdTe复合衬底分子束外延研究

文章引入晶格过渡的Si/ZnTe /CdTe作为复合外延基底材料,以阻挡Si/HgCdTe之间大晶格失配产生的高密度位错。通过对低温表面清洁化、面极性控制和孪晶抑制等的研究,解决了Si基CdTe分子束外延生长中诸多的技术难题。在国内首次采用分子束外延(MBE)的方法获得了大面积的Si基CdTe复合衬底材料,对应厚度为4～4. 4μm Si/CdTe (211)样品双晶半峰宽的统计平均结果为83弧秒,与相同厚度的GaAs/CdTe (211)双晶平均水平相当。     

分子束外延CdTe（211）B／Si复合衬底材料

报道了用MBE的方法，在3英寸Si衬底上制备ZnTe／CdTe（211）B复合衬底材料的初步研究结果，该研究结果将能够直接应用于大面积Si基HgCdTe IRFPA材料的生长．经过Si（211）衬底低温表面处理、ZnTe低温成核、高温退火、高温ZnTe、CdTe层的生长研究，用MBE方法成功地获得了3英寸Si基ZnTe／CdTe（211）B复合衬底材料．CdTe厚度大于10μm，XRD FWHM平均值为120arc sec，最好达到100arc sec，无（133）孪晶和其他多晶晶向．     

不同生长条件对CdTe/GaAs外延薄膜表面形貌和光学性质的影响

本文利用分子束外延技术在GaAs(211)B衬底上外延CdTe(211)薄膜,系统研究不同工艺条件对CdTe外延薄膜的表面形貌和光学性质的影响。研究表明,在一定的生长温度下,在Te气氛下生长CdTe薄膜,增加CdTe:Te的束流比,可显著降低CdTe表面金字塔缺陷的尺寸和密度,当CdTe和Te束流比为6.5时,金字塔缺陷几乎消失,材料的表面平整度显著改善,X射线衍射(XRD)也表明CdTe晶体质量显著提高。进一步的拉曼光谱表明,随着CdTe和Te束流比的增加,Te的A₁峰减弱,CdTe LO和TO声子峰强度比增强。低温光致发光光谱(PL)研究也表明随着CdTe和Te束流比的增加,Cd空位的减少可以使与杂质能级相关的深能级区域的峰强降低,与此同时和晶体质量相关的自由激子峰半峰全宽减少,材料的光学质量明显改善。该研究为探索CdTe/GaAs外延材料的理想的工艺窗口以及相关机理,并为进一步以此为缓冲层外延高质量HgCdTe材料提供基础。     

CdTe/GaAs(111)B薄膜的MBE生长研究

采用分子束外延方法,在GaAs(111)B衬底上,生长CdTe薄膜,以求研制出用于液相外延生长碲镉汞(HgCdTe)薄膜的CdTe/GaAs(111)B复合衬底.通过理论分析和实验探索,优化了生长温度和Te/Cd束流比等重要生长参数,获得了质量较好的CdTe薄膜,再通过循环热处理,使CdTe/GaAs(111)B复合衬底的质量得到进一步的提高,X-射线回摆曲线半峰宽(FWHM)有明显的降低.为LPE-HgCdTe薄膜的生长打下了较好基础.     

Si/CdTe复合衬底HgCdTe液相外延材料的生长与性能分析

通过改进推舟液相外延技术,成功地在(211)晶向Si/CdTe复合衬底上进行了HgCdTe液相外延生长,获得了表面光亮的HgCdTe外延薄膜.测试结果表明,(211)Si/CdTe复合衬底液相外延HgCdTe材料组分及厚度的均匀性与常规(111)CdZnTe衬底HgCdTe外延材料相当;位错腐蚀坑平均密度为(5～8)×105 cm-2,比相同衬底上分子束外延材料的平均位错密度要低一个数量级;晶体的双晶半峰宽达到70″左右.研究结果表明,在发展需要低位错密度的大面积长波HgCdTe外延材料制备技术方面,Si/CdTe复合衬底HgCdTe液相外延技术可发挥重要的作用.     

Si/CdTe复合衬底HgCdTe液相外延材料的生长与性能分析

通过改进推舟液相外延技术,成功地在(211)晶向Si/CdTe复合衬底上进行了HgCdTe液相外延生长,获得了表面光亮的HgCdTe外延薄膜.测试结果表明,(211)Si/CdTe复合衬底液相外延HgCdTe材料组分及厚度的均匀性与常规(111)CdZnTe衬底HgCdTe外延材料相当;位错腐蚀坑平均密度为(5～8)×105 cm-2,比相同衬底上分子束外延材料的平均位错密度要低一个数量级;晶体的双晶半峰宽达到70″左右.研究结果表明,在发展需要低位错密度的大面积长波HgCdTe外延材料制备技术方面,Si/CdTe复合衬底HgCdTe液相外延技术可发挥重要的作用.     

硅缓冲层提高选区外延生长硅基锗薄膜质量

研究了Si缓冲层对选区外延Si基Ge薄膜的晶体质量的影响。利用超高真空化学气相沉积系统,结合低温Ge缓冲层和选区外延技术,通过插入Si缓冲层,在Si/SiO_2图形衬底上选择性外延生长Ge薄膜。采用X射线衍射(XRD)、扫描电子显微镜(SEM)、原子力显微镜(AFM)表征了Ge薄膜的晶体质量和表面形貌。测试结果表明,选区外延Ge薄膜的晶体质量比无图形衬底外延得到薄膜的晶体质量要高;选区外延Ge薄膜前插入Si缓冲层得到Ge薄膜具有较低的XRD曲线半高宽以及表面粗糙度,位错密度低至5.9×10~5/cm^2,且薄膜经过高低温循环退火后,XRD曲线半高宽和位错密度进一步降低。通过插入Si缓冲层可提高选区外延Si基Ge薄膜的晶体质量,该技术有望应用于Si基光电集成。     

Microstructural Characterization of CdTe(211)B/ZnTe/Si(211) Heterostructures Grown by Molecular Beam Epitaxy

Transmission electron microscopy and small-probe microanalysis have been used to investigate the microstructure and compositional profiles of CdTe(211)B/ZnTe/Si(211) heterostructures. Thin ZnTe buffer layers and subsequent thick CdTe layers were grown on Si(211) substrates using molecular beam epitaxy. Many {111}-type stacking faults were found to be present throughout the entire ZnTe layer, terminating near the point of initiation of CdTe growth. A rotation angle of about 3.5° was observed between lattice planes of the Si substrate and the final CdTe epilayer. Local lattice parameter measurement and elemental profiles indicated that some intermixing of Zn and Cd had taken place. The average widths of the ZnTe layer and the (Cd,Zn)Te transition region were found to be roughly 6.5 nm and 3.5 nm, respectively.     

Recent Results on Growth of (211)B CdTe on (211)Si with Intermediate Ge and ZnTe Buffer Layers by Metalorganic Vapor-Phase Epitaxy

We report on the investigation of epitaxial cadmium telluride grown by metalorganic vapor-phase epitaxy (MOVPE) on (211)Si, with particular emphasis on studying the effect of changing the reactor parameters and thermal annealing conditions on the epilayer quality. The CdTe films were characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM), and x-ray diffraction (XRD). The best CdTe films were observed when the Te/Cd precursor partial pressure ratio was close to 3.1. It was also observed that, though annealing improved the crystal quality, a slight increase in surface roughness was observed. Similar attempts were made to improve the growth conditions of ZnTe intermediate buffer layer, which showed similar trends with changes in precursor flows.     

Understanding the Evolution of CdTe Buffer Layer Surfaces on ZnTe/Si(211) and GaAs(211)B During Cyclic Annealing

We present the results of a detailed study of the changes that occur on CdTe buffer layer surfaces grown on ZnTe/Si(211) and GaAs(211)B during the routine thermal cyclic annealing (TCA) process. Observations indicate that CdTe buffer layer surfaces are Te saturated when the TCA is performed under Te overpressure. In the absence of Te flux during the TCA step, the CdTe surface loses CdTe congruently and the typical CdTe nanowires show the presence of nodules on their surfaces. The observed changes in reflection high-energy electron diffraction patterns during TCA are explained in terms of surface chemistry and topography observations. Overall, the Te overpressure is necessary to maintain a smoother and pristine surface to continue the molecular beam epitaxy (MBE) growth.     

Cyclic Annealing During Metalorganic Vapor-Phase Epitaxial Growth of (211)B CdTe on (211) Si Substrates

High-quality (211)B CdTe buffer layers on Si substrates are required to enable Hg_1–x Cd _x Te growth and device fabrication on lattice-mismatched Si substrates. Metalorganic vapor-phase epitaxy (MOVPE) of (211)B CdTe on Si substrates using Ge and ZnTe interlayers has been achieved. Cyclic annealing has been used during growth of thick CdTe layers in order to improve crystal quality. The best (211)B CdTe/Si films grown in this study display a low x-ray diffraction (XRD) rocking-curve full-width at half-maximum (FWHM) of 85 arcsec and etch pit density (EPD) of 2 × 10⁶ cm⁻². These values are the best reported for MOVPE-grown (211) CdTe/Si and are comparable to those for state-of-the-art molecular beam epitaxy (MBE)-grown CdTe/Si.     

Molecular Dynamics Simulation of MBE Growth of CdTe/ZnTe/Si

We simulate in three dimensions molecular beam epitaxial (MBE) growth of CdTe/ZnTe/Si using classical molecular dynamics. Atomic interactions are simulated with Stillinger–Weber potentials, whose parameters are obtained by fitting to experimental data or density function theory-calculated distortion energies of the component crystals. The effects of substrate temperature and atomic species flux ratios on epilayer morphology are investigated. The agreement between simulations and experiments suggests that this model has reasonable ability to predict the microstructures of CdTe/ZnTe/Si grown by MBE.     

Improved CdTe layers on GaAs and Si using atomic layer epitaxy

In this paper, we report on the atomic layer epitaxy (ALE) of CdTe on GaAs and Si by the organometallic vapor phase epitaxial process at atmospheric pressure. Self-limiting growth at one monolayer was obtained over the temperature range from 250°C to 320°C, under a wide range of reactant pressure conditions. A study of growth mechanism indicates that DMCd decomposes into Cd on the surface and the Te precursors react catalytically on the Cd covered surface. We have used this ALE grown layer to improve the crystal quality and the morphology of conventionally grown CdTe on GaAs. Improvement in the crystal quality was also observed when ALE CdTe nucleation was carried out on Si pretreated with DETe at 420°C. Atomic layer epitaxy grown ZnTe was used to obtain (100) oriented CdTe on (100) silicon.     

Microstructural and optical characterization of CdTe(211)B/ZnTe/Si(211) grown by molecular beam epitaxy

CdTe layers have been grown by molecular beam epitaxy on 3 inch nominal Si(211) under various conditions to study the effect of growth parameters on the structural quality. The microstructure of several samples was investigated by high resolution transmission electron microscopy (HRTEM). The orientation of the CdTe layers was affected strongly by the ZnTe buffer deposition temperature. Both single domain CdTe(133)B and CdTe(211)B were obtained by selective growth of ZnTe buffer layers at different temperatures. We demonstrated that thin ZnTe buffer layers (<2 nm) are sufficient to maintain the (211) orientation. CdTe deposited at ∼300°C grows with its normal lattice parameter from the onset of growth, demonstrating the effective strain accommodation of the buffer layer. The low tilt angle (<1°) between CdTe[211] and Si[211] indicates that high miscut Si(211) substrates are unnecessary. From low temperature photoluminescence, it is shown that Cd-substituted Li is the main residual impurity in the CdTe layer. In addition, deep emission bands are attributed to the presence of As_Te and Ag_Cd acceptors. There is no evidence that copper plays a role in the impurity contamination of the samples.