飞秒脉冲激光沉积 Si基α轴择优取向的钛酸铋铁电薄膜及I-V特性研究

采用飞秒脉冲激光沉积系统，在Si（111）衬底上制备了α轴和c轴择优取向的Bi4Ti3O12薄膜．X射线衍射（XRD）表明；室温（20℃）下沉积的Bi4Ti3O12／Si（111）薄膜呈C轴择优取向，晶粒的平均直径为20nm．在500℃沉积的Bi4Ti3O12／Si（111）薄膜呈α轴择优取向．测量了薄膜的电滞回线和，I-V特性曲线，并用分布参数电路研究了Bi4Ti3O12薄膜的，I-V特性曲线和铁电性的关联性．α轴择优取向Bi4Ti3O12薄膜的剩余极化强度Pr=15μC／cm^2，矫顽力Ec=48kV／cm．     

飞秒脉冲激光沉积Si基α轴择优取向的钛酸铋铁电薄膜及Ⅰ-Ⅴ特性研究

采用飞秒脉冲激光沉积系统,在Si(111)衬底上制备了a轴和c轴择优取向的Bi4Ti3O12薄膜．X射线衍射(XRD)表明:室温(20℃)下沉积的Bi4Ti3O12／Si(111)薄膜呈c轴择优取向,晶粒的平均直径为20nm．在500℃沉积的Bi4Ti3O12／Si(111)薄膜呈a轴择优取向．测量了薄膜的电滞回线和Ⅰ-Ⅴ特性曲线,并用分布参数电路研究了Bi4Ti3O12薄膜的,Ⅰ-Ⅴ特性曲线和铁电性的关联性．a轴择优取向Bi4Ti3O12薄膜的剩余极化强度Pr=15μC／cm2,矫顽力Ec=48kV／cm．     

飞秒脉冲激光沉积Si基a轴择优取向的钛酸铋铁电薄膜及Ⅰ-Ⅴ特性研究

采用飞秒脉冲激光沉积系统,在Si(111)衬底上制备了a轴和c轴择优取向的Bi4Ti3O12薄膜.X射线衍射(XRD)表明室温(20℃)下沉积的Bi4Ti3O12/Si(111)薄膜呈c轴择优取向,晶粒的平均直径为20nm.在500℃沉积的Bi4Ti3O12/Si(111)薄膜呈a轴择优取向.测量了薄膜的电滞回线和Ⅰ-Ⅴ特性曲线,并用分布参数电路研究了Bi4Ti3O12薄膜的Ⅰ-Ⅴ特性曲线和铁电性的关联性.a轴择优取向Bi4Ti3O12薄膜的剩余极化强度Pr=15μC/cm2,矫顽力Ec=48kV/cm.     

Bi4Ti3O12薄膜的取向生长及其电性能研究

采用Sol—Gel工艺，在快速退火的工艺条件下制备了Bi4Ti3O12铁电薄膜，研究了退火温度及时间、薄膜厚度对Bi4Ti3O12薄膜的取向生长行为及其铁电性能、漏电流的影响，探讨了Bi4Ti3O12薄膜取向生长的微观机制．结果表明：退火温度显著影响薄膜的C轴取向生长，其(00ι)品面的取向度F=(P—P0)／(1-P0)由550℃的0．081增加到850℃的0．827，退火时间对其(00ι)晶面的取向度也有较大影响；经750℃以上温度退火处理的Bi4Ti3O12薄膜呈高度c轴取向，对铁电性能有较明显的削弱作用；薄膜的漏电流密度随退火温度升高而增大，但薄膜的c轴取向生长有利于减缓漏电流密度的增长。     

TiO2种子层对Bi 3.15 Nd 0.85 Ti 3 O 12铁电薄膜的结晶取向和铁电性能的影响

用sol—gel法分别制备了直接沉积在Pt／Ti／SiO2／Si衬底上和加入了TiO2种子层的Bi3．15Nd0．85Ti3O12（BNT）铁电薄膜，研究了种子层对BNT薄膜结构和电学性能的影响．XRD结果表明直接沉积在Pt／Ti／SiO2／Si衬底上的BNT薄膜具有（117）和（001）的混合取向，而加入TiO2种子层之后薄膜的最强峰为（200）取向；FE-SEM显示具有TiO2种子层的BNT薄膜，其表面主要是由具有非C轴取向的晶粒组成且更为致密；直接沉积的BNT薄膜和具有TiO2种子层的BNT薄膜的剩余极化Pr值分别为26和43．6μC／cm^2，矫顽场强＆分别为91和80．5kV／cm；疲劳测试表明两种薄膜均具有良好的抗疲劳特性，TiO2种子层的引入并没有降低BNT薄膜的疲劳特性；两种薄膜的漏电流密度均在10^-6-10^-5A／cm^2之间．     

Ag/Bi4Ti3O12/p-Si异质结的制备及其C-V特性研究

为制备符合铁电存储器件要求的高质量铁电薄膜,采用溶胶-凝胶(Sol-Gel)工艺,制备了Si基Bi4Ti3O12铁电薄膜及MFS结构的Ag/Bi4Ti3O12/P-Si异质结,对Bi4Ti3O12薄膜的相结构特征及异质结的C-V特性进行了测试与分析.XRD图谱显示,Si基Bi4Ti3O12薄膜具有沿c-轴择优取向生长的趋势,而Ag/Bi4Ti3O12/p-Si异质结顺时针回滞的C-V特性曲线则表明,该异质结可实现电极化存储.此外,对该异质结C-V特性曲线的非对称及向负偏压方向偏移的产生原因也进行了分析.在此基础上,为提高铁电薄膜的铁电性能及改善其C-V特性提出了合理的结构设想.     

化学溶液沉积法制备Nd和Sc/Al/(Sc,Al)共掺杂钛酸铋铁电薄膜的电性能研究

利用化学溶液沉积法在Pt/Ti/SiO2/Si(100)基底和700℃条件下分别制备了Nd和Sc/Al/( Sc,Al)共掺杂的钛酸铋薄膜Bi3.15 Nd0.85 Ti2.94 Sc0.06O12 (BNTSc)、Bi3.15 Nd0.85 Ti2.94 Al0.06O12(BNTAl)和Bi3.15Nd0.85 Ti2.94(Sc0.03,Al0.03)O12(BNT(Sc,Al)),并研究和对比了这一系列薄膜的微结构、介电、铁电和漏电流等特性.结果发现BNT( Sc,Al)薄膜具有较高的剩余极化强度和介电常数,其漏电流密度低于BNTAl薄膜.另外,还讨论了相关的物理机制.     

Ag/Bi3.25La0.75Ti3O12/Bi4Ti3O12/Si结构铁电薄膜制备及其铁电性能的研究

利用溶胶-凝胶(sol-gel)方法,在硅基底上制备了Bi3.25La0.75Ti3O12/Bi4Ti3O12/Si铁电薄膜,其中Bi4Ti3O12作为缓冲层.用XRD方法分析了该结构铁电薄膜的物相结构;用扫描电镜对薄膜样品进行表面形貌观察;并且对该结构的铁电性能进行了研究.     

退火温度对Si基Bi4Ti3O12铁电薄膜微观结构影响研究

采用Sol-Gel工艺制备了Si基Bi4Ti3O12铁电薄膜。研究了退火温度对Si基Bi4Ti3O12薄膜晶相结构、晶粒尺寸及薄膜表面形貌的影响。研究表明，退火温度低于450℃时Bi4Ti3O12薄膜为非晶状态，退火温度在550-850℃范围内均为多晶薄膜，而且随退火温度升高，Bi4Ti3O12薄膜更趋向于沿c轴取向的生长；而晶粒尺寸及薄膜粗糙度随退火温度升高而增大，但在较高温度下增长速度趋缓。     

硅基LiNbO3薄膜的微结构研究

利用透射电子显微镜及X射线衍射，研究脉冲激光沉积技术(PLD)在Si(001)衬底上生长LiNbO3薄膜的微结构．结果表明，在600℃的衬底温度、30Pa的氧分压条件下，在硅片表面5nm厚的非晶氧化层上生长的薄膜，为c轴择优取向的单相LiNbO3晶体，本文还讨论了获得c轴择优取向LiNbO3薄膜的生长机理．     

Bi2O3薄膜的制备及其电阻开关特性的研究

电阻式存储器由于具有众多的优点有望成为最有前景的下一代高速非挥发性存储器的选择之一.实验利用射频磁控溅射法在重掺硅上沉积了Bi2O3薄膜,并对该薄膜的结晶状态和Au/Bi2O3/n+Si/Al结构的电阻开关特性进行了研究.XRD分析结果表明,射频磁控溅射法沉积所得的Bi2O3薄膜结晶性能好,(201)取向明显.I-V曲线测试结果表明,Au/Bi2O3/n+Si/Al结构具有单极性电阻开关特性.通过对不同厚度Bi2O3薄膜的Au/Bi2O3/n+Si/Al结构I-V特性比较发现,随着薄膜厚度的增加,电阻开关的Forming、Set和Reset阈值电压均随之增加.对于Bi2O3薄膜厚度为31.2 nm的Au/Bi2O3/n+Si/Al结构,其Forming、Set和Reset阈值电压均低于4 V,符合存储器低电压工作的要求.     

结构设计对铁电薄膜系统电滞回线的影响

为制备符合Si集成铁电器件要求的高质量Si基铁电薄膜，采用溶胶—凝胶(sol—gel)工艺，制备了MFM及MFS结构的铁电薄膜系统，研究了不同结构及不同衬底对铁电薄膜系统铁电性能及电滞回线的影响，并对这些差异产生的主要影响因素进行了分析，在此基础上，提出并制备了Ag／Pb(Zr0.52Ti0.48)O3／Bi4Ti3O12／p—Si多层结构，该结构铁电薄膜系统的铁电性能及电滞回线的对称性有明显改善，有望应用于Si集成铁电器件。     

Deposition and dielectric properties of CaCu3Ti4O12 thin films on Pt/Ti/SiO2/Si substrates using pulsed-laser deposition

CaCu₃Ti₄O₁₂ (CCTO) thin films were successfully deposited on Pt/Ti/SiO₂/Si(1 0 0) substrates using pulsed-laser deposition technique. The crystalline structure and the surface morphology of the CCTO thin films were greatly affected by the substrate temperature and oxygen pressure. Thin films with a (2 2 0) preferential orientation were obtained at the substrate temperature above 700 °C and oxygen pressure above 13.3 Pa. The 480-nm thin films deposited under 720 °C and 26.6 Pa have a fairly high dielectric constant of near 2000 at 10 kHz and room temperature. The values of the dielectric constant and loss and their temperature-dependence under different frequency are comparable with those obtained in the epitaxial CCTO films grown on oxide substrates.     

Effect of Bi2Ti2O7 Seeding Layer on Capacitance-voltage Properties of Bi3:54Nd0:46Ti3O12 Films

Au/Bi3:54Nd0:46Ti3O12/Bi2Ti2O7/Si structure has been fabricated with a preferentially (111)-orientated Bi2Ti2O7 seeding layer as a ferroelectric gate of metal-ferroelectric-insulator ¯eld e®ect transistor. Bi3:54Nd0:46Ti3O12 and Bi3:54Nd0:46Ti3O12/Bi2Ti2O7 ¯lms are both well-crystallized when annealed at 680±C for 40 min, and have smooth, dense and crack-free surfaces. The width of memory window of the ferroelectric gate increases with increasing electric ¯eld applied to the Bi3:54Nd0:46Ti3O12 thin ¯lms. The width of memory window of Au/Bi3:54Nd0:46Ti3O12/Bi2Ti2O7/Si with seeding layer is relatively wider than that of Au/Bi3:54Nd0:46Ti3O12/Si at the same bias voltage, and the counterclockwise hysteresis curve of Au/Bi3:54Nd0:46Ti3O12/Bi2Ti2O7/Si is referred to as polarization type switching at di®erent voltages. Bi2Ti2O7 seeding layer plays an important role in alleviating the element interdi®usion between Bi3:54Nd0:46Ti3O12 and Si.     

硅基Bi4Ti3O12薄膜的C-V特性研究

Bi4 Ti3O12是典型的层状钙钛矿结构铁电材料,具有优良的压电、铁电、热释电和电光等性能,可广泛应用于铁电存储器、压电和电光等器件.本文在硅衬底上利用溶胶凝胶法制备出Bi4 Ti3O12铁电薄膜,并且对其性能进行了研究.测量不同退火温度下得到的Ag/BTO/p-Si结构的C-V曲线,结果表明Bi4 Ti3O12薄膜在合适的制备工艺下可望实现极化型存储.     

Sol-Gel工艺Si基Bi4 Ti3 O12铁电薄膜制备与晶相结构研究

采用Sol-Gel工艺制备了Si基Bi4TiO12铁电薄膜.研究了退火温度、退火时间、薄膜厚度等对薄膜晶相结构的影响.研究表明,退火温度对Si基Bi4Ti3O12铁电薄膜晶相结构的影响最为显著,而且随退火温度升高,Bi4Ti3O12薄膜更趋向于沿c-轴取向的生长;退火时间在30分钟内对薄膜晶相结构的影响比较明显;薄膜厚度及30分钟以上的退火处理对薄膜晶相结构的影响不大.     

Preparation, dielectric and ferroelectric properties of Pb5Ge3O11 and Pb5Ge2.85Si0.15O11 thin films fabricated by sol-gel process

Lead germanate-silicate (Pb₅Ge_2.85Si_0.15O₁₁) ferroelectric thin films were successfully fabricated on Pt/Ti/SiO₂/(100)Si substrates by the sol-gel process. The thin films were fabricated by multi-coating at preheating temperatures of 350 and 450 °C. After annealing the thin films at 600 °C, the films exhibited c-axis preferred orientation. The degree of c-axis preferred orientation of the thin films preheated at 350 °C was higher than that of films preheated at 450 °C. Grain growth was influenced by the annealing time. The thin films exhibited a well-saturated ferroelectric P-E hysteresis loop when preheated at 350 °C and annealed at 600 °C for 1.5 h. The values of the remanent polarization (Pr) and the coercive field (Ec) were approximately 2.1 μC/cm² and 100 kV/cm, respectively.     

Microstructure and ferroelectric properties of compositionally graded Nd-doped Bi4Ti3O12 thin films prepared by sol–gel method

The compositionally graded Bi_4?xNd_xTi₃O₁₂ (BNT) thin films were prepared on Pt/Ti/SiO₂/Si substrates by sol–gel method. Their microstructure, ferroelectric and dielectric properties were investigated. The single-phase upgraded and downgraded BNT films were obtained with (117) preferred orientation. Compared to the homogeneous BNT films prepared by the same conditions, the remanent polarization (P _r) and permittivity (ε _r) of compositionally graded BNT films were significantly enhanced. The upgraded BNT film showed larger 2P _r (34.9?μC/cm²) and ε _r (509), and those of downgraded BNT film were 29.4?μC/cm² and 505. Bi element in the downgraded BNT film accumulated near the interface of film/Pt bottom electrode, which deteriorated the compositional gradient and resulted in decreasing 2P _r and ε _r compared to the upgraded BNT film.