共查询到15条相似文献,搜索用时 102 毫秒
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微量元素对Sn-0.7Cu无铅钎料抗氧化性能的影响 总被引:2,自引:0,他引:2
以Sn-0.7Cu系无铅钎料合金为基础,添加微量的P、Ge、Ga、RE元素,进行了280℃大气环境下氧化试验,通过对含有不同微量元素的无铅钎料表面氧化状况的对比及分析,研究了不同微量元素对Sn-0.7Cu无铅钎料抗氧化性能的影响。发现当P和Ga同时添加时,得到Sn-0.7Cu-(0.001~0.1)P-(0.0001~0.1)Ga无铅钎料的抗氧化性能高于Sn-0.7Cu-(0.001~0.1)P和Sn-0.7Cu-(0.0001~0.1)Ga的抗氧化性能。 相似文献
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本文简单概述了Sn-Cu系无铅钎料的国内外研究现状。在无铅焊料互连结构中,反应界面化合物层(IMC)的形貌及厚度是决定焊点可靠性的一个重要因素。本文通过研究Sn-0.7Cu共晶焊料中添加Ni微量元素对Sn-0.7Cu与Cu界面反应的影响。结果表明:对于Sn-0.7Cu/Cu界面,液态反应初始生成相为Cu6Sn5,在随后的5次回流焊之后形成新的Cu3Sn相,IMC厚度快速增长从而严重影响焊接的可靠性;添加Ni元素的Sn-0.7Cu/Cu界面初生相为(Cu,Ni)6Sn5,但在回流焊和热老化试验之后,Ni的添加延缓了IMC的增长,IMC的生长受到抑制,且界面无其它相生成。再者,初步探讨了Ge元素的添加对该体系焊料抗氧化性能的影响。 相似文献
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无铅电子钎料合金蠕变性能研究 总被引:7,自引:0,他引:7
设计制作了一种简单可靠的弯折蠕变测量装置,比较了两种无铅电子钎料合金Sn-9Zn和Sn-3.5Cu-0.7Ag与传统电子钎料合金Sn-40Pb的常温蠕变性能,以及冷却条件对其蠕变强度的影响。结果表明:两种无铅钎料的抗蠕变性能大大优于传统锡铅钎料;Sn-3.5Ag-0.7Cu合金的抗蠕变性能优于Sn-9Zn合金;冷却速率对Sn-9Zn合金和Sn-3.5Ag-0.7Cu合金组织的影响类似,然而对蠕变强度的影响却相反:水冷使两种合金的组织相对于空冷都明显细化,Sn-9Zn合金的蠕变强度因之降低,而Sn-3.5Ag-0.7Cu合金的蠕变强度却因之提高。对可能产生的原因进行了讨论。 相似文献
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采用悬滴法测量了3种无铅钎料合金(Sn-3.0Ag-0.5Cu、Sn-0.7Cu与Sn-9.0Zn)在260℃时的表面张力,分别为525.5,534.8和595.4 mN/m;同时采用座滴法测量了其在260℃熔融状态下与Cu基板的接触角,分别为24.5°、28.0°和102.5°,并且与传统Sn-37.0Pb钎料进行了比较研究。结果表明,无铅钎料合金的表面张力与接触角均大于Sn-37.0Pb钎料。结合Young-Dupre公式讨论了钎料合金表面张力与其润湿性能的相关性,认为Sn基钎料合金在Cu基板上的润湿性能主要取决于其表面张力。 相似文献
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Sn-Cu、Sn-Ag-Cu系无铅钎料的钎焊特性研究 总被引:17,自引:5,他引:12
制备了Sn-0.7Cu、Sn-3.5Ag-0.6Cu钎料,用润湿平衡法测量了钎料对铜的润湿曲线,研究了温度、钎剂活性、钎焊时间对润湿行为的影响,并与Sn-37Pb钎料进行了比较。结果表明:升高温度能显著改善无铅钎料对铜的钎焊性。当温度<270℃时,Sn-0.7Cu的钎焊性明显低于Sn-3.5Ag-0.6Cu钎料;而当温度≥270℃时,两种钎料对铜都会显示较好的润湿性,而Sn-0.7Cu略优于Sn-3.5Ag-0.6Cu钎料。提高钎剂活性能显著增强钎料对铜的润湿性,其卤素离子的最佳质量分数均为0.4%左右。随着浸渍时间的延长,熔融钎料与铜的界面间产生失润现象。无铅钎料的熔点和表面张力较高,是钎焊性较差的根本原因。 相似文献
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Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions 总被引:3,自引:0,他引:3
F. Tai F. Guo Z. D. Xia Y. P. Lei Y. F. Yan J. P. Liu Y. W. Shi 《Journal of Electronic Materials》2005,34(11):1357-1362
In this research, nanosized Ag reinforcement particles were incorporated by mechanical means into a promising lead-free solder,
Sn-0.7Cu, in an effort to improve the comprehensive property of the Sn-0.7Cu solder. Wettability, mechanical performance,
and creep-rupture life tests were conducted to study the difference between Sn-0.7Cu solder and its composite solder with
different Ag reinforcement volume fractions. Experimental results indicated that the composite solders and their joints showed
better wettability and mechanical properties, as well as longer creep-rupture lives, than Sn-0.7Cu solder. The composite solder
with 1vol.%Ag reinforcement addition exhibited the best comprehensive property as compared to the composite solders with other
reinforcement volume fractions. Systematic creep-rupture life tests were conducted on the 1vol.%Ag-reinforced Sn-0.7Cu-based
composite solder joints. Significant enhancement of the creep-rupture lives were found in the composite solder joints under
different stress and temperature combinations as compared to the Sn-0.7Cu solder joint. Ductile rupture surfaces were exhibited
in most of the broken solder joints. 相似文献
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The impact behavior of solder joints was studied using three different high-velocity impact tests: the U-notch Charpy impact
test, the no-notch Charpy impact test, and a laboratory-designed drop test. The solder joints were made of five solder alloys,
Sn-37Pb, Sn-3.8Ag-0.7Cu, Sn-2.0Ag-0.7Cu, Sn-1.0Ag-0.7Cu, and Sn-0.7Ag-0.7Cu (in wt.%), in which the traditional Cu/solder/Cu
butt joint was used. All three impact tests gave the same trend of the impact behavior of the solder joints, with the Sn-37Pb
joints having the highest impact resistance and the Sn-3.8Ag-0.7Cu joints having the lowest impact resistance. For the lead-free
joints, the Sn-1.0Ag-0.7Cu joints had better impact resistance than the Sn-2.0Ag-0.7Cu joints, and the Sn-2.0Ag-0.7Cu joints
better than the Sn-0.7Ag-0.7Cu joints. The impact behavior was correlated well to the fracture morphologies observed by scanning
electron microscopy (SEM). Comparison of the three tests showed that the no-notch Charpy impact test is a promising method
for evaluating the drop performance of solder joints. 相似文献
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In the present work, lead-free solder balls were manufactured by a uniform droplet spray (UDS) method. The solder used to
produce solder balls was based on the Sn-3.8Ag-0.7Cu alloy. Different amounts of cerium-based mixed rare-earth (RE) elements
were added into the Sn-3.8Ag-0.7Cu solder alloy in order to examine the effects of small amounts of RE additions on the physical
properties, microstructure, and surface smoothness of the solder balls. Results show that a small amount of RE addition has
no obvious effect on the melting temperature, but it decreases the nucleation undercooling degree. Moreover, a small amount
of RE addition (<0.25 wt.%) can improve the surface smoothness of the solder balls. However, when the RE was added up to 0.5 wt.%,
the surface smoothness of the solder balls was deteriorated. From observations of the microstructure of the solder balls,
it is obvious that the RE addition affects solidification behavior, and as a result, the surface smoothness of the solder
balls. 相似文献
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波峰焊及再流焊无铅焊点组织演变规律的研究 总被引:6,自引:1,他引:5
以电子封装线上的波峰焊无铅焊点Sn-0.7Cu/Cu、回流焊无铅焊点Sn-3Ag-0.5Cu/Cu为对象,研究了150 ℃时效过程中无铅焊点处金属间化合物(IMC)、焊料合金组织的演化规律及界面处金属间化合物生长的动力学.试验结果表明:两种无铅焊点处IMC层的厚度随着时效时间的延长而增加,IMC层的生长基本上符合抛物线规律,因此IMC层的长大受元素扩散控制;且两种无铅焊点处IMC层的生长速率常数相近,但Sn-0.7Cu焊料中Sn的晶粒尺寸较Sn-3Ag-0.5Cu中的大;长期时效后,在试样的IMC层内发现有孔洞产生. 相似文献