用于红外探测的铱硅化物的X射线光电子能谱

用Ｘ射线光电子能谱方法测量了铱硅化物的芯能级谱。得到了与化学键有关的化学多和芯能级对称性变化方面的信息，提出了在ＩｒＳｉ／Ｓｉ肖特基势垒形成机理与界面外ＩｒＳｉ和Ｓｉ原子的化学键密切相关本文结果有益于解用铱硅化物肖特基势垒制备红外探测器。     

铂-铱硅化物肖特基势垒红外探测器

已经制备了用硅化物做电极的肖特基势垒红外探测器,该电极是在p型硅衬底上,依次真空淀积5～10A的铂和10～20A的铱金属膜,经热退火后形成的。铂-铱肖特基二极管的势垒高度为0.16～0.19eV,与具有0.22eV的纯铂二极管相近,而探测器截止波长可延伸到6μm范围以外。而且,与单用铂或单用铱的二极管相比,在有效光谱范围内,铂-铱二极管呈现出较高的探测器量子效率。     

铂－镍硅化物／硅接触肖特基势垒的形成方法

本工作研究了低温固相反应形成铂－镍硅化物／硅接触肖特基势垒的方法。介绍了用磁控溅射方法淀积金属薄膜和溅射工艺过程应注意的问题及其对肖特基势垒特性的影响。讨论了Ｈ＿２气氛中退火以形成优良肖特基势垒接触的方法与实验结果。     

铂—镍硅化物／硅接触肖特基势垒的形成方法

本工作研究了低温固相反应形成铂－镍硅化物／硅接触肖特基势垒的方法。介绍了用磁控溅射方法淀积金属薄膜和溅射工艺过程应注意的问题及其对肖特基势垒特性的影响。讨论了Ｈ２气氛中退火以形成优良肖特基势垒接触的方法与实验结果。     

微波肖特基势垒二极管硅化物工艺技术研究

对微波肖特基中、低势垒二极管硅化物的工艺技术进行了研究。用Ｎｉ－Ｓｉ硅化物作中势垒硅化物,用Ｔｉ－Ｓｉ硅化物作低势垒硅化物。通过设计和工艺实验,得到温度、时间、真空度等取佳工艺技术条件。在保持微波肖特基二极管势垒特征的同时,提高了反向电压,增强了它的稳定性和可靠性。     

硅化铱肖特基势垒红外焦平面阵列技术

本文讨论了硅化铱肖特基势垒红外探测器(IrSi-SBIRD)的典型结构和其制作技术;评述了硅化铱肖特基势垒红外焦平面阵列(IrSi-SBIRFPA)的现状。     

用于肖特基势垒红外传感器的Ir及IrSi膜

本文叙述了在 P-Si 基片上,采用物理沉积方法制备高纯 Ir(铱)膜。讨论了在300～1000℃退火温度下,Si-Ir 界面反应形成 IrSi 硅化物的研制技术和工艺参数。分析了界面反应机理、IrSi 膜的光电学特性。最后介绍了 IrSi 在肖特基势垒红外(SBIR)固体传感器研制技术中的应用。     

用于肖特基垫垒红外传感器的Ir及IrSi膜

本文叙述了在P-Si基片上，采用物理沉积方法制备高纯Ir(铱）膜，讨论了在300－1000度退火温度下，Si-Ir界面反应形成IrSi硅化物的研制技术和工艺参数，分析了界面反应机理，IrSi的光电学特性，最后介绍了IrSi在肖特基势垒红外（SBIR）固体传感器研制技术中的应用。     

SOI反偏肖特基势垒动态阈值MOS特性

将Ti硅化物-p型体区形成的反偏肖特基势垒结构引入绝缘体上硅动态阈值晶体管.传统栅体直接连接DTMOS,为了避免体源二极管的正向开启,工作电压应当低于0.7V.而采用反偏肖特基势垒结构,DTMOS的工作电压可以拓展到0.7V以上.实验结果显示,室温下采用反偏肖特基势垒SOI DTMOS结构,阈值电压可以动态减小200mV.反偏肖特基势垒SOI DTMOS结构相比于传统模式,显示出优秀的亚阈值特性和电流驱动能力.另外,对浮体SOI器件、传统模式SOI器件和反偏肖特基势垒SOI DTMOS的关态击穿特性进行了比较.     

SOI反偏肖特基势垒动态阈值MOS特性

将Ti硅化物-p型体区形成的反偏肖特基势垒结构引入绝缘体上硅动态阈值晶体管.传统栅体直接连接DTMOS,为了避免体源二极管的正向开启,工作电压应当低于0.7V.而采用反偏肖特基势垒结构,DTMOS的工作电压可以拓展到0.7V以上.实验结果显示,室温下采用反偏肖特基势垒SOI DTMOS结构,阈值电压可以动态减小200mV.反偏肖特基势垒SOI DTMOS结构相比于传统模式,显示出优秀的亚阈值特性和电流驱动能力.另外,对浮体SOI器件、传统模式SOI器件和反偏肖特基势垒SOI DTMOS的关态击穿特性进行了比较.     

过渡层和界面电荷对金属硅化物/硅肖特基接触特性的影响

针对金属硅化物／硅接触存在过渡层，提出了分析这种结构的肖特基接触特性的模型；讨论了过渡层厚度、界面电行及有关参数的影响，分析了不同退火条件下PtSi／Si肖特基二极管的特性。     

Ion-implanted low-barrier PtSi Schottky-barrier diodes

An ion-implanted, shallow n⁺layer has been used for lowering the barrier height of PtSi-n-Si Schottky diodes. Barrier height reductions up to 200 mV have been achieved with little degradation of the diode's reverse-current characteristics. During silicide formation, the implanted ions are "pushed" ahead of the PtSi-Si reaction zone and pile up at the silicide-silicon interface, resulting in more barrier lowering than would be expected from the ion-implant dose. A model including the impurity pileup is presented and calculations based on the model are shown to be in reasonable agreement with experimental measurements.     

清晰热成象红外双色肖特基势垒CCD图象传感器

用控制肖特基光电二极管阵列势垒高度的方法，研制出象素包含低和高势垒高度二极管的红外双色肖特基ＣＣＤ图象传感器。研制的６４８（Ｈ）×４８８（Ｖ）红外双色ＣＣＤ图象传感器转移效率高达９９．７４％，解决了常规单色红外ＣＣＤ图象传感器探测灰色物体温度的错误，获得清晰的热成象。     

The device characteristics of Ir- and Ti-based Schottky gates AlSb/InAs high electron mobility transistors

In this work, the InAs/AlSb high electron mobility transistors (HEMTs) on GaAs semi-insulating substrate using refractory iridium (Ir) gate technology was proposed. The Ir-gate exhibited a superior metal work function which was beneficial for increasing Schottky barrier height of InAs/AlSb heterostructures to 0.58 eV. Compared to the Ti-gate HEMT, the Ir-gate HEMT shows higher threshold voltage and lower gate leakage current owing to its higher Schottky barrier height and higher melting point. Moreover, the Ir-gated HEMT also shows the manifest stability improvement of DC characteristics under hot carrier stress as the Ti and As diffusion is alleviated.     

Deep-level transient spectroscopy measurements using high Schottky barriers

This paper describes a method to investigate minority-carrier traps in semiconductors by utilizing high Schottky barrier diodes in DLTS (deep-level transient spectroscopy) measurements.

This offers an advantage compared to using pn diodes in that no excessive heat treatment which can alter the semiconductor deep-level properties has to be performed.

One of the best-known deep-level systems is the gold levels in silicon. The method is demonstrated for the gold donor level in n-type silicon by using iridium as Schottky contact.     

Plasmon‐Induced Sub‐Bandgap Photodetection with Organic Schottky Diodes

Organic materials for near‐infrared (NIR) photodetection are in the focus for developing organic optical‐sensing devices. The choice of materials for bulk‐type organic photodetectors is limited due to effects like high nonradiative recombination rates for low‐gap materials. Here, an organic Schottky barrier photodetector with an integrated plasmonic nanohole electrode is proposed, enabling structure‐dependent, sub‐bandgap photodetection in the NIR. Photons are detected via internal photoemission (IPE) process over a metal/organic semiconductor Schottky barrier. The efficiency of IPE is improved by exciting localized surface plasmon resonances, which are further enhanced by coupling to an out‐of‐plane Fabry–Pérot cavity within the metal/organic/metal device configuration. The device allows large on/off ratio (>1000) and the selective control of individual pixels by modulating the Schottky barrier height. The concept opens up new design and application possibilities for organic NIR photodetectors.     

硅基红外焦平面阵列技术的新进展(Ⅰ)

主要介绍以硅为衬底的非本征硅、金属硅化物（Ｐｄ２Ｓｉ，ＰｔＳｉ和ＩｒＳｉ）肖特基势垒红外探测器、ＧｅｘＳｉ１－ｘ／Ｓｉ异质结内光电发射红外探测器、硅基红外图象传感器、硅微测辐射热计等红外探测器焦平面阵列的新进展     

An infrared detector utilizing internal photoemission

An infrared detector utilizing internal photoemission as a detection mechanism is demonstrated. The detector consists of a metal-semiconductor contact with photoemission taking place over the associated Schottky barrier. Quantum efficiency and bias effects are investigated.     

标准CMOS工艺集成肖特基二极管设计与实现

提出了一种在标准CMOS工艺上集成肖特基二极管的方法,并通过MPW在charted 0.35μm工艺中实现.为了减小串连电阻,肖特基的版图采用了交织方法.对所设计的肖特基二极管进行了实测得到I-V,C-V和S参数,并计算得出所测试肖特基二极管的饱和电流、势垒电压及反向击穿电压.最后给出了可用于SPICE仿真的模型.