蓝宝石基片的单面研磨工艺研究

为了实现蓝宝石基片的快速平坦化,对蓝宝石基片进行系统的单因素单面研磨试验,研究了磨料种类、磨料粒径、研磨盘转速、研磨压力以及磨料质量分数等研磨工艺参数对蓝宝石基片材料去除率和表面粗糙度的影响规律。试验结果表明:金刚石磨料适合蓝宝石基片的单面研磨;随着磨料粒径的增大,材料去除率逐渐增大,表面越来越粗糙;随着研磨盘转速的增大,材料去除率先增大后减小,表面粗糙度值在20～60 r/min区间变化不大,稳定在Ra 0. 12～Ra 0. 13μm之间,而在60～100 r/min区间波动较大,当研磨盘转速为60 r/min时,材料去除率最大;随着研磨压力的增大,材料去除率逐渐增大,而表面粗糙度值越来越低;随着磨料质量分数的增大,材料去除率先增大后减小,表面粗糙度先增大然后趋于平缓,当磨料质量分数为3 wt%时,材料去除率最大,且表面粗糙度值相对较小;最后通过正交试验优化了工艺参数,在优化的工艺条件下依次选用粒径为W40、W14、W3的金刚石磨料对蓝宝石基片进行粗研、半精研及精研,取得了表面粗糙度为Ra 7. 9 nm的平坦表面。     

SrTiO3陶瓷基片集群磁流变研磨加工表面特性研究

采用集群磁流变效应研磨加工工艺进行SrTiO3陶瓷基片研磨加工,分析了研磨盘材料、磨粒种类、研磨压力和磨粒团聚等因素对SrTiO3陶瓷基片表面粗糙度和表面完整性的影响。 结果表明:磁流变效应研磨工作液中的SiC、Al2O3和CeO2等磨料的大尺寸磨粒在SrTiO3陶瓷基片研磨加工表面产生的局部大尺寸划痕破坏了加工表面的完整性;采用铸铁研磨盘和SiO2磨料的磁流变研磨工作液研磨加工后,原始表面粗糙度Ra从约1.7854μm下降到0.6282μm,并且表面完整,SrTiO3材料与SiO2磨料之间存在的化学机械研磨过程促进了研磨加工表面性能的改善;研磨压力也是影响研磨加工表面粗糙度和大尺寸划痕的主要因素之一,研磨压力取较小值(1.875kPa）为宜。      

氮化硅陶瓷球化学机械抛光机理的研究

为探究氮化硅陶瓷球化学机械抛光过程及磨料与工件材料的相互作用规律,选用四种不同的磨料对氮化硅陶瓷球进行了抛光实验。通过对抛光后表面粗糙度的检测,讨论了不同种类磨料对工件表面粗糙度的影响。利用SEM观测工件表面形貌,探讨了不同磨料对工件的材料去除方式。采用X射线衍射技术分析了水基CeO2磨料抛光氮化硅陶瓷球后工件表面的化学反应生成物,对化学机械抛光的热力学分析进行了验证,分析了其化学机械作用过程。结果表明,CeO2是抛光氮化硅陶瓷球非常有效的一种磨料,利用水基CeO2抛光液对氮化硅陶瓷球进行化学机械抛光,获得了表面粗糙度Ra为4nm的光滑表面。     

陶瓷球材料性能和显微结构对其磨削加工的影响

通过试验探索了氧化锆、氧化铝、氮化硅和碳化硅四种陶瓷球材料的性能和显微结构对加工效果的影响;采用扫描电镜观察了研磨后球的表面特征.结果表明:在相同的研磨条件下,具有长柱状晶粒的氮化硅陶瓷球加工速率最低,但圆度和表面粗糙度最容易控制;氧化锆和氧化铝陶瓷球表面质量次之,碳化硅陶瓷球加工速率最高,圆度和表面粗糙度最难控制.     

高精度氮化硅陶瓷球批量加工研磨工艺研究

为解决高精度氮化硅陶瓷球批量研磨加工的问题,将超精密研磨技术应用到氮化硅陶瓷球的加工实验中.开展了研磨过程的分析,建立了不同研磨阶段陶瓷球球度、表面质量及材料去除率与所选不同大小粒度磨料之间的关系,并提出了对比分析的方法,在通过专业设备检测的基础上对成品球球度、表面粗糙度和振动值进行了评价.研究结果表明,氮化硅陶瓷球能够批量生产且球度达到0.062μm以下,表面粗糙度达到1.48 nm以下,振动值达到24 dB以下,实现了批量生产G3级氮化硅陶瓷球的目的.     

止推气浮轴承工作表面的研磨抛光工艺

介绍了设计的止推气浮轴承的结构和工作原理,针对该轴承的工作表面要求达到镜面效果的难题,设计了止推气浮轴承工作表面的研磨与抛光工艺,对研抛过程中的研磨盘转速、研抛压力、磨料种类及粒度等工艺参数进行了单因素试验分析,得到了一组适合止推气浮轴承工作表面研磨抛光的优化组合参数。     

新型研磨垫对单晶氧化镓研磨的实验研究

为抑制氧化镓晶片在研磨过程中的解理现象,通过NAKAMURA的方法,重新设计、研制一种黏弹性固着磨料新型研磨垫对氧化镓晶片进行研磨实验研究,对比分析其与传统铸铁研磨盘对单晶氧化镓研磨的材料去除率和表面质量的影响规律,结果表明:在同一研磨参数下,采用铸铁盘研磨时,晶片材料去除率较高,为358 nm/min,研磨后晶片表面粗糙度Ra由初始的269 nm降低到117 nm,降幅仅为56. 5%;而采用新型研磨垫研磨时,其材料去除率虽较低,为263nm/min,但研磨后晶片表面粗糙度Ra却降低至58 nm,降幅达到78. 4%,晶片表面质量得到明显提高,为后续氧化镓晶片的抛光奠定了良好的基础,因而新型研磨垫更适合对氧化镓进行研磨。同时,也为氧化镓晶片研磨提供了参考依据。     

聚晶金刚石复合片镜面加工工艺优化研究

针对聚晶金刚石复合片精加工后需达到镜面级表面的指标要求,基于正交试验法优化聚晶金刚石复合片精加工工艺参数,采用极差分析法处理试验数据,并绘制试验指标与各试验因素间的关系曲线图,得出了各因素对表面粗糙度的影响规律,并以此为基础优化工艺参数,进行聚晶金刚石复合片镜面加工工艺优化研究。研究表明:抛光盘转速和研抛时间对工件表面粗糙度影响较大,各因素对表面粗糙度的影响程度按从大到小的顺序依次为:抛光盘转速、研抛时间、研抛压力和抛光液磨料粒度。采用优化后的最优工艺参数组合进行加工试验,当研抛压力为90 kPa、抛光盘转速为1 200 r/min、抛光液磨料粒度为1μm、研抛时间为30 min时,得到了表面粗糙度Ra为0.019μm的质量表面,达到了聚晶金刚石复合片镜面加工(Ra0.02μm)的效果。     

固结磨料研磨的材料去除率建模及仿真研究

通过对固结磨料研磨过程作适当简化和假设,在磨粒尺度下,依据磨粒的受力平衡条件,建立工件的材料去除率模型,并用MATLAB软件进行数值模拟,分析影响固结磨料研磨材料去除率的因素,得出结论:固结磨料研磨的材料去除率分别与磨料粒度、研磨外加载荷的二分之三次方及工件与研磨盘的相对速度呈正比,与磨料的体积分数成反比,因此可以通过增加磨料粒度、外加载荷和研磨盘的转速来提高材料去除率。     

超微粒金刚石和富勒烯研具创建超平滑表面的研究

制备了超微粒金刚石和富勒烯研磨工具,并分别进行了硅片研磨试验,详细分析了两种材料的研磨特性如表面粗糙度的稳定性、磨料粒度对研磨效果的影响以及研磨材料的显微结构等。试验结果表明,使用0~1/8μm粒度的金刚石研具获得的表面粗糙度值大于使用0~1/4μm粒度金刚石研具的表面粗糙度值,这是因为磨粒被粘结剂覆盖所致。研究结果表明,采用富勒烯研具研磨硅片可获得Ra5nm的超平滑镜面。     

Ceramic Response to High Speed Grinding

Material response was investigated with respect to normal grinding forces, surface roughness, and removal mechanisms in grinding of alumina, silicon carbide, silicon nitride, and zircona with a resin-bond 160 μm grit diamond wheel at the grinding speeds of upto 160 m/s. The results reveal that the normal grinding forces decreased significantly with an increase in grinding speed; they also increased substantially with an increase in a complex relation of the ceramic hardness and toughness. High speed grinding produced a reduction in surface roughness for silicon carbide and alumina but gave no improvement for zirconia and silicon nitride. Also the surface roughness in high speed grinding was found to be material-dependent that the ground silicon nitride exhibited much smoother than the other ground ceramics. The influence of grinding speed on material removal mechanisms was analyzed in terms of grinding geometry and ceramic material properties.     

Effect of extrusion pressure and number of finishing cycles on surface roughness in magnetorheological abrasive flow finishing (MRAFF) process

Magnetorheological abrasive flow finishing (MRAFF) was developed as a new precision finishing process for complicated geometries using smart magnetorheological polishing fluid. This process introduces determinism and in-process controllability of rheological behaviour of abrasive laden medium used for finishing intricate shapes. Magnetorheological polishing (MRP) fluid is comprised of carbonyl iron powder and silicon carbide abrasives dispersed in a viscoplastic base of grease and mineral oil and exhibits change in rheological behaviour in presence of external magnetic field. This smart behaviour of MRP fluid is utilized to precisely control finishing forces. The process performance in terms of surface roughness reduction depends on process variables like hydraulic extrusion pressure, magnetic flux density in the finishing zone, number of finishing cycles, and composition of MRP fluid. In the present work, experiments were conducted on a hydraulically powered MRAFF experimental setup to study the effect of extrusion pressure and number of finishing cycles on the change in surface roughness of stainless steel grounded workpieces. A new observation of “illusive polishing” action with the initial increase in number of finishing cycles is reported. The actual finishing action is possible only after removal of initial loosely held material remaining after grinding.     

集群磁流变变间隙动压平坦化加工试验研究

为了提高光电晶片集群磁流变平坦化加工效果,提出集群磁流变变间隙动压平坦化加工方法,探究各工艺参数对加工效果的影响规律。以蓝宝石晶片为研究对象开展了集群磁流变变间隙动压平坦化加工和集群磁流变抛光对比试验,通过检测加工表面粗糙度、材料去除率,观测加工表面形貌、集群磁流变抛光垫中磁链串受动态挤压前后形态变化,研究挤压幅值、工件盘转速、挤压频率以及最小加工间隙等工艺参数对加工效果的影响规律。试验结果表明：集群磁流变平坦化加工在施加工件轴向微幅低频振动后,集群磁流变抛光垫中形成的磁链串更粗壮,不但使其沿工件的径向流动实现磨粒动态更新、促使加工界面内有效磨粒数增多,而且在工件与抛光盘之间的加工间隙产生动态抛光压力、使磨粒与加工表面划擦过程柔和微量化,形成了提高材料去除效率、降低加工表面粗糙度的机制。对于2英寸蓝宝石晶电（1英寸=2.54 cm）集群磁流变变间隙动压平坦化加工与集群磁流变抛光加工效果相比,材料去除率提高19.5%,表面粗糙度降低了42.96%,在挤压振动频率1 Hz、最小加工间隙1 mm、挤压幅值0.5 mm、工件盘转速500 r/min的工艺参数下进行抛光可获得表面粗糙度为Ra0.45 nm的超光滑表面,材料去除率达到3.28 nm/min。证明了集群磁流变变间隙动压平坦化加工方法可行有效。     

Cu-3镍铜合金砂带磨削试验研究

分析了Cu-3镍铜合金砂带磨削加工过程中,砂带粒度和磨削用量的不同对磨削加工效率、工件表面质量和砂带磨损的影响。采用氧化铝磨料砂带在不同的砂带线速度或磨削压力下对镍铜合金进行了工艺试验,对材料去除量、工件表面粗糙度和砂带磨损量进行了测量。研究表明:增加砂带线速度和磨削压力可在一定程度上提高材料去除率和磨削比;随着磨削压力的增大,工件表面粗糙度呈增大趋势;随着砂带粒度的增大,工件表面粗糙度呈减小趋势;砂带线速度为25m/s,磨削压力为43N,砂带粒度为P240时,镍铜合金综合磨削效果最好。     

氮化硅陶瓷镶块低粗糙度磨削的研究

提出氧化铝砂轮磨削陶瓷表面的加工过程是砂轮磨粒与工件表面凸峰的碰撞－碰撞与摩擦共同作用－摩擦抛光。对砂轮速度，工件转速、砂轮横向进给量、光磨次数，陶瓷材料硬度以及切削液等因素对表明粗糙度的影响进行了分析，表明氧化铝砂轮通过挤压和磨削抛光作用使陶瓷工件表面的粗糙度得到显著改善，实现了在普通磨床上对陶瓷材料的高质量加工。     

Predictive Modeling of Surface Roughness in Grinding of Ceramics

The surface roughness represents the quality of ground surface since irregularities on the surface may form nucleation for cracks or corrosion and thus degrade the mechanical properties of the component. The surface generation mechanism in grinding of ceramic materials could behave as a mixture of plastic flow and brittle fracture, while the extent of the mixture hinges upon certain process parameters and material properties. The resulting surface profile can be distinctively different from these two mechanisms. In this article, a physics-based model is proposed to predict the surface roughness in grinding of ceramic materials considering the combined effect of brittle and ductile material removal. The random distribution of cutting edges is first described by a Rayleigh probability function. Afterwards, surface profile generated by brittle mode grinding is characterized via indentation mechanics approach. Last, the surface roughness is modeled through a probabilistic analysis of ductile and brittle generated surface profile. The model expresses the surface finish as a function of the wheel microstructure, the process conditions, and the material properties. The predictions are compared with experimental results from grinding of silicon carbide and silicon nitride workpieces (SiC and Si₃N₄, respectively) using a diamond wheel.     

Nano–level finishing of single crystal silicon blank using magnetorheological finishing process

Magnetorheological finishing (MRF) utilizes magnetorheological (MR) fluid, which consists of magnetic particles, nonmagnetic abrasives, and some additives in water or other carrier to polish the materials. An experimental study is conducted to predict the effect of process parameters (concentration of magnetic particles and abrasive particles, carrier wheel speed, and initial surface roughness) on surface finish and material removal rate in MRF of single crystal silicon blank. The final surface roughness value in terms of arithmetical mean roughness (Ra) obtained is as low as 8 nm from the initial value of 1300 nm. An optimization study is also carried out to find optimum values of process parameters from the selected range.     

氮化硅陶瓷球研磨去除机制试验与仿真研究

为研究研磨过程中氮化硅陶瓷球的材料去除形式及磨损行为,结合陶瓷材料动态压痕断裂力学理论,进行陶瓷球研磨加工试验,采用超景深三维显微镜和扫描电镜对研磨后陶瓷球表面进行观察,同时建立单颗金刚石磨粒冲击作用有限元模型并进行仿真研究。试验结果表明:氮化硅陶瓷球表面材料去除以脆性断裂去除和粉末化去除为主,陶瓷球表面残留有大量贝壳状缺陷和呈簇状随机分布的粉末化材料区域;研磨过程中,陶瓷球表面存在擦伤、划伤和凹坑等缺陷;磨粒冲击作用时,表面材料会受微切削作用产生破碎去除,同时也会受挤压作用产生脆性断裂去除,当磨粒以滚动方式作用在陶瓷球表面时,陶瓷球表面更容易形成粉末化去除,且材料去除率更高。仿真结果表明:各磨粒冲击作用方式产生的最大等效应力由大到小的顺序为滚动磨粒变切深、滚动磨粒定切深、磨粒挤压、滑动磨粒定切深,其中,滚动磨粒变切深产生的亚表面裂纹最深。     

On the mechanism of material removal by free abrasive grinding of glass and fused silica

The dependence of the rate of material removal from glass and fused silica specimens on the carrier fluid used in free abrasive grinding was observed and other abrasion parameters, i.e. surface roughness, bed thickness and drag force, were measured. The similarity between the damage produced by silicon carbide particles during free abrasive grinding and that found after indentation with a sharp point encouraged the formulation of a rotation/ indentation model of abrasion. This semi-quantitative model showed good agreement with the experimental data.