Ku- and K-band internally matched high-power GaAs f.e.t. amplifiers

Internal-matching techniques, using lumped-element capacitors fabricated on high dielectric ceramics, have been developed for high power GaAs f.e.t.s in Ku- and K-bands. The developed internally matched high-power f.e.t. amplifier modules have exhibited 1.9 W power output with 4 dB associated gain at 14 GHz and 1.25 W power output with 3 dB associated gain at 18 GHz.     

n-channel formation on semi-insulating InP surface by m.i.s.f.e.t.

InP m.i.s.f.e.t.s using Fe-doped semi-insulating material surface have been fabricated. The devices, composed of sulphur-diffused n-type source and drain and c.v.d. Al2O3 gate insulator, exhibited n-channel normally-off behaviour and a source drain capacitance two orders of magnitude smaller than that of p-InP m.i.s.f.e.t.s with the same dimensions.     

High-speed 1 ?m GaAs m.e.s.f.e.t.

By minimising parasitic series resistances, a GaAs m.e.s.f.e.t. with 1 ?m gate length was fabricated, possessing the highest known r.f. power gain, measured up to 18 GHz, for GaAs m.e.s.f.e.t.s.     

GaAs gigabit logic circuits using normally-off m.e.s.f.e.t.s

Normally-off GaAs m.e.s.f.e.t. logic circuits fabricated by electron beam lithography have exhibited excellent high speed switching characteristics. The highest switching speed evaluated from a 15-stage ring oscillator is 30 ps per gate with a power dissipation of 1.9 mW. Binary frequency dividers have been fabricated with D-type flip-flops operating up to 3 GHz. A divide-by-eight counter has also operated at 2.5 GHz.     

Silicon-on-sapphire m.o.s.f.e.t.s fabricated by back-surface laser-anneal technology

Self-aligned aluminium-gate silicon-on sapphire (s.o.s.) m.o.s.f.e.t.s have been fabricated by applying laser-anneal technology from the back surface for activation of the ion-implanted channel layer. The threshold voltage and surface electron mobility were similar to the conventional silicon-gate m.o.s.f.e.t.s, but the low resistivity of gate and interconnection electrodes using aluminium is advantageous for high switching speed m.o.s. l.s.i.     

V-shaped-gate GaAs m.e.s.f.e.t. for improved high-frequency performance

The idea of gate shaping in f.e.t.s was implemented into the GaAs-m.e.s.f.e.t. structure. A m.e.s.f.e.t. with 2 ?m gate length was fabricated, the measured m.a.g. data of which allow an extrapolation to an fmax of about 45 GHz.     

X-band performance of GaAs power f.e.t.s

The results of X-band measurements on GaAs power f.e.t.s are reported. These devices are fabricated with a simple planar process. Devices with output powers of 1 W or more at 9 GHz with 4 dB gain have been fabricated from more than a dozen slices. The highest output powers observed with 4 dB gain are 1.78 W at 9 GHz and 2.5 W at 8 GHz. Devices have been operated with 46% power-added efficiency at 8 GHz.     

Microwave power amplification with InP f.e.t.s

InP f.e.t.s were fabricated from v.p.e. layers, with an Al gate of 1.5 ?m × 308 ?m. The power output at 9 GHz, with 4 dB gain, was 1.15 W/mm gate width. This result is believed to be higher than the best published results obtained with equivalent GaAs f.e.t. structures.     

Ion-implanted GaAs X-band power f.e.t.s

Active layers for GaAs power f.e.t.s have been produced by Si implantation into Cr-doped substrates followed by a simple proximity-annealing technique. Devices fabricated on these layers have up to 1.05 W/mm gate width at 10 GHz. This performance is equal to that of epitaxial devices.     

Microwave capability of 1.5 ?m-gate GaAs m.o.s.f.e.t.

1.5 ?m-gate GaAs m.o.s.f.e.t.s have been fabricated by anodic oxidation, and the microwave capability has been examined. The maximum oscillation frequency fmax is 22 GHz and the noise figure is 6.1 dB at 8 GHz. The results are comparable to those of GaAs m.e.s.f.e.t.s.     

Enhancement-mode GaAs m.o.s.f.e.t. on semi-insulating substrate using a self-aligned gate technique

A self-aligned gate notched channel GaAs m.o.s.f.e.t. structure on semi-insulating substrate is presented. Device operation is mainly in enhancement mode. The transconductance is comparable to enhancement-mode m.e.s.f.e.t.s, j.f.e.t.s and s.i.g.f.e.t.s; however, the output-current capability is essentially increased.     

InP/Al2O3n-channel inversion-mode m.i.s.f.e.t.s using sulphur-diffused source and drain

InP metal-insulator-semiconductor field-effect transistors (m.i.s.f.e.t.s) have been fabricated using c.v.d. Al2O3 as the gate insulator and the sulphur-diffusion process for source and drain. The n-channel inversion-mode device exhibits normally off behaviour. A maximum d.c. transconductance gm of 10 mS (87 mS/mm of gate width) has been obtained.     

Low-noise GaAs m.e.s.f.e.t.s

GaAs m.e.s.f.e.t.s with optimum noise figures of 1.6 dB at 6 GHz have been fabricated by projection photolithography. An equation has been developed for the calculation of optimum noise figure which gives good agreement between calculated and measured values.     

New structure of enhancement-mode GaAs microwave m.o.s.f.e.t.

This letter proposes a new feasible device structure of an enhancement-mode GaAs deep-depletion m.o.s.f.e.t. as an attractive alternative to the junction-gate f.e.t.s and describes its microwave properties. The device has been fabricated on a high-resistance epitaxial n?-layer by simple readily available technology without requiring the sophisticated control of the channel thickness needed for the conventional junction-gate f.e.t.s. The 'normally-off nature of the device can be explained on the basis of the substrate space-charge region extending over then?-layer. The microwave performance of the device can be favourably compared with that of currently achievable junction-gate normally-off f.e.t.s. Unilateral gain drops to zero at a frequency slightly above 7 GHz.     

GaAs f.e.t.s with graded channel doping profiles

Graded-channel GaAs f.e.t.s with the carrier concentration decreasing from the substrate?epitaxial interface outwards are observed to exhibit more linear d.c. transfer characteristics, higher reverse gate breakdown voltages and lower 3rd-order intermodulation products than f.e.t.s fabricated from companion slices with uniform or flat doping profiles.     

Low-noise microwave f.e.t.s fabricated by molecular-beam epitaxy

The growth of m.b.e. GaAs suitable for f.e.t. fabrication is reported. The m.b.e. structure consists of an n+ = 2.5×1018 cm?3 contact layer on top of an n+ = 3.5×1017 cm?3 active layer. Using this material, f.e.t.s. have been fabricated that have a minimum noise figure of 1.5 dB with an associated gain of 15 dB at 8 GHz. These are the best results yet reported for low-noise m.b.e. GaAs f.e.t.s.     

Microwave gain from an n-channel enhancement-mode InP m.i.s.f.e.t.

A power gain of 14 dB at 1 GHz has been demonstrated in an enhancement-mode m.i.s.f.e.t. constructed on an Fe-doped semi-insulating InP substrate. The same device also exhibits well behaved gain characteristics at low frequencies.     

New n-channel m.o.s.f.e.t.s

By using plasma c.v.d. and lift-off, an n-channel m.o.s.f.e.t. with effective channel length of 0.4 ?m has been fabricated. Its main fabrication processes and obtained electrical characteristics are described.     

Enhancement-mode ion-implanted InP f.e.t.s

Planar enhancement-mode InP f.e.t.s have been fabricated through the use of ion implantation and subsequent electron-beam lithography. Noise figures of 3.2 and 2.6 dB were achieved at 8 GHz with associated gains of 6.4 and 4.7 dB, respectively.     

X and Ku band GaAs m.e.s.f.e.t.

A GaAs Schottky-barrier f.e.t. (m.e.s.f.e.t.) with a 1 ?m gate has been built, which is suitable for X band and Ku band applications. The unilateral power gain over the X band is above 9 dB and the noise figure is only 5 dB at 10 GHz.