数字水印技术述评

重点介绍了数字水印产生的方法，分析了数字水印技术的模型、典型算法、发展应用和存在的问题，阐述了数字水印技术的研究发展及其应用前景。     

数字水印技术及多媒体信息安全

本文在对数字水印技术的概念、原理、特点及分类等作阐述的基础上分析了数字水印技术的模型及主要算法，并重点介绍了数字水印技术在多媒体信息安全中的应用。最后对数字水印技术的发展做出了展望。     

数字水印技术及在广电行业的应用

对数字水印技术、特点及其在广电行业的应用进行了探讨。首先简单介绍了数字水印技术水印及其特点，其次对在数字媒体中加入和提取数字水印的通用过程和数字视频水印的嵌入和提取方案进行重点介绍，最后对数字水印技术在广电行业的应用进行了探讨。     

基于文本的数字水印嵌入技术的研究

目前数字水印的嵌入技术可以应用于包括文档、声音、图像以及视频在内的各种多媒体数据中，但是针对文本的数字水印嵌入技术研究相对较少。主要介绍当前常用的文本数字水印嵌入的基本模型和方法以及研究状况。首先介绍了文本数字水印的嵌入与检测模型。然后分析了当前文本数字水印的嵌入技术研究出现的问题。     

改进的基于离散小波变换的数字水印技术

提出一种基于离散小波变换静止图像的数字水印技术，探讨了增强数字水印鲁棒性的方法，首先是新的伪随机序列的生成方法，其次是基于马尔可夫随机场（MRF）提出了自适应的水印嵌入手段，最后提出了提高数字水印对几何变换鲁棒性的基于图像配准技术的数字水印提取技术。     

数字水印的应用及需求分析

给出了一个完整的数字图像水印通信系统模型，对其中各个功能模块进行了分析。从应用的角度给出了数字水印的分类方法，给出了包括数字版权保护，数字指纹在内的数字水印技术的几个典型应用，在这些应用环境下对水印算法的具体要求进行了详细的分析。研究具体的数字水印技术的应用及其环境，分析其对数字水印技术的要求，对设计相应的数字水印算法将具有一定指导作用。     

关于数字图像的水印技术

随着多媒体技术和网络技术的广泛应用，对图像、音频、视频等多媒体内容的保护成为迫切需要解决的问题。数字水印技术是目前信息安全领域的一个新方向，是一种可以在开放的网络环境下保护版权和认证来源及完整性的新技术。本文在介绍了数字水印的基本要求的同时，给出了系统的框架，以及数字水印的原理和目前主要的应用领域，并探讨了数字水印的特点及其所受到的各种攻击方式，给出了典型算法，研究水印的嵌入、提取和检测并给出了模型，最后给出数字水印的研究方向。     

数字水印技术:从概念到应用

介绍了数字水印技术的基本概念、应用背景，数字水印技术的基本要求、发展现况与发展方向。并提出一种基于图像特征树量化的数字水印算法，水印信息嵌入在图像的重要特征之中，故对JPEG、JPEG2000压缩以及高斯噪音等多种处理具有较强的鲁棒性。     

数字产品版权认证中心的设计与实现

随着中国知识产权保护力度的加大，知识产权的保护问题受到了越来越广泛的关注。而数字水印技术是二种很好的知识产权的保护技术。现介绍了基于数字水印技术的数字水印认证中心的设计与实现。并介绍了这种崭新的基于J2EE技术的数字水印应用解决方案的背景、应用模式和系统设计等。     

基于扩频CDMA的数字盲水印算法

数字水印技术要求所构造的算法，具有很强的鲁棒性（抗攻击能力）。在数字水印技术中引入扩频技术，提高了数字水印的鲁棒性，但同时却使嵌入信息量减小了。丈中在引入CDMA技术，进一步增强鲁棒性，同时也使嵌入的信息量得到了提高。仿真实验表明：所提出的算法具有很强的鲁棒性、透明性，而且误码率较小，在很强的干扰下，仍能提取出水印。     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Nanoimprint Lithography -A Next Generation High Volume Lithography Technique

IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

Influence of PVK ： NPB hole transporting layer on the characteristics of organic light-emitting devices

A doping system consisting of NPB and PVK is employed as a composite hole transporting layer （CHTL）. By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK ： NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK ： NPB at 1：3.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.     

Analysis of error performance on Turbo coded FDPIM

Due to variable symbol length of digital pulse interval modulation（DPIM）, it is difficult to analyze the error performances of Turbo coded DPIM. To solve this problem, a fixed-length digital pulse interval modulation（FDPIM） method is provided. The FDPIM modulation structure is introduced. The packet error rates of uncoded FDPIM are analyzed and compared with that of DPIM. Bit error rates of Turbo coded FDPIM are simulated based on three kinds of analytical models under weak turbulence channel. The results show that packet error rate of uncoded FDPIM is inferior to that of uncoded DPIM. However, FDPIM is easy to be implemented and easy to be combined, with Turbo code for soft-decision because of its fixed length. Besides, the introduction of Turbo code in this modulation can decrease the average power about 10 dBm, which means that it can improve the error performance of the system effectively.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.