激光束诱导电流在HgCdTe双色探测器工艺检测中的应用

报道了激光束诱导电流（LBIC）在碲镉汞（HgCdTe）红外双色探测器工艺检测中的应用.通过LBIC测试,发现p型HgCdTe材料由B＋离子注入损伤形成的n区面积大于其注入面积,并获得n区横向的精确分布.同时,运用LBIC,获得了p型HgCdTe材料因不同能量的等离子体干法刻蚀诱导的刻蚀台面侧壁工艺损伤形成的n区横向分布,并得到了n区横向宽度与等离子体能量的关系.     

中波碲镉汞光电二极管pn结特性研究

采用液相外延(LPE)生长的中波Hg Cd Te薄膜,基于B离子注入n-on-p平面结技术,制备了LBIC测试结构和I-V测试芯片并进行了相应的测试和分析。LBIC测试结果表明,Hg Cd Te pn结实际结区尺寸扩展4~5?m,这主要与光刻、B离子注入以及注入后低温退火等器件工艺有关。二极管器件C-V和I-V特性研究表明,所制备的Hg Cd Te pn结不是突变结也不是线性缓变结。中波Hg Cd Te二极管器件最高动态阻抗大于30 G?,器件优值R0A高达1.21×105?cm2,表现出较好的器件性能。     

离子束刻蚀HgCdTe环孔pn结I—V、RD—V特性的研究（上）

本文推导了一种可简便、准确、直观计算和分析pn结I-V特性的公式和方法,并应用该方法对两类典型HgCdTe环孔pn结的I-V、RD-V特性进行了计算和拟合;得到了表面欧姆(反型沟道)漏电导、二极管理想因子n随电压的分布等反映二极管结特性的重要参数.计算结果表明,对于长波HgCdTe光伏器件而言,表面漏电流在整个暗电流中所占的比重相当大,表面漏电流严重地制约着器件性能.HgCdTe材料的晶体缺陷会使二极管的理想因子n增大,从而使产生-复合电流及陷阱辅助隧穿电流增加.     

HgCdTe环孔p-n结光伏探测器暗电流机制

P-n结I-V特性是红外光伏探测器的一个重要指标,它直接决定了探测器的动态电阻和热噪声,决定了探测器的性能.实验主要对离子刻蚀环孔P-n结HgCdTe长波光伏探测器进行变温,I-V特性测试分析.通过对测试实验数据拟合,从理论上计算了探测器在不同温度及不同偏压下的暗电流,得到一些相关的材料和器件性能参数.希望利用分析计算结果了解工艺中存在的问题,对改进工艺及提高器件性能提供理论依据.     

离子束刻蚀HgCdTe环孔pn结I-V、RD-V特性的研究（下）

本文推导了一种可简便、准确、直观计算和分析pn结I-V特性的公式和方法,并应用该方法对两类典型HgCdTe环孔pn结的I-V、RD—V特性进行了计算和拟合;得到了表面欧姆（反型沟道）漏电导、二极管理想因子n随电压的分布等反映二极管结特性的重要参数。计算结果表明,对于长波HgCdTe光伏器件而言,表面漏电流在整个暗电流中所占的比重相当大,表面漏电流严重地制约着器件性能。HgCdTe材料的晶体缺陷会使二极管的理想因子n增大,从而使产生一复合电流及陷阱辅助隧穿电流增加。     

Si基HgCdTe变面积光伏探测器的变温特性研究

通过变面积Si基HgCdTe器件变温I-V测试和暗电流特性拟合分析,研究了不同偏压下n-on-p型Si基HgCdTe光伏器件的暗电流成分与Si基HgCdTe材料少子扩散长度和少子寿命随温度的变化规律.在液氮温度下,随着反向偏压的增大器件的表面漏电流在暗电流中所占比重逐渐增加.在零偏压下,当温度低于200 K时材料的少子...     

富汞热处理对碲镉汞电学性能的影响

对液相外延方法(LPE)生长的碲镉汞(HgCdTe)材料进行了闭管富汞热处理,并研究了不同的热处理时间和热处理温度对碲镉汞材料电学性能的影响。HgCdTe材料经过富汞热处理后可以有效降低材料内的缺陷尺寸和密度。该方法不仅可以降低材料内的位错密度,而且还可以完成材料P型到N型的转变。工艺中的低温热处理对HgCdTe材料的电学性能有较大影响。研究发现,随着低温热处理时间的持续增加,HgCdTe材料的载流子浓度会明显增加。而当低温热处理温度在210℃~250℃范围内变化时,若保持低温热处理时间不变,则热处理后HgCdTe材料的载流子浓度在一定范围内波动,且无明显变化。通过对HgCdTe器件进行I-V曲线测试以及最终的组件测试,发现热处理后载流子浓度在1E13~1E14cm^-3范围内的HgCdTe芯片就可以得到很好的测试结果。     

微电子学、集成电路

TN42005040348碲镉汞p+-on-n长波异质结探测器的研究/叶振华,吴俊,胡晓宁,巫艳,王建新,李言谨,何力(中国科学院上海技术物理研究所材料器件中心)//红外与毫米波学报.―2004,23(6).―423～426.报道了HgCdTe p+-on-n长波异质结焦平面器件的研究结果.采用由分子束外延(MBE)和原位掺杂技术生长的P+-on-n异质结材料,通过湿法腐蚀、台面钝化、台面金属化、铟柱制备和互连等工艺,得到了HgCdTe p+-on-n长波异质结焦平面器件.根据,I-V实验结果和暗电流理论,拟合计算和分析了各种暗电流机制对器件性能的影响.且获得了器件的响应光谱和探测率。图…     

碲镉汞p^＋-on-n长波异质结探测器的研究

报道了HgCdTe p^ -on-o长波异质结焦平面器件的研究结果．采用由分子柬外延(MBE)和原位掺杂技术生长的P^ -on-n异质结材料，通过湿法腐蚀、台面钝化、台面金属化、铟柱制备和互连等工艺，得到了HgCdTe p^ -on-o长波异质结焦平面器件．根据，I-V实验结果和暗电流理论，拟合计算和分析了各种暗电流机制对器件性能的影响．且获得了器件的响应光谱和探测率。     

分子束外延的CdTe在碲镉汞中波器件中钝化效果

采用分子束外延技术（MBE）制备了碲化镉（CdTe）原位钝化的中波碲镉汞（HgCdTe）材料。原子力显微镜（AFM）和扫描电子显微镜（SEM）测试结果表明,分子束原位外延的CdTe可见cross-hatch,表面粗糙度为1～2 nm,CdTe和HgCdTe界面结合紧密。微波光导测试结果显示,77 K时,与表面处理后非原位CdTe钝化的HgCdTe材料相比,CdTe原位钝化的HgCdTe材料的少子寿命较大。制备了分子束外延CdTe原位钝化的中波HgCdTe光伏器件,和相同材料上的非原位CdTe/ZnS双层钝化制备的器件I-V特性相似。     

Laser beam induced current imaging of reactive ion etching induced n-type doping in HgCdTe

The nondestructive optical characterization technique of laser beam induced current (LBIC) has been used to illustrate the effects of reactive ion etching (RIE) of mid-wavelength infrared n-type HgCdTe. RIE may be used as a method of n-p junction formation, as a means of forming n⁺ ohmic contacts to wider bandgap HgCdTe, or for mesa isolation etching of epilayers for HgCdTe detectors and emitters. Along with experimental measurements of the LBIC phenomena, this paper introduces the simulation of LBIC signals using a commercial semiconductor device modeling package. A number of LBIC maps are presented for different wafer processing conditions, with the results being explained using the simulation software. The experimental and calculated results bring to light a number of previously unreported characteristics associated with the LBIC phenomena, including the effect of junction depth, temperature, and grading of the junction region. In addition to the LBIC technique confirming the presence of an n⁺ region after RIE processing, it also provides information regarding the depth of the n⁺ region and lateral extent of the doping.     

变磁场I-V法对碲镉汞光伏器件少子扩散特性的研究

零偏压电阻-面积乘积(R0A)和反向饱和电流密度J0是决定光电二极管性能的重要参数．提出了一种对碲镉汞(Hg1-xCdxTe)光伏器件的少子扩散特性进行研究的有效方法．利用变磁场下的电流-电压(I-V)测试,得到了组分x在0．5与0．6之间的器件R0A和J0随磁场强度B变化的函数关系．由实验结果估算得到了室温工作的短波红外(SWIR)碲镉汞光伏器件的少子扩散长度．其数值与用激光诱导电流(LBIC)方法得到的相一致．     

激光束感应电流法研究HgCdTe电活性缺陷和焦平面器件的光电特性

用高分辨率的、非破坏的光学表征技术的激光束感应电流研究碲镉汞（MCT）晶片中电活性缺陷和光伏型红外碲镉汞焦平面器件及光伏型硅光电器件P－N结光电特性,实验表明在MCT晶片中探测到激光束感应电流,在光伏型P－N结构的器件中,观察到周期结构的激光束感应电流分布。定性地观察激光束感应电流图谱以及定量地分析单个P－N结的感应电流分布形状可以判断器件的均匀性和器件的质量。     

碲镉汞离子注入温度研究

作为pn结成型的重要参数,离子注入温度对晶格缺陷和材料扩散的影响较大。在碲镉汞的离子注入过程中,注入温度很大程度上影响着注入区的尺寸与光刻掩膜的形貌。从离子注入工艺的温度控制出发,研究了该工艺中的束流、注入能量、接触面粗糙度等因素;结合器件的I-V曲线,探究了注入温度对碲镉汞红外探测器性能的影响。结果表明,较低的注入束流、冷却温度以及良好的导热面,可以保证实际注入温度低于光刻胶的耐受温度,从而提高工艺过程的成品率。同时,较低的注入温度对于减小暗电流及注入区扩散面积起到了一定的作用,提高了碲镉汞红外探测器光敏元的性能。     

碲镉汞红外探测器电极接触研究北大核心CSCD

金属/碲镉汞电极接触是红外焦平面探测器的重要组成部分,对器件的性能与稳定性影响较大。然而在碲镉汞金属化过程中,金属离子能量较高将有可能对碲镉汞表面造成损伤。本文采用了离子束沉积系统生长金属电极,探究了束流、束压以及热处理等条件对碲镉汞红外探测器接触性能的影响。研究表明,碲镉汞在生长电极后表面会受到一定程度的损伤;随着离子能量的升高,对材料表面损伤加剧。在I-V曲线中,电极沉积损伤较大的器件表现出软击穿现象;在热处理后,在一定程度上可以修复电极沉积时能量过大造成的损伤,提高了电极接触性能。     

激光束诱导电流谱技术表征红外器件几何结构

硼离子注入p型HgCdTe薄膜材料制备的光伏型红外探测器光敏元实际面积对器件结构的优化设计、器件性能研究具有重要意义．通过高分辨率、非直接接触的激光束诱导电流谱表征手段获取HgCdTe光伏型器件单元的几何结构信息，结果表明离子注入形成的n型区域的面积明显大于离子实际注入的区域面积。     

Laser-beam-induced current mapping of spatial nonuniformities in molecular beam epitaxy As-grown HgCdTe

The formation of dislocations and corresponding built-in electric fields in molecular beam epitaxy (MBE)-grown HgCdTe can have a major impact on the performance and yield of photodetectors fabricated from this material. This paper investigates the presence of such built-in electric fields arising from dislocation segregation in MBE as-grown HgCdTe, and their subsequent removal via a low-temperature Hg-saturated anneal. The electrical properties and surface morphology of an HgCdTe layer grown on a thin CdTe buffer layer are compared with those of an HgCdTe layer grown directly on the CdZnTe substrate. Laser-beam-induced current (LBIC) imaging is a nondestructive technique capable of mapping built-in electric fields present in a semiconductor material, which, in the present case, has been used to reveal dislocation distributions present in as-grown, unintentionally doped, MBE-grown Hg_0.71Cd_0.29Te. Two-dimensional scanning LBIC measurements at 160 K allow spatial mapping of electric fields across the HgCdTe wafer. Subsequent isothermal annealing of the wafer in an Hg atmosphere has been found to decrease the magnitude of the built-in electric fields to below the LBIC detection limit. However, of particular note, is that before and after annealing, crosshatch patterns can be seen using Nomarski microscopy, with the crosshatching being predominantly in the [01 ] direction and, to a lesser extent, in the [ 31] and [ 13] directions. Defect-decoration etching of the annealed wafer reveals dislocation banding parallel to the [01 ] direction, which closely resembles the contrast observed in the LBIC image of the wafer before annealing. These Nomarski and LBIC images are compared with those of a second wafer, which incorporates a 40-nm CdTe buffer layer. The second wafer does not show significant Nomarski or LBIC contrast, indicating a flat, electrically uniform as-grown layer. Variable magnetic-field Hall measurements at 77 K and quantitative mobility-spectrum analysis (QMSA) indicate predominately p-type conduction with a doping density of 2×10¹⁵ cm⁻³ in the as-grown layer. After Hg annealing at 240°C, no LBIC signals are observed at 160 K, and Hall measurements at 77 K indicate the presence of two n-type carriers, with a combined doping density of 2×10¹⁵ cm⁻³. Double-crystal x-ray diffraction measurements show no evidence of twinned crystal volumes in the layers before or after annealing, or any change in the full-width at half-maximum (FWHM) (41 arcsec) of the (422) reflection. The similarity between the dislocation density distribution, as revealed by defect decoration, and the LBIC image suggests that Hg out-diffusion during growth is expedited in regions of high dislocation concentration, thus creating a nonuniform Hg vacancy-acceptor concentration. The as-grown acceptor concentration, in turn, modulates the hole concentration, creating p⁺/p⁻ junctions and built-in electric fields in the material. Low-temperature annealing in a saturated-Hg atmosphere does not remove the crosshatch patterns or dislocation banding, but it fills the Hg vacancies, revealing the uniformly distributed n-type background, thus reducing the magnitude of any built-in electric fields. The LBIC mapping of MBE as-grown HgCdTe samples is, thus, capable of revealing defect distributions that would otherwise require a destructive technique, such as defect-decoration etching, to determine.     

碲镉汞光伏型探测器的变面积氢化研究

利用氢等离子体对碲镉汞光伏型探测器进行了变面积氢化处理研究,发现随着氢化面积的变大,器件的电流-电压(I-V)特性得到明显改善,表现在器件的暗电流变小,零偏电阻R0变大,同时器件的电流噪声也随着氢化面积的扩大而逐渐降低.通过对比实验结果和数值拟合结果,认为氢化工艺对器件性能的改善机制与氢化区域有关,当氢化区域限于N型区时,氢化的效果主要表现在降低注入损伤导致的少子复合中心从而提高少子寿命;当氢化区域扩大到P型区时,氢化的效果主要表现在使表面耗尽区中的陷阱中心减少,主要通过降低间接隧道电流来改善器件性能,这说明了实验中注入成结的光伏器件为N P结.     

Correlation of laser-beam-induced current with current-voltage measurements in HgCdTe photodiodes

Laser-beam-induced current (LBIC) is being investigated as an alternative to electrical measurements of individual photodiodes in a two-dimensional array. This is possible because LBIC only requires two electrical contacts to an array and the two-dimensional scanning of a focused laser beam across the array to image the entire array. The measured LBIC profiles, obtained from linear arrays of HgCdTe photodiodes, will be used to study the uniformity of photodiodes in the array and to extract the R₀A of the photodiodes. It will be shown that the shape of the LBIC signal is correlated to the electrical performance of the photodiode, with R₀A related to the spreading length of the photodiodes. Linear arrays of n-on-p, mid-wavelength infrared (MWIR) and long wave-length infrared (LWIR) devices were formed in liquid-phase epitaxy HgCdTe epilayers using a plasma junction-formation technique. The LBIC profiles were measured on each of the devices at various temperatures. For the MWIR devices, the extracted spreading length shows no correlation with R₀A. However, the LBIC signal does detect nonuniform devices within the array. For the case of the LWIR devices, the spreading length is extracted as a function of temperature, with the R₀A subsequently calculated from the spreading length. The calculated R₀A, obtained without requiring contact to each photodiode in the array, agrees well with electrical measurements. Asymmetry of the LBIC signals for certain devices in the arrays is shown to be a result of localized leakage at the photodiode junction or from the contact pads through the passivation layers. These results are confirmed by numerical modeling of the device structures.