一种可代银的锌电极浆料

<正> 最近国外专利报导了一种锌导电浆料,特别适用于制作陶瓷电容器、可变电阻器以及其它电子元件的电极。 通常,陶瓷电容器和可变电阻器的电极浆料为银浆料,由银粉,玻璃粉和有机载体组成。但是,用贵金属银作电子元件电极,成本较高。     

国外电子浆料最新发展概况

本文概述国外电子(导体、电阻、介质)浆料的最新发展,包括各种厚膜浆料,树脂酸盐浆料方面的新产品、新材料及新技术。     

光刻用有机金浆研究

光刻有机金浆是以金的树脂酸盐为主，配以有关的贵、贱金属的树脂酸盐等制成。这种浆料分散性好，纯度高，烧制成的金膜薄而致密，覆盖率高，光刻出的图形边沿整齐，分辨率高，附着力好，可以制作出较精密的线路，对于厚薄膜难于满足的一些性能得到了实现和提高。对我国电子工业发展将会起到一定的积极作用。     

《厚膜电子浆料论文集》内容简介

<正>《厚膜电子浆料论文集》收录了原昆明贵金属研究所研究员、厚膜电子浆料专家谭富彬先生的已发表论文23篇、未发表论文9篇、国家发明专利说明书10项(已授权9项)。共计265页,大约四十多万字。本论文集是作者从参加工作至今致力于贵金属和贱金属电子浆料研发工作的总结,多种贵金属粉末不同规格的制备,含铅玻璃无铅玻璃的熔制,热塑性有机载体及热固性有机载体的配制与合成,无论室温烘干(或固化),直至950℃高温烧结浆料,都收入论文集中。还有各种金属粉末、电子浆料及在电子元件中应用性     

《厚膜电子浆料论文集》内容简介

<正>《厚膜电子浆料论文集》收录了原昆明贵金属研究所研究员、厚膜电子浆料专家谭富彬先生的已发表论文23篇、未发表论文9篇、国家发明专利说明书10项(已授权9项)。共计265页,大约四十多万字。本论文集是作者从参加工作至今致力于贵金属和贱金属电子浆料研发工作的总结,多种贵金属粉末不同规格的制各,含铅玻璃无铅玻璃的熔制,热塑性有机载体及热固性有机载体的配制与合成,无论室温烘干(或固化),直至950℃高温烧结浆料,都收入论文集中。还有各种金属粉末、电子浆料及在电子元件中应用性能考核、测试方法,都一一有叙述。作者对电子浆料的     

陶瓷凝胶注模成型技术

介绍一种新的陶瓷成型技术－－凝胶注模成型,它是在陶瓷浆料中加入有机单体浇铸后,在一定的条件下,有机单体发生原位聚合反应,使陶瓷浆料凝固而形成所铸零件。它可用于单相及复合陶瓷的成型,适用于复杂形状的零件成型,是一种净尺寸成型技术。另外,该技术成型的坯体强度高,可用于机加工,最后,讨论了高固相、低粘度陶瓷浆料的制备原则。     

与西德海洛依斯公司座谈问答摘要

<正> 应冶金部贵金属研究所的邀请,西德贵金属专业访华团于1981年5月23～30日访问了昆明贵金属研究所。参加访华的西德海洛依斯公司是欧洲生产贵金属浆料最早的公司,在日本、美国、西德都有厚膜浆料生产厂,是世界三大浆料公司之一。现将海洛依     

厚膜电阻浆料有机载体的改进

厚膜电阻浆料有机载体的改进李同泉（昆明贵金属研究所昆明６５０２２１）ＩｍｐｒｏｖｅｍｅｎｔｏｆＯｒｇａｎｉｃＣａｒｉｅｒｆｏｒＴｈｉｃｋ－ｆｉｌｍＬｉＴｏｎｇｑｕａｎ（ＫｕｎｍｉｎｇＮｏｂｌｅＭｅｔａｌＩｎｓｔｉｔｕｔｅ，Ｋｕｎｍｉｎｇ，６５０２２１...     

适用于铜电极的厚膜电阻浆料

本文描述了适用于铜电极的LaB6厚膜电阻浆料,在以前的工作基础上,对LaB6的球磨工艺、玻璃釉的组分以及有机载体进行重新选择和实验,从而得到具有优异电性能的厚膜电阻浆料。     

兼用型初测打点浆料的研制

介绍了一种既适用于自动砂轮锯划片后自动装片或手工装片,又适用于手工装片的识别不良管芯的初测打点浆料,并介绍了红外灯光线涸化浆料的简易装置。     

一种新型焊膏喷印技术

焊膏印刷是SMT/表面组装技术的核心工艺,其加工质量的优劣关系到后序组装、回流焊、封装及产品整体性能。文章首先介绍了通过金属箔掩模版、激光打孔不锈钢掩模版进行焊膏丝印的技术,并介绍了国外研发成功的一种焊膏喷印新技术。同时,对两种工艺技术的原理、特点和优势进行了详细比较。当前微电子业界焊膏网印过程中,一般大量使用丝网印刷来获取高质量的焊膏图形,但多种硬件参数、操作员个人经验因素等综合因素会影响到最终加工效果。比较而言,焊膏喷印方式自动化程度高,可有效缩短焊膏图形最终加工结果与焊膏喷印软件中预计效果间的差距。     

活性钎焊电子浆料流变性能及丝印质量的研究

研究了固含量及有机载体对电子浆料流变性能及丝网印刷质量的影响。采用流变仪测量钎焊电子浆料的黏度和触变性,并结合丝印后形貌特征,通过优化电子浆料的配方来改善丝印质量,对后续烧结过程形成性能优良的陶瓷覆铜板三明治结构具有很好的指导意义。获得了优化的浆料配方为:固含量为质量分数89%,有机载体成分质量组成为:丙二醇苯醚溶剂93.53%,乙基纤维素粘结剂5.97%及LD-9108型流平剂0.5%。获得的浆料黏度为46.039 Pa·s,触变指数为2.6136。     

Microcapacitors with controlled electrical capacity in the pF–nF range printed by laser-induced forward transfer (LIFT)

Micrometric-sized pixels of hybrid organic–inorganic thin films (Ag/parylene-C) have been printed by laser-induced forward transfer (LIFT) on flexible, cost-efficient substrates. Micrometric capacitors have been fabricated by laser printing such pixels together with silver nanoparticles (AgNP) paste. The AgNP paste has been deposited in the shape of square pads, acting as bottom electrode. This combination is suitable to be used in microelectronic circuits, as the electrical components exhibit controllable capacity in the pF–nF range. Electrical characterizations of the printed pixels demonstrate that the capacitors are fully operative and stable over time.     

空气中烧成锌电极浆料的研究

半导瓷用锌电极浆料可在空气中烧成。材料配方的选择和工艺的优化是实验的关键。实验中以硼硅铅玻璃和金属有机化合物作为锌电极浆料的粘结剂和抗氧化剂，取得了良好的效果。     

Diffusion‐based model of local Al back surface field formation for industrial passivated emitter and rear cell solar cells

In this work, the back surface field (BSF) formation of locally alloyed Al‐paste contacts employed in recent industrial passivated emitter and rear cell solar cell designs is discussed. A predictive model for resulting local BSF thickness and doping profile is proposed that is based on the time‐dependent Si distribution in the molten Al paste during the firing step. Diffusion of Si in liquid Al away from the contact points is identified as the main differentiator to a full‐area Al‐BSF; therefore, a diffusion‐based solution to the involved differential equation is pursued. Data on the Si distribution in the Al and the resulting BSF structures are experimentally obtained by firing samples with different metal contact geometries, peak temperature times and pastes as well as by investigating them by means of scanning electron microscopy and energy dispersive X‐ray spectroscopy. The Si diffusivity in the Al paste is then calculated from these results. It is found that the diffusivity is strongly dependent on the paste composition. Furthermore, the local BSF doping profiles and thicknesses resulting from different contact geometries and paste parameters are calculated from the Si concentration at the contact sites, the diffusivity and solubility data. These profiles are then used in a finite element device simulator to evaluate their performance on solar cell level. With this approach, a beneficial paste composition for any given rear contact geometry can be determined. Two line widths are investigated, and the effects of the different paste properties are discussed in the light of the solar cell results obtained by simulation. Copyright © 2013 John Wiley & Sons, Ltd.     

电子元件用贵金属超细粉末的生产

随着微电子工业的迅速发展,作为厚膜电子浆料的基本功能材料-超细贵金属粉末得到广泛的应用.对粉体技术的研发和产业化,主要靠自主创新,积累了不少研究经验.介绍了电子元件用贵金属超细粉末的生产工艺,探讨了影响粉体性能的因素和表征粉体性能的参数,用本工艺生产的贵金属超细粉体完全符合电子元件的使用要求.     

Preparation of TiO2 paste starting from organic colloidal suspension for semi-transparent DSSC photo-anode application

We investigated the effect of different formulation strategies on the preparation of TiO2 screen printable pastes starting from the same organic colloidal suspension for dye-sensitized solar cells (DSSCs) application. As first strategy, we developed TiO2 pastes starting from nano-crystalline powder dried from the synthetized suspension, with and without an additional acid treatment, obtaining non-transparent scattering sintered layers. Instead, we demonstrate that starting from the sol solution is a key factor to obtain a well nano-dispersed TiO2 paste. The novel paste process resulted in a final homogeneous and semitransparent porous layer (T>80% @450–550 nm). In order to evaluate the properties of TiO2 powders and inks we performed thermal analysis, BET and FTIR measurements. The films were screen printed on FTO (fluorinedoped tin oxide) glass and characterized after sintering via profilometry, FE-SEM analysis and UVVis spectra measurements. The photo-anode was further validated in small (2 cm2) and large (90 cm2) active area DSSCs, giving an average photovoltaic efficiency respectively of 5,22% and 2,39%, comparable with commercially available TiO2 paste with similar composition.     

Cu厚膜微带制作及其性能研究

本文进一步研究了新型的在大气气氛中烧结的贱金属(Cu)多层导电浆料,并采用干膜反光刻抛光微带工艺,将浆料推广应用到较高频率范围的微波集成电路。文中介绍了制作低通滤波器和混频器的实例。     

On the absence of the β to α Sn allotropic transformation in solder joints made from paste and metal powder

Until July 2006, most solder joints in the electronics industry were made of the alloy 63Sn37Pb or 62Sn36Pb2Ag. After this date, the European environmental Restriction of Hazardous Substances directive (RoHS) forced many manufacturers to use Pb-free alloys. These substitutes for SnPb are Sn-rich alloys (over 90% Sn) of various compositions. Below 13.2 °C, Sn potentially transforms into a different phase. This occurs with catastrophic effects, as the transforming material becomes extremely brittle and falls apart. The purpose of this paper is to investigate if this allotropic transformation also occurs in samples prepared from solder paste or metal powder. This work compares the transformation propensity of samples prepared with bulk solder, solder paste, and tin powder. Different conditions and geometries are used in the investigation and experiments with both commercial and specifically prepared solder pastes are carried out. Samples prepared from bulk solder transform into the α phase as expected, whilst samples prepared from solder paste and tin powder do not transform. The residual organic compounds from the flux are believed to be responsible for this behaviour. The tin oxide (SnO₂) retained in the bulk after melting could also play a role. This paper shows, for the first time, a relationship between the ability of tin to transform and the nature of the starting material and in particular that the tin β/α allotropic transformation does not occur when samples are prepared from paste or powders. The new lead-free alloys can therefore be used with more confidence in mission-critical applications.     

CuInSe2薄膜太阳能电池非真空印刷制备技术研究

对CuInSe2(CISe)薄膜太阳能电池的吸收层进行了非真空印刷制备技术研究。使用机械化学法合成CISe前驱粉末,采用ethyl-cellulose作为分散试剂配置印刷浆,使用丝网印刷技术沉淀CISe吸收层,对沉淀的吸收层进行N2氛围的快速热退火处理,使用XRD、UV、SEM及J-V等手段对CISe吸收层进行了分析表征。结果表明:简单高效的机械化学法可获得主(112)晶向CISe前驱粉末;经丝网印刷并干燥后的CISe吸收层中含有大量有机分散剂,退火可蒸发有机分散剂并有效改善CISe结晶度,但过长的退火会增加晶体缺陷;实验制得一典型CISe薄膜太阳能电池的短路电流密度、开路电压、填充因子和转换效率分别为4.48mA/cm2、355mV、0.41和0.65%。