蓝宝石衬底的ECR等离子体清洗与氮化的RHEED研究

通过分析RHEED(反射高能电子衍射)图像研究了ECR(电子回旋共振)等离子体所产生的活性氢源和氮源对蓝宝石衬底的清洗与氮化作用,结果表明:在ECR氢等离子体中掺入少量的氮气可以明显提高蓝宝石衬底的清洗效果,从而获得平整而洁净的衬底表面;而采用ECR氮等离子体对经过氢氮混合等离子体清洗20min后的蓝宝石衬底进行氮化,能观测到最清晰的氮化铝成核层的RHEED条纹,且生长的GaN缓冲层质量是最好的.     

蓝宝石衬底的ECR等离子体清洗与氮化的RHEED研究

通过分析RHEED(反射高能电子衍射)图像研究了ECR(电子回旋共振)等离子体所产生的活性氢源和氮源对蓝宝石衬底的清洗与氮化作用,结果表明:在ECR氢等离子体中掺入少量的氮气可以明显提高蓝宝石衬底的清洗效果,从而获得平整而洁净的衬底表面;而采用ECR氮等离子体对经过氢氮混合等离子体清洗2 0 min后的蓝宝石衬底进行氮化,能观测到最清晰的氮化铝成核层的RHEED条纹,且生长的Ga N缓冲层质量是最好的     

蓝宝石衬底分步清洗及其对后续氮化的影响

通过反射高能电子衍射仪(RHEED)分析蓝宝石衬底在经过双热电偶校温的ECR-PEMOCVD装置中清洗氮化实验表面晶质的RHEED图像,研究了常规清洗和ECR等离子体所产生的活性氢氮等离子体源对蓝宝石衬底清洗、氮化的实验.结果表明,经常规清洗后的蓝宝石衬底表面晶质差异较大,有些衬底再经通常的30min等离子体清洗是达不到要求的,而要根据情况施行分步清洗才能清洗充分,清洗充分的衬底经20min就可氮化出来,不充分的再长的时间也很难氮化.     

标准温度和衬底分步清洗对GaN初始生长影响RHEED研究

在经过校温的ECR-PEMOCVD装置上，通过分析RHEED(反射高能电子衍射)图像研究了常规清洗和ECR等离子体所产生的活性氢氮等离子体源对蓝宝石衬底进行清洗、氮化实验，结果表明：经常规清洗的蓝宝石衬底的表面晶质差异很大；按照经验清洗30min是不能清洗充分的，那么根据情况进行多步清洗就显得很重要了；结果表明清洗得很充分的衬底经20min的氮化出来，而未清洗充分的衬底20min或更长的时间是不能氮化出来的。     

外延GaN基薄膜表面晶体结构RHEED图像研究

论述了反射高能电子衍射(RHEED)作为外延薄膜进行原位监测的一个重要手段以及RHEED图像与外延薄膜的表面形貌的关系,提出了以RHEED图像分析外延GaN基薄膜晶格结构的演变情况,并从衬底α-Al2O3的等离子体清洗、氮化进行了具体的分析和演算.结论指出,RHEED不仅是进行外延薄膜原位监测,而且还可以作为分析外延薄膜晶体结构演变的一个有力手段.     

GaN的ECR-PEMOCVD生长中衬底清洗和氮化的分析

在改进的电子回旋共振(ECR)等离子体增强金属有机物化学汽相沉积(ECR-PEMOCVD)装置(ESPD-U)中,以氮等离子体为氮源,三乙基镓(TEG)为镓源,在蓝宝石(α-Al2O3)衬底上生长氮化镓(GaN)薄膜.在不同的温度、氮氢流量下,分别对α-Al2O3衬底进行等离子体清洗和氮化,并用RHEED实时监测.通过对RHEED图像的分析,得出衬底清洗和氮化的最佳条件.     

ZnO薄膜的结构特征及光学性能评价

利用金属有机物化学气相沉积(MOCVD)方法在Al2O3(0001)衬底上生长ZnO薄膜,通过改变衬底温度及生长舱压力,得到了各种不同表面形貌的ZnO薄膜.扫描电镜(SEM)用来对样品的形貌进行观察,当衬底温度及生长舱压力分别为400℃,40Pa和450℃,8Pa时,得到了纳米管及纳米墙结构.利用X射线衍射谱(XRD)、透射光谱及光致发光谱对样品的结构及光学性能进行评价.实验结果证明对于较高的生长温度和较低的生长舱压力所生长的样品具有较好的结晶质量.     

[(BaTiO3)m/(SrTiO3)m]n超晶格生长的RHEED实时研究

利用反射高能电子衍射(RHEED)，研究了在SrTiO3(100)基片上采用激光分子束外延法生长的[(BaTiO3)m／(SrTiO3)m]n超晶格薄膜的生长特性。观察到清晰明亮的反射高能电子衍射花样及富有周期性的RHEED振荡曲线，制备的超晶格呈现良好的结晶层状外延生长，薄膜表面及界面的平整度很好。     

ZnO薄膜和量子阱的生长及光学特性

研究了用MOCVD法在蓝宝石(Al2O3)(0001)和(1120)衬底上制备ZnO薄膜时的生长特性.详细研究了采用Al2O3(0001)衬底时生长温度与压力的影响.由于存在比较大的晶格失配,一般容易得到ZnO纳米结晶,不容易获得既平坦且质量又好的ZnO薄膜.生长温度对薄膜-衬底界面的生长模式有很大的影响;而生长压力对ZnO纳米结晶的形状有决定性作用.通过适当控制生长温度及压力,可以得到ZnO薄膜或不同形状的纳米结构.当采用Al2O3(1120)衬底时,由于晶格失配较小,能保持平坦层状生长,临界膜厚远远大于采用Al2O3(0001)衬底的结果.在Al2O3(1120)衬底上制作了ZnO/MgZnO量子阱并研究了其光学特性.观察到了量子化能级间以及在载流子间的跃迁引起的发光.由压电效应引起的内建电场约为3×105V/cm.同时发现采用低温低压生长可以增大ZnO中受主杂质浓度,有利于获得p型ZnO.     

ECR-PEMOCVD生长GaN RHEED图像研究

通过在自制的电子回旋共振等离子体增强金属有机物化学气相沉积 (ECR -PEMOCVD)系统上装配反射高能电子衍射仪 (RHEED) ,对外延GaN生长过程进行原位监测。通过分析研究RHEED图像确定衬底清洗、氮化、缓冲层生长、外延层生长的合适条件     

采用ECR-PEMOCVD方法进行立方和六方GaN单晶薄膜生长的准热力学模型和相图

基于热力学平衡理论,对在电子回旋共振等离子体增强金属有机化学气相沉积系统中的GaN薄膜生长给出了一个化学平衡模型.计算表明,GaN生长的驱动力Δp是以下生长条件的函数:Ⅲ族输入分压,输入Ⅴ/Ⅲ比,生长温度.计算了六方和立方GaN的生长相图,计算结果和我们的实验结果显示出一定的一致性.通过分析,解释了高温和高Ⅴ/Ⅲ比生长条件适合六方GaN的原因.上述模型可以延伸到用于GaN单晶薄膜生长的类似系统中.     

Low-temperature ECR-PEMOCVD deposition of high-quality crystalline gallium nitride films: A comparative study of intermediate layers for growth on amorphous glass substrates

A low temperature growth method based on an electron cyclotron resonance plasma-enhanced metal organic chemical vapor deposition system (ECR-PEMOCVD) was proposed for the growth of GaN (Gallium nitride) films on ordinary amorphous soda-lime glass substrates. To alleviate the large lattice mismatch between GaN film and glass substrate and improve the heat dissipation performance for potential optoelctrical device application, five intermediate layers (Cu, Ni, Ti, Ag, and ITO) were deposited on the glass substrate before the growth of GaN. A comparative study was performed through structural analysis of the as-grown GaN films with various intermediate layers investigated by means of in-situ reflection high energy electron diffraction (RHEED), X-ray diffraction (XRD), and atomic force microscopy (AFM). The results indicate that the Ti intermediate layer has a great advantage over other intermediate layers in view of crystalline quality and smooth surface, therefore is more suitable and preferred for the potential application in optoelectronic devices.     

氮气流量对玻璃衬底上低温沉积GaN薄膜结晶性的影响

采用电子回旋共振-等离子体增强金属有机物化学气相沉积（ECR-PEMOCVD）技术,在康宁7101型普通玻璃衬底上沉积了高度c轴择优取向的多晶GaN薄膜. 利用反射高能电子衍射（RHEED) , X射线衍射 (XRD) 对样品进行检测,研究了在低温（430℃）沉积中氮气流量对GaN薄膜结晶性的影响. 并且利用原子力显微镜 (AFM) 和室温光致发光 (PL) 谱研究了薄膜的表面形貌和发光特性,发现薄膜表面形貌较为平整,其发光峰由较强的紫外近带边发光峰和极其微弱的绿光发光峰组成.     

Mitigative Tin Whisker Growth Under Mechanically Applied Tensile Stress

Sn whisker/hillock growth is a result of the release of compressive stress in a Sn thin film. Filamentary Sn whiskers were formed on an electrodeposited Sn thin film aged at room temperature, while Sn hillocks were formed as the aging temperature was raised to 80°C and 150°C. By mechanically applying a tensile stress on the Sn thin film, the growth of the Sn whisker/hillock was significantly mitigated. This mitigation growth suggests that part of the compressive stress in the Sn thin film was neutralized by the mechanically applied tensile stress.     

磁控溅射法生长CeO2/Si薄膜及其发光性质

利用反应磁控溅射法对CeO2薄膜的生长规律进行了研究. 通过实验发现，溅射时氧气和氩气的比例对薄膜的成分和晶体质量有很大影响. 在室温下测试了CeO2薄膜的PL谱，结果表明CeO2薄膜的发光主要来自于氧缺陷.     

CdTe/GaAs(111)B薄膜的MBE生长研究

采用分子束外延方法,在GaAs(111)B衬底上,生长CdTe薄膜,以求研制出用于液相外延生长碲镉汞(HgCdTe)薄膜的CdTe/GaAs(111)B复合衬底.通过理论分析和实验探索,优化了生长温度和Te/Cd束流比等重要生长参数,获得了质量较好的CdTe薄膜,再通过循环热处理,使CdTe/GaAs(111)B复合衬底的质量得到进一步的提高,X-射线回摆曲线半峰宽(FWHM)有明显的降低.为LPE-HgCdTe薄膜的生长打下了较好基础.     

LSAT(111)衬底上ZnO单晶薄膜的分子束外延生长

利用射频等离子体辅助分子束外延技术,在LSAT(111)衬底上制备高质量ZnO单晶薄膜.研究了衬底表面预处理及生长温度对ZnO外延膜的生长过程、外延取向关系以及表面形貌的影响.发现在较低温度下生长ZnO时,薄膜中容易形成30. 旋转畴,而在较高温度下,可完全消除薄膜中的旋转畴,得到具有单一畴的ZnO单晶薄膜，讨论了旋转畴的起源以及生长温度对于消除旋转畴的作用.锐利的3×3 RHEED图像验证了ZnO薄膜具有O极性     

Influence of substrate temperature on the deposition and structural properties of μc-Si: H thin films fabricated with VHF-PECVD

With in situ optical emission spectroscopy (OES) diagnosis on VHF-generated H₂+SiH₄ plasmas, and with the measurements of deposition rate and structure of μc-Si: H thin films fabricated with VHF-PECVD technique at different substracte temperature, influence of substrate temperature on the deposition of μc-Si: H thin film and on its structural properties have been investigated. The results show that with the increase of substrate temperature, the crystalline volume fraction Xc and average grain size d are enhanced monotonously, but the deposition rate increases firstly and then decreases. The optimized substrate temperature for (μc-Si: H thin films deposition under our current growth system is about 210 °C, at which deposition rate 0.8 nm/s of μc-Si: H thin film with Xc?60% and d?9 nm can be obtained.     

Films surface temperature calculation during growth by sputtering technique

A calculation of film surface temperature during thin films growth by sputtering technique is proposed. The calculation procedure is based on the conversion into heat of the total flux energy of species impinging the film surface during growth. The results indicate that the film''s surface temperature depends drastically on material substrate thermal conductivity and thickness on one hand, and the plasma conditions namely the discharge power on the other. The predicted film surface temperatures were used to explain the microstructure evolution of hydrogenated amorphous silicon (a-Si:H) thin films deposited by reactive radio frequency (RF) sputtering on different substrates.