铜导线一次短路熔痕显微组织再结晶过程

采用定性模拟试验制备铜导线一次短路熔痕,用金相检验、硬度测试、扫描电镜分析等方法研究了不同受热条件下一次短路熔痕显微组织的变化规律。结果表明：铜导线一次短路熔痕形成后持续受热,显微组织存在再结晶现象;当熔痕的受热温度为800℃,保温时间为100 min时,胞状晶全部转变为柱状晶。     

电气火灾事故材料失效分析(2案例)

铜、铝导线无论是火灾热作用还是短路高温熔化,均能查找到能代表当时环境特征的残留熔痕.应用金相法对某125型摩托车左前侧支架熔痕及棕榈厂多股铝芯电线熔痕进行鉴定分析,从铜、铝导线上的火烧熔珠和直接短路熔珠的不同金相组织的变化特征,鉴别其熔化原因与火灾起因的关系,确认该两起火灾事故均为导线一次短路引起.     

用金相显微技术鉴别一次短路熔痕和二次短路熔痕

当已经判明了火灾现场中的导线熔痕是短路造成的,鉴别熔痕是一次短路熔痕还是二次短路熔痕,可以为分析火灾原因提供准确的依据,单靠以往经验的外观鉴定,有时很难区分二者。本文将利用金相显微技术,来鉴别铜导线的一次短路熔痕和二次短路熔痕。     

消防射水对导线二次短路熔痕的影响分析

在进行二次短路熔痕的过程中,由于熔珠形成条件的不同,得到不同的金相组织变化的规律,从中找到了有关铜导线二次短路熔珠在消防射水影响之下形成的金相组织与国家标准的熔珠显微组织特征相同,并进行了细致的分析,并找到了与国家标准熔珠显微相同的原因。     

Q345R表面钛涂层的激光熔覆制备及显微组织研究

本文以采用铜为过渡层、表面激光熔覆钛涂层的Q345R钢板为研究对象,研究了各层凝固组织、结合界面显微组织、元素扩散行为及显微硬度,阐明了两个结合界面处显微组织及元素扩散行为的差异。研究发现,钛层组织为均匀分布的单一柱状树枝晶,与前一条熔覆轨迹交界处为不具备明显方向性的树枝晶,近界面处形成细小而紧密的等轴树枝晶。铜层中部区域的显微组织为典型柱状树枝晶,在铜/钢结合界面铜侧,显微组织表现为垂直于界面的细小树枝晶向细小等轴树枝晶的过渡,细小等轴树枝晶垂直方向的厚度约为20 μm。由于激光熔覆过程中强烈的热量影响,钢层存在明显的热影响区,该区域组织发生了重结晶或不完全重结晶,组织由粒状贝氏体、细小的铁素体和珠光体组成。远离界面处组织为典型的铁素体和珠光体组织,呈现带状分布。钛/铜结合界面存在熔合区,并存在显著的元素扩散行为,而铜/钢结合界面不存在熔合区,Cu、Fe元素在铜/钢结合界面处的含量急剧变化,扩散距离约为1~2 μm。显微硬度方面,结合界面的硬度实现了两侧材料硬度的过渡,有效避免了界面微裂纹的产生。     

低压等离子喷涂316L等轴晶涂层及其性能研究

为研究低压等离子喷涂等轴晶涂层组织性能和形成机理,采用大气等离子喷涂（APS）和低压等离子喷涂（LPPS）,分别制备了316L不锈钢涂层.利用金相显微镜,X射线衍射和显微硬度等方法,分析了2种涂层的金相组织、相结构、显微硬度和耐蚀性.结果表明：一定条件下制备的低压等离子喷涂SUS316L不锈钢涂层明显不同于传统大气等离...     

等离子束熔覆铁基合金涂层的组织与性能研究

利用等离子熔覆技术,在钢基体表面熔覆了一层铁基合金,获得了与基体呈冶金结合的、性能良好的涂层;采用金相显微镜对熔覆层的组织进行观察,发现熔覆层整体组织由柱状树枝晶向等轴晶转变,无气孔、夹杂,其中枝晶组织粗大,等轴晶组织细小;利用显微硬度计分析表明,熔覆层具有较高的硬度,并且由表面到基体呈梯度分布;磨损试验结果表明熔覆层的耐磨性是淬火45钢的2.56倍.     

高镁铝合金在喷射成形过程中显微组织的变化

研究了高镁铝合金在喷射成形过程中显微组织的变化.沉积态高镁铝合金基体呈全部等轴晶组织并存在少量显微孔洞是沉积态组织的主要特征.分析了等轴晶组织和显微孔洞在喷射成形中生成的机制.     

火场中铝导线熔痕的微观形貌分析

利用扫描电子显微镜对铝导线熔痕的微观形貌进行了观察和分析,发现铝导线的一次短路、二次短路和火烧熔痕的微观形貌分别具有相应的特征和规律,利用微观形貌的区别可以鉴别铝导线熔痕的形成原因。     

管线钢在役焊接热影响区显微组织的热模拟研究

为探讨在役焊接这种严酷的焊接条件下管线钢焊接热影响区显微组织的变化,采用焊接热模拟技术、金相分析及透射电镜对比研究了X70管线钢在役焊接热影响区和常规焊接热影响区的金相组织和精细结构.结果表明,在役焊接的快速冷却只对粗晶区的金相组织产生了较大影响,而对过渡区、细晶区和类母材区的金相组织几乎没有影响.金相显微镜下两者粗晶区的组织均为贝氏体铁素体和粒状贝氏体,但各组织的形态和数量不同.在透射电镜下观察,两者粗晶区的精细结构有较大差异,在役焊接粗晶区生成了少量细小的横穿贝氏体铁素体板条的板条马氏体,常规焊接粗晶区生成了少量的块状铁素体组织.     

热得快火灾物证鉴定方法的研究

模拟热得快正常使用、通电过热、正常使用后受火灾作用和通电过热后受火灾作用,获得在不同试验条件下的热得快火灾残留物.用扫描电镜对热得快火灾残留物中的电热丝显微形貌进行了观察.结果表明,在不同试验条件下,电热丝的显微形貌有明显的不同.因此,利用扫描电镜,观察热得快电热丝的显微形貌,可以直观、快速地鉴别热得快在火灾前所处的状态,为热得快火灾原因的认定提供了一种新的技术方法.     

Detailed investigation of ultrasonic Al–Cu wire-bonds: I. Intermetallic formation in the as-bonded state

Scanning and transmission electron microscopy were used to study intermetallic formation and the interface morphology in copper wire-bonds. The ends of copper wires were melted in air and in a protective environment to form wire-balls. The protective environment enabled formation of symmetrical and relatively defect-free copper balls, together with a smaller heat affected zone (in comparison with wires melted in air). Detailed morphological and compositional characterization of the Al–Cu as-bonded interface was conducted using scanning and transmission electron microscopy, on specimens prepared by focused ion beam milling. Discontinuous and non-uniform intermetallics were found in regions where high localized stress was introduced during the wire-bonding process. The main intermetallic phase was found to be Al₂Cu.     

Preparation and Properties of Plasma Spraying Cu-Al2O3 Gradient Coatings

In order to overcome the limitations of low adhesion strength and poor thermal-shock resistance of pure ceramic coatings, Cu-Al2O3 gradient coatings were fabricated by plasma spraying. The microstructure and distribution of Cu-Al2O3 gradient coatings were analyzed. The adhesion strength, thermal-shock resistance and porosity of the coatings were tested. The results show that the composition of the gradient coatings has a gradient distribution along the thickness of coatings. As copper has a relatively low melting point and the molten copper has good wettability on the surface of Al2O3, it can be melted sufficiently and could fill the interstices and pores among the spraying particles effectively, thus improves the adhesion strength, thermal shock resistance and reduces the porosity. The adhesion strength of the gradient coating is 15.2 MPa which is two times of that of the double-layer structure coating.     

图案化金属铜纳米线阵列的制备与表征

采用紫外线光刻技术与电化学沉积相结合的方法,成功制备了不同图案的铜纳米线阵列:一种是圆形图案;另一种是QDU图案.首先利用紫外线光刻技术在多孔阳极氧化铝模板(AAO)生成预设图案,以此作为"二次模板";再利用电化学方法将铜纳米线沉积到"二次模板"的开孔中.扫描电镜(SEM)测试结果表明,大面积、高规整的铜纳米线图案阵列各自独立地立在基底上, 同时,用电子能谱(EDS)分析了铜纳米线的化学成分.透射电镜(TEM)也探测到了铜纳米线的微结构.     

Microstructure development in Nb3Sn(Ti) internal tin superconducting wire

The authors have studied the phase formation sequences in a Nb₃Sn ‘internal tin’ process superconductor. Heat treatments were performed to convert the starting materials of tin, Ti–Sn, copper and niobium, to bronze and Nb₃Sn. Specimens were quenched at different points of the heat treatment, followed by metallography to identify the phases present and X-ray microtomography (XMT) to investigate the void volume and distribution. An unexpected observation of the microstructure development was the uphill diffusion of tin during the Cu–Sn reactive diffusion. Some defects likely to affect the superconducting performance of the wires were observed. Microscopy revealed the presence of a Ti–Sn intermetallic compound displacing the niobium filaments, and XMT revealed the formation of long pores in the longitudinal direction. Two types of pore formation mechanism, in addition to Kirkendall pores, are proposed. The phase and microstructure development suggests that low-temperature heat treatment (below 415 °C) will have significant influence on optimising the final superconducting properties.     

Effect of Transverse Grain Boundary on Microstructure,Texture and Mechanical Properties of Drawn Copper Wires

In the present study, microstructure and texture of drawn copper wires with a large number of transverse grain boundaries have been characterized and their mechanical properties have been analyzed. The results show that the texture evolution is accelerated by transverse grain boundary and the saturation value 60% of volume fraction of 〈111〉 fiber texture component is reached rapidly with increasing strain. For the microstructure of drawn wires with a large number of transverse grain boundaries, the critical strain, where lamellar boundaries form, is less than that for wires with equiaxed grains or columnar grains （all grain boundaries parallel to axis direction）. Since transverse grain boundary accelerates grain subdivision and dislocation density increases rapidly in drawn wires with a large number of transverse grain boundaries, there are a higher flow stress and a higher work hardening rate.     

渗铜量对颗粒强化铁基材料显微组织的影响

采用烧结-熔渗和后续热处理工艺制备了Co-Cr-Mo-Si颗粒强化的铁基粉末冶金材料,利用光学显微镜、扫描电镜和能谱分析技术,研究了不同渗铜量对材料显微组织的影响.研究表明:Co-Cr-Mo-Si硬颗粒单独存在于基体中,起颗粒强化的作用;未渗铜时,孔洞多,硬颗粒与基体界面清晰可见,结合强度差,随着渗铜量的增多,合金元素扩散程度提高,硬颗粒与基体界面结合强度好;材料的孔隙度减小,碳化物弥散分布程度提高;采用熔渗工艺并合理控制渗铜量,可获得组织均匀化、各相界面结合较好的铁基粉末冶金材料.     

铜包钢线材室温拉变形后的显微组织和力学性能

研究了经室温拉变形后的纯铜包覆Q195钢的不同线径的线材的显微组织及力学性能.结果表明,显微组织自原始的等轴晶变为细长条纤维状,纤维长度与形变量的平方近似地成正比,纤维直径与形变量近似地成反比.经室温拉变形的包覆线材的抗拉强度,随形变量增大而增大,与形变量平方根呈直线关系;但延伸率降低,延伸率波动偏高与晶界融合及Q195钢的渗碳体球化现象吻合.根据原始纯铜和Q195钢的抗拉强度值,可以用复合材料强度的混合法则来近似地预测不同线径的包覆线材的抗拉强度.     

Fabrication of uniform Al-Pb-Bi monotectic alloys under microgravity utilizing the Space Shuttle: microstructure and superconducting properties

Al-Pb-Bi monotectic alloys with three different compositions were melted and solidified under a microgravity environment in the Space Shuttle. The (Pb, Bi) particles were dispersed uniformly in the aluminium matrix, while evident sedimentation was observed in the reference sample processed under 1 G. Slow cooling was also effective to obtain homogeneous microstructure because of the absence of Marangoni force. The alloys were cold-worked into wires and the superconducting properties of the wires were investigated. The distance between (Pb, Bi) fibres for the alloys prepared under microgravity was so small that the wires showed complete zero resistance below 9 K due to the proximity effect.