可用于Ⅲ族氮化物生长的50mm 3C-SiC/Si(111)衬底的制备

利用新研制出的垂直式低压CVD(LPCVD)SiC生长系统,获得了高质量的50mm 3C-SiC/Si(111)衬底材料.系统研究了3C-SiC的n型和p型原位掺杂技术,获得了生长速率和表面形貌对反应气体中SiH4流量和C/Si原子比率的依赖关系.利用Hall测试技术、非接触式方块电阻测试方法和SIMS,分别研究了3C-SiC的电学特性、均匀性和故意调制掺杂的N浓度纵向分布.利用MBE方法,在原生长的50mm 3C-SiC/Si(111)衬底上进行了GaN的外延生长,并研究了GaN材料的表面、结构和光学特性.结果表明3C-SiC是一种适合于高质量无裂纹GaN外延生长的衬底或缓冲材料.     

Direct growth of CdTe on (100), (211), and (111) Si by metalorganic chemical vapor deposition

CdTe epilayers were grown directly on (100), (211), and (111) silicon substrates by metalorganic chemical vapor deposition (MOCVD). The crystallinity and the growth orientation of the CdTe film were dependent on the surface treatment of the Si substrate. The surface treatment consisted of exposure of the Si surface to diethyltelluride (DETe) at temperatures over 600°C prior to CdTe growth. Direct growth of CdTe on (100) Si produced polycrystalline films whereas (lll)B single crystals grew when Si was exposed to DETe prior to CdTe growth. On (211) Si, single crystal films with (133)A orientation was obtained when grown directly; but produced films with (211)A orientation when the Si surface was exposed to DETe. On the other hand, only (lll)A CdTe films were possible on (111) Si, both with and without Te source exposure, although twinning was increased after exposure. The results indicate that the exposure to a Te-source changes the initial growth stage significantly, except for the growth on (111) Si. We propose a model in which a Te atom replaces a Si atom that is bound to two Si atoms.     

以金属为缓冲层在Si(111)上分子束外延GaN及其表征

用电子束蒸发方法在Si(111)衬底上蒸发了Au/Cr和Au/Ti/Al/Ti 两种金属缓冲层,然后在金属缓冲层上用气源分子束外延(GSMBE)生长GaN. 两种缓冲层的表面都比较平整和均匀,都是具有Au(111)面择优取向的立方相Au层. 在Au/Cr/Si(111)上MBE生长的GaN,生长结束后出现剥离. 在Au/Ti/Al/Ti/Si(111)上无AlN缓冲层直接生长GaN,得到的是多晶GaN;先在800℃生长一层AlN缓冲层,然后在710℃生长GaN,得到的是沿GaN(0001)面择优取向的六方相GaN. 将Au/Ti/Al/Ti/Si(111)在800℃下退火20min,金属层收缩为网状结构,并且成为多晶,不再具有Au(111)方向择优取向.     

溅射AlN技术对GaN基LED性能的影响

研究了在图形蓝宝石衬底(PSS)上利用磁控溅射制备AlN薄膜的相关技术,随后通过采用金属有机化学气相沉积(MOCVD)在相关AlN薄膜上生了长GaN基LED.通过一系列对比实验,分析了AlN薄膜的制备条件对GaN外延层晶体质量的影响,研究了AlN薄膜溅射前N2预处理功率和溅射后热处理温度对GaN基LED性能的作用机制.实验结果表明:AlN薄膜厚度的增加,导致GaN缓冲层成核密度逐渐升高和GaN外延膜螺位错密度降低刃位错密度升高;N2处理功率的提升会加剧衬底表面晶格损伤,在GaN外延膜引入更多的螺位错;AlN热处理温度的升高粗化了表面并提高了GaN成核密度,使得GaN外延膜螺位错密度降低刃位错密度升高;而这些GaN外延膜位错密度的变化又进一步影响到LED的光电特性.     

Self-limiting MBE growth and characterization of three-dimensionally confined nanostructures on patterned GaAs (311)A substrates

The formation of triangular-shaped dot-like (TD) structures grown by molecular beam epitaxy on GaAs (311)A substrates patterned with square- and triangular-shaped holes is compared. On substrates patterned with square-shaped holes, TD structures are formed via the pinch-off of two symmetrically arranged {111} planes which develop freely in the regions between the holes on the original substrate surface, while the (111)A sidewalls of the as-etched holes develop a rough morphology during growth. The evolution of the rough (111)A sidewalls is eliminated on substrates patterned with triangular shaped holes resulting in similar TD structures with highly improved uniformity over the entire pattern. Spectrally and spatially resolved cathodoluminescence spectroscopy reveals the lateral variation of the quantum-well confinement energy in the TD structures generating distinct lateral energy barriers between the top portion and the nearby smooth regions with efficient radiative recombination. Formation of TD structures provides a new approach to fabricate three-dimensionally confined nanostructures in a controlled manner.     

Te-rich liquid phase epitaxial growth of HgCdTe on Si-based substrates

The growth of high quality (111)B oriented HgCdTe layers on CdZnTe/GaAs/Si and CdTe/Si substrates by Te-rich slider liquid phase epitaxy (LPE) is reported. Although the (111) orientation is susceptible to twinning, a reproducible process yielding twin-free layers with excellent surface morphology has been developed. The electrical properties and dislocation density in films grown on these substrates are comparable to those measured in HgCdTe layers grown on bulk CdTe substrates using the same LPE process. This is surprising in view of the large lattice mismatch that exists in these systems. We will report details of both the substrate and HgCdTe growth processes that are important to obtaining these results.     

LSAT(111)衬底上ZnO单晶薄膜的分子束外延生长

利用射频等离子体辅助分子束外延技术,在LSAT(111)衬底上制备高质量ZnO单晶薄膜.研究了衬底表面预处理及生长温度对ZnO外延膜的生长过程、外延取向关系以及表面形貌的影响.发现在较低温度下生长ZnO时,薄膜中容易形成30. 旋转畴,而在较高温度下,可完全消除薄膜中的旋转畴,得到具有单一畴的ZnO单晶薄膜，讨论了旋转畴的起源以及生长温度对于消除旋转畴的作用.锐利的3×3 RHEED图像验证了ZnO薄膜具有O极性     

ZnO Grown on (111) ZnS Substrates by Plasma-Assisted Molecular Beam Epitaxy

ZnO thin films have been grown by plasma-assisted molecular beam epitaxy on (111) ZnS substrates. The films grown on Zn-face substrates showed better structural and optical properties compared with those grown on S-face substrates, as demonstrated by x-ray diffraction and photoluminescence measurements. Scanning electron microscopy measurements indicated that ZnO films grown on Zn-face substrates also have smoother surface morphology. It is also found that higher growth temperature yields films with better quality.     

Investigation of distribution and redistribution of silicon in thin doped gallium-arsenide layers grown by molecular beam epitaxy on substrates with (100), (111)Ga, and (111)As orientations

The distribution of silicon in GaAs was investigated by secondary-ion mass spectrometry (SIMS) before and after the thermal annealing of thin doped GaAs layers grown by molecular beam epitaxy on substrates with (100), (111)Ga, and (111)As orientations. The surface relief pattern of the grown epitaxial films was studied by atomic-force microscopy both inside and outside the ion-etching crater developed during the SIMS analysis. Features of the surface relief inside the crater are revealed for various orientations. Changes observed in the shape of doping profiles are explained both by the features of the development of the surface relief during the ion etching accompanying the SIMS analysis and by an accelerated diffusion of Si over the growth defects.     

Growth and characterization of hot-wall epitaxial CdTe on (111) HgCdTe and CdZnTe substrates

Thin CdTe films were deposited by hot-wall epitaxy (HWE) on (111) HgCdTe and CdZnTe substrates at temperatures from about 140 to 335°C. X-ray rocking curves were used to show that crystal quality of the CdTe (111)B films improved as substrate temperature increased from 140 to about 250°C. Rocking curve values for full width at half maximum (FWHM) decreased from 2–4 degrees at 140–150°C to less than 100 arc-s at 250°C, and a FWHM of 59 arc-s was the lowest value observed near 250°C. The FWHM of the HWE CdTe was found to be insensitive to growth rate below about 400Å/min, but increased to four degrees at 1250Å/min. X-ray diffraction confirmed that films grown on the B-face at higher temperatures were epitaxial, but contained a significant volume fraction, 35% to 50%, of rotational in-plane twins. Electron microscopy confirmed a coarse twin density, and photoluminescence spectra showed an absence of excitonic emission in the HWE films. Simultaneous growth on two (111) HgCdTe substrates with different surface polarities between 230°C and 335°C showed that deposition rate on the A-face decreased relative to that on the B-face as temperature increased. Films grown on the B-face exhibited better surface morphologies than those grown on the A-face.     

X-ray photoelectron spectroscopy of gallium nitride films grown by radical-beam gettering epitaxy

Thin GaN films were grown on GaAs(111) substrates by radical-beam gettering epitaxy. The structural quality of the films was studied by high-resolution x-ray diffraction. The chemical composition of the GaAs surface and GaN film was studied by x-ray photoelectron spectroscopy. It is shown that Ga-N and As-N bonds are formed on the GaAs surface at initial growth stages at low temperatures. The state of the film-substrate interface was studied. It was found that prolonged annealing of GaN films in nitrogen radicals shifts the composition to nitrogen excess.     

Growth optimization and optical properties of GaAs-(Ga,Al)As quantum well structures on UV-ozone prepared nominal (111)B GaAs surfaces

GaAs and (Ga,Al)As---GaAs quantum well (QW) structures have been grown by molecular beam epitaxy on nominal (111)B oriented GaAs substrates. The substrate preparation technique involving UV-ozone oxidation was observed to lead to a rough surface after oxide desorption. Mirror-like layer surfaces have nevertheless been achieved by applying a careful procedure during the first stages of growth in order to recover surface flatness. New evidence of planarization is presented, based on the frequency analysis of reflection high-energy electron diffraction (RHEED) intensity oscillations during growth. QWs grown at a moderate substrate temperature (about 610°C) have been obtained with sharp excitonic transitions whose photoluminescence (PL) emission linewidths are comparable to those obtained on misoriented (111)B substrates. In contrast, the use of higher substrate temperatures was found to provide rougher interfaces due to GaAs sublimation during growth interruption at each interface, as revealed by continuous wave and time-resolved PL measurements.     

Growth of GaN on porous SiC and GaN substrates

We have studied the growth of GaN on porous SiC and GaN substrates, employing both plasma-assisted molecular-beam epitaxy (PAMBE) and metal-organic chemical-vapor deposition (MOCVD). For growth on porous SiC, transmission electron microscopy (TEM) observations indicate that the epitaxial-GaN growth initiates primarily from surface areas between pores, and the exposed surface pores tend to extend into GaN as open tubes and trap Ga droplets. The dislocation density in the GaN layers is similar to, or slightly less than, that observed in layers grown on nonporous substrates. For the case of GaN growth on porous GaN, the overgrown layer replicates the underlying dislocation structure (although considerable dislocation reduction can occur as this overgrowth proceeds, independent of the presence of the porous layer). The GaN layers grown on a porous SiC substrate were found to be mechanically more relaxed than those grown on nonporous substrates; electron-diffraction patterns indicate that the former are free of misfit strain or are even in tension after cooling to room temperature.     

Microstructural Characterization of HgCdSe Grown by Molecular Beam Epitaxy on ZnTe/Si(112) and GaSb(112) Substrates

Transmission electron microscopy and small-probe microanalysis have been used to investigate the microstructure of HgCdSe thin films grown by molecular beam epitaxy on ZnTe/Si(112) and GaSb(112) substrates. The quality of the HgCdSe material was dependent on the growth temperature and materials flux, independent of the substrate. Samples grown at 100°C were generally of high quality, while those grown at 140°C had {111}-type stacking defects and increased dislocation densities. Improved preparation of the GaSb buffer layer should be developed for future HgCdSe growth on GaSb(112) substrates.     

MOCVD外延碲镉汞薄膜的生长工艺选择

金属有机化合物汽相沉积（ＭＯＣＶＤ）技术是制备用于红外焦平面阵列（ＩＲＦＦＰＡ）的高质量碲镉汞（ＨｇＣｄＴｅ）薄膜材料的重要手段。文中讨论了汞源温度、生长温度、衬底材料及互扩散多层工艺（ＩＭＰ）等因素在ＭＯＣＶＤ外延生长碲镉汞薄膜过程中的作用机理,并选择适合的生长条件获得了质量优良的碲镉汞薄膜。     

Growth and characterization of n-type GaAs/AlGaAs quantum well infrared photodetector on GaAs-on-Si substrate

We present in this article device characteristics of molecular beam epitaxy grown GaAs/AlGaAs quantum well infrared photodetectors (QWIP) on a semi-insulating GaAs substrate and on a GaAs-on-Si substrate grown by metalorganic chemical vapor deposition (MOCVD). Important issues for QWIP application such as dark current, spectral response, and absolute responsivity were measured. We find that the detector structure grown on a GaAs-on-Si substrate exhibits comparable dark current and absolute responsivity and a small blue shift in the spectral response. This is the first demonstration of long wavelength GaAs/AlGaAs quantum well infrared photodetector using MOCVD grown GaAs-on-Si substrate and the performance is comparable to a similar detector structure grown on a GaAs substrate.     

Effect of growth pressure on indium incorporation during the growth of InGaN by MOCVD

The effect of the growth pressure on the In incorporation in InGaN thin films, grown by metalorganic chemical vapor deposition (MOCVD) have been investigated. The InGaN thin films were grown by varying the growth pressures, while maintaining all other growth parameters constant. Photoluminescence and high resolution x-ray diffraction (XRD) measurements showed that the In incorporation in the InGaN thin film was drastically increased with decreasing growth pressures. XRD analysis also revealed that the In concentration in the films was increased by 7.5% as the growth pressure was decreased from 250 torr to 150 torr. This can be attributed to the enhanced mass transportation of precursor gases through the boundary-layer on the substrate in the MOCVD system.     

Assessment of MOCVD- and MBE-growth GaAs for high-efficiency solarcell applications

A critical assessment of the photovoltaic quality of epitaxial GaAs grown by metal-organic chemical vapor deposition (MOCVD) and by molecular-beam epitaxy (MBE) is reported. Epitaxial films of nominally identical structure were grown by the two techniques and were fabricated into p-n heteroface solar cells. The 0.5-cm by 0.5-cm cells were then characterized and compared. The MOCVD-grown films produced independently verified record efficiency cells of 24.8% under 1-sun AM1.5 global conditions while the MB-grown films produced similarly high efficiencies of 23.8%. The material qualities of the two films in terms of minority-carrier diffusion lengths and surface recombination velocities were quite comparable. These results demonstrate that the quality of MBE-grown films can be quite comparable to the best MOCVD-grown films and that they are suitable for high-efficiency solar cells     

HWE生长条件对CdTe/Si薄膜结构特性的影响

研究了热壁外延(HWE)生长条件对Si(100)衬底上沉积外延的多晶CdTe薄膜的晶粒尺寸和取向的影响.用SEM和XRD技术分析了不同外延时间、不同衬底温度及不同源温下外延膜的表面形貌和结构特征.SEM发现随着外延时间的增加或衬底温度的提高,晶粒尺寸明显增大;XRD显示所有的外延薄膜均为面心立方结构,并高度显示优势取向(111),且随着衬底温度或薄膜厚度的增加,(111)峰的衍射强度增加,显示薄膜的择优取向更好.其原因是面心立方结构中,(111)表面具有的表面自由能最低.通过对不同外延时间下薄膜厚度的测试发现,薄膜具有加速生长趋势.衬底温度及源温对外延层厚度均有较大的影响.     

c轴择优取向AlN薄膜的制备研究

采用MOCVD法在蓝宝石(0001)单晶衬底上生长AlN压电薄膜。用XRD和原子力显微(AFM)技术表征薄膜的微观结构。研究了衬底温度、TMA和NH3流量、反应室气压对AlN薄膜织构特性的影响,并对薄膜生长的工艺参数进行了相应优化。结果表明:在优化条件下制备的AlN薄膜高度c轴择优取向,(0002)峰摇摆曲线半高宽仅为0.10°,且薄膜表面平整,椭圆偏振法测出其折射率为2.0～2.4。