共查询到18条相似文献,搜索用时 130 毫秒
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选择在SnAgCu钎料中添加纳米铝颗粒,改善无铅钎料的性能.结果表明,微量纳米铝颗粒可以增加SnAgCu钎料的润湿铺展面积,显著提高SnAgCu焊点的拉伸力和剪切力,添加过量时钎料的润湿性能会有一定程度的下降,经过优化分析发现纳米铝颗粒的最佳添加量应该控制在0.1%附近.对SnAgCu-xAl钎料的组织分析,发现纳米颗粒的添加,钎料组织得到明显的细化,树枝晶间距明显减小.对SnAgCu-xAl焊点进行蠕变拉伸测试,发现纳米铝颗粒可以显著提高SnAgCu焊点的蠕变断裂寿命,主要归因于纳米颗粒对位错的钉扎作用. 相似文献
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研究了高温对SnAgCu+xCo(x=0,0.1,0.2,0.45,1.0,x为质量分数%,下同)复合钎料接头显微组织和力学性能的影响。用差热分析法(DSC)分析了Co对钎焊接头过冷度和凝固相的影响。与Sn-3.0Ag-0.5Cu钎料相比,焊后SnAgCu+xCo(x=0.1,0.2)复合钎料界面金属间化合物层厚度减小,接头剪切强度提高。经150℃保温500h后,SnAgCu+xCo复合钎料接头剪切强度均高于Sn-3.0Ag-0.5Cu钎料接头,说明Co的添加可以改善SnAgCu钎料的服役可靠性。经DSC分析,Co的添加会提高SnAgCu钎料合金的凝固点,从而降低其过冷度。综上,Sn-3.0Ag-0.5Cu-0.2Co复合钎料接头的力学性能和服役条件下的可靠性最佳。 相似文献
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研究了纳米TiO2颗粒对SnAgCu钎料组织和性能的影响.结果表明:微量的纳米TiO2颗粒可以增加SnAgCu钎料的润湿铺展面积,显著提高SnAgCu焊点的拉伸力和剪切力.添加过量时焊点的力学性能会有一定程度的下降.经过优化分析发现,纳米TiO2颗粒的最佳添加量为0.1%(质量分数,下同).SnAgCu-0.1TiO2相对SnAgCu钎料基体组织得到明显的细化,树枝晶的间距下降62.5%.经过热循环测试,发现0.1%TiO2可以显著提高SnAgCu焊点的抗热疲劳特性.主要归因于纳米颗粒对位错的钉扎作用,因而阻止了裂纹在钎料基体内部的扩展. 相似文献
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分析了SnAgCuX系无铅钎料中Ag异元素含量的变化对熔化温度、润湿性能的影响,同时研究了时效前和高温时效后钎焊接头的抗剪强度和显微组织,其中X包含Ni,P和Ce三种元素.结果表明,添加微量X元素能够在一定程度上弥补snAgCu钎料中Ag元素含量的降低引起的性能下降.X元素的添加对SnAgCu钎料的熔化温度影响不大,但能改善钎料合金的润湿性能,提高钎焊接头的抗剪强度,并抑制时效引起的接头强度下降.这与微量X元素的添加改善了钎料的显微组织和金属间化合物的形貌有很大的关系. 相似文献
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研究了不同含量Pr元素(质量分数分别为0,0.05%,0.5%)对Sn-3.8Ag-0.7Cu无铅钎料凝固特性、润湿铺展性能以及微观组织的影响.结果表明,SAC,SAC-0.05Pr以及SAC-0.5Pr的凝固所需过冷度分别为20.6,5.0,5.1℃,说明适量Pr元素的加入能够显著降低SnAgCu钎料凝固所需的过冷度;同时,Pr元素的加入细化了钎料组织,降低钎料组织中初晶β-Sn的尺寸,抑制了SnAgCu/Cu焊点内部不同形貌大块化合物Ag3Sn初晶的形成;当Pr元素的添加量为0.05%时,钎料润湿性能最优、组织最佳;0.5%Pr元素的添加会在钎料以及焊点内部形成PrSn3相,对焊点的性能造成不利的影响. 相似文献
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水洗钎剂下SnAgCu系钎料对不同基板的润湿特性 总被引:5,自引:0,他引:5
选用商用水洗钎剂,采用润湿平衡法,研究了低银SnAgCu系钎料合金在表面贴装元器件及紫铜板上的润湿特性。研究结果表明,在Ag的质量分数为2.5%时,SnAg2.5Cu0.7钎料合金具有最大的润湿力和铺展面积及最小的润湿角。其润湿力高于现行商用SnAg3.8Cu0.7钎料合金,完全可满足表面组装元器件对其润湿性能的要求。 相似文献
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Environmentally friendly solders 3-4 beyond Pb-based systems 总被引:1,自引:0,他引:1
Based on environmental considerations, global economic pressures, enacted by legislations in several countries, have warranted the elimination of lead from solders used in electronic applications.Sn3.5Ag, SnAgCu, and Sn0.7Cu have emerged among various lead-free candidates as the most promising solder alloys to be utilized in microelectronic industries.However, with the vast development and miniaturization of modern electronic packaging, new requirements such as superior service capabilities have been posed on lead-free solders.In order to improve the comprehensive property of the solder alloys, two possible approaches were adopted in the current research and new materials developed were patented.One approach was involved with the addition of alloying elements to make new ternary or quaternary solder alloys.Proper addition of rare earth element such as La and Ce have rendered solder alloys with improved mechanical properties, especially creep rupture lives of their joints.Another approach, the composite approach, was developed mainly to improve the service temperature capability of the solder alloys.Composite solders fabricated by mechanically incorporating various reinforcement particles to the solder paste have again exhibited enhanced properties without altering the existing processing characteristics.The recent progress and research efforts carried out on lead-free solder materials in Beijing University of Technology were reported.The effects of rare earth addition on the microstructure, processing properties, and mechanical properties were presented.The behaviors of various Sn-3.5Ag based composite solders were also explicated in terms of the roles of reinforcement particles on intermetallic growth, steady-state creep rate, the onset of tertiary creep, as well as the overall creep deformation in the solder joints.Thermomechanical fatigue (TMF) behavior of the solder alloys and composite solders were investigated with different parameters such as ramp rate, dwell time, etc.The damage accumulation features and residual mechanical properties of the thermomechanically-fatigued composite solder joints were compared with non-composite solder joints.To match the lead-free alloys, various types of water soluble no-clean soldering flux have also been developed and their properties were presented. 相似文献
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采用再流焊方法对细间距器件进行钎焊试验,针对使用SnAgCu和SnPb两种钎料对应的焊点进行了研究。结果表明,SnAgCu焊点的拉力明显高于SnPb焊点,说明SnAgCu对应焊点的抗拉强度更高。对焊点断口组织分析发现,SaAgCu焊点拉伸断裂方式为韧性断裂,而SnPb焊点的断裂方式兼有脆性断裂和韧性断裂的特征。运用非线性有限元模拟,针对焊点在温度循环载荷作用下的力学性能分析,发现SnAgCu焊点的应力应变以及非线性应变能明显小于SnPb焊点对应的数值。说明SnAgCu焊点的可靠性明显高于SnPb焊点。模拟结果和试验研究结果吻合,该研究为无铅钎料的进一步研究提供理论指导。 相似文献
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Creep behavior of SnAgCu solders with rare earth Ce doping 总被引:2,自引:0,他引:2
Extensive testing was carried out to study the effects of rare earth Ce doping on the properties of SnAgCu solder alloys.The addition of 0.03%(mass fraction) rare earth Ce into SnAgCu solder may improve its mechanical properties,but slightly lower its melting temperature.The tensile creep behavior of bulk SnAgCuCe solders was reported and compared with SnAgCu solders.It is found that SnAgCuCe solders show higher creep resistance than SnAgCu alloys.Moreover,Dorn model and Garofalo model are successfully used... 相似文献
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基于Anand模型SnAgCu-X焊点疲劳寿命预测 总被引:3,自引:0,他引:3
Anand模型采用有限元法模拟WLCSP器件Sn3.8Ag0.7Cu-X(Ce,Fe)无铅焊点在热循环载荷条件下的应力-应变响应,借助蠕变应变疲劳寿命预测模型SnAgCu,SnAgCuCe,SnAgCuFe焊点疲劳寿命.结果表明,在服役器件整体器件出现明显的变形现象,电路板翘曲严重.从中心到拐角焊点变形-应力-应变逐渐增加,芯片下拐角焊点成为整个结构潜在的危险区域.通过计算WLCSP器件SnAgCu、SnAgCuCe和SnAgCuFe三种焊点的疲劳寿命,证实了SnAgCuCe和SnAgCuFe焊点寿命明显高于SnAgCu焊点,证明了在SnAgCu中添加一定量的铈和铁可以显著提高SnAgCu焊点的使用寿命,分析结果为新型无铅钎料的研发提供理论支撑. 相似文献
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电子组装用无铅钎料的研究和发展 总被引:1,自引:0,他引:1
综述了近年来国际上无铅钎料的研发现状,重点介绍了无铅钎料的性能要求。指出研究无铅钎料,不只是简单地提供一种替代品,还需要考虑无铅钎料的力学性能、钎焊性能及焊点可靠性能够与传统的Sn-Pb钎料相近、钎焊设备与工艺尽量改动不大等因素,开展无铅钎料的研究具有十分重要的理论意义和实用价值。详细讨论了Sn-Ag系、Sn-Cu系和Sn-Ag-Cu系等三大系列的无铅钎料,指出无铅化电子组装面临着机遇与挑战,要想在激烈的国际竞争中赢得市场,我国必须重视无铅钎料产品的研究开发与产业化,这同时需要电子企业的全力支持与配合。 相似文献