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1.
大应变In0.3Ga0.7As/GaAs量子阱激光器的生长和研究 总被引:1,自引:0,他引:1
金属有机物化学气相沉积(MOCVD)方法生长应变InGaAs/GaAs量子阱,应变缓冲层结合生长中断改善量子阱的PL谱特性.用该量子阱制备的激光器有很低的阈值电流密度(43A/cm^2)和较高的斜率效率(0.34W/A,per facet). 相似文献
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InGaAs/GaAs应变量子阱激光器MOCVD生长研究 总被引:3,自引:2,他引:1
采用金属有机物化学气相淀积(MOCVD)方法生长了InGaAs/GaAs应变量子阱(QW),通过降低生长温度、提高生长速度以及采用应变缓冲层(SBL)结构,改善了应变QW生长表面质量和器件荧光(PL)谱特性,实验表明,通过优化工艺条件和采用SBL等手段提高了应变QW质量。生长的QW结构用于1054 nm激光器的制作,经测试,器件具有较低的阈值电流和较高的单面斜率效率,性能较好。 相似文献
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InGaAs/AlGaAs量子阱中量子尺寸效应对PL谱的影响 总被引:1,自引:1,他引:0
本文采用金属有机物化学气相淀积(MOCVD)方法设计并生长了两组InGaAs/A1GaAs应变多量子阱,量子阱的厚度分别为3nm和6nm,对其光致发光谱(PL)进行了研究,二者的发光波长分别为843nm和942nm,用有限深单量子阱理论近似计算了由于量子尺寸效应和应变效应引起的InGaAs/A1GaAs量子阱带隙的改变,这解释了两组样品室温下PL发射波长变化的原因。 相似文献
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利用金属有机化学气相沉积(MOCVD)技术,在不同偏向角的GaAs衬底上生长了InGaAs/GaAs单量子阱外延结构。通过对样品室温光致发光(PL)谱测试结果的分析,讨论了衬底偏向角、量子阱层生长温度以及V/III比对外延片发光波长、发光强度及PL谱半峰全宽(FWHM)的影响。发现在相同生长条件下,对于InGaAs/GaAs应变量子阱结构,在GaAs(100)偏111A晶向较小偏向角的衬底上生长的样品PL谱发光强度较大,半峰全宽较窄;量子阱层低温生长的样品发光强度更强;增大量子阱层V/III比可以提高样品的发光强度,同时PL谱峰值波长出现红移。 相似文献
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研制了InGaAs/AlGaAs SQW激光器,对其工作特性如阈值电流密度、激射波长、特征温度、远场分布等进行了研究.
用MOCVD方法生长制备了InGaAs/AlGaAs分别限制单量子阱结构材料,得出其各层组分和能带分布.首先在GaAs衬底上生长GaAs缓冲层和AlGaAs波导层,然后生长窄能带的AlGaAs量子阱势垒层,再继续生长InGaAs量子阱有源区.其后继续生长AlGaAs势垒层、高Al组分AlGaAs波导层和GaAs高掺杂欧姆接触层.我们发现在低温范围里(160 K~220 K)阈值电流密度随温度升高而减小,与普通量子阱激光器正相反,表现出负的特征温度.随着温度进一步提高,阈值电流密度表现出指数式增大.300 K下腔长2000 μm的激光器最低的阈值电流密度约为200 A/cm2.(OD7) 相似文献
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聚对苯撑苯并双(口恶)唑发光及其器件制备 总被引:2,自引:0,他引:2
采用光谱技术,研究了聚对苯撑苯并双(口恶)唑(PBO)溶液的光敏发光特性,并用相对法估算出溶液发光效率在50%范围.结合光谱技术、半导体电学和电化学等研究手段,具体研究了以PBO为发光层的单层电致发光器件,研究结果显示,电致发光与薄膜的光致发光有具有相同的发光中心,峰值位于510 nm左右.同时发现,由于存制备过程中不同处理条件使得不同厚度薄膜残留的掺杂物质浓度不同,从而引起薄膜的导电性的不同.使得器件的阈值场强随PBO厚度的减小而逐渐增加. 相似文献
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在高密度小尺寸的系统级封装(SiP)中,对供电系统的完整性要求越来越高,多芯片共用一个电源网路所产生的电压抖动除了会影响到芯片的正常工作,还会通过供电网路干扰到临近电路和其他敏感电路,导致芯片误动作,以及信号完整性和其他电磁干扰问题.这种电压抖动所占频带相当宽,几百MHz到几个GHz的中频电源噪声普通方法很难去除.结合埋入式电容和电源分割方法的特点,提出一种新型高性能埋入式电源低通滤波结构直接替代电源/地平面.研究表明,在0.65~4GHz的频带内隔离深度可达-40~75 dB,电源阻抗均在0.25ohm以下,实现了宽频高隔离度的高性能滤波作用.分别用电磁场和广义传输线两种仿真器模拟,高频等效电路模型分析这种低通滤波器的工作原理以及结构对隔离性能的影响,并进行了实验验证. 相似文献
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Aluminium was a primary material for interconnection in integrated circuits (ICs) since their inception. Later, copper was introduced as interconnect material which has better metallic conductivity and resistance to electromigration. As the aggressive technology scaling continues, the copper resistivity increased because of size effects, which causes increase in delay, power dissipation and electromigration. The need to reduce the resistor-capacitor??????? delay, dynamic power utilisation and the crosstalk commotion is as of now the fundamental main impetus behind the presentation of new materials. The purpose of this paper is to do a survey of interconnect material used in IC from introduction of ICs to till date. This paper studies and reviews new materials available for interconnect application which are optical interconnects, carbon nanotube (CNT), graphene nanoribbons (GNRs) and silicon nanowires which are alternatives to copper. While doing a survey of interconnect material, it is found that multiwalled CNTs, multilayer GNR and mixed CNT bundles are promising candidates and are ultimate choice that can strongly address the problems faced by copper but on integration basis copper would last for coming years. 相似文献
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C. Fulk R. Sporken J. Dumont D. Zavitz M. Trenary B. Gupta G. Brill J. Dinan S. Sivananthan 《Journal of Electronic Materials》2005,34(6):846-850
We investigate the properties of arsenic (As) covered Si(211) and Si(311) surfaces by analyzing data from x-ray photoelectron
spectroscopy (XPS) and low-energy electron diffraction (LEED) images. We then create a model using total surface energy calculations.
It was found that both Si(211) and Si(311) had 0.68±0.08 surface As coverage. Si(211) had 0.28±0.04 Te coverage and Si(311)
had 0.24±0.04 Te coverage. The Si(211) surface replaces the terrace and trench Si atoms with As for a lower surface energy,
while the Si edge atoms form dimers. The Si(311) surface replaces all terrace atoms and adsorbs an As dimer every other edge
site. These configurations imply an improvement in the mean migration path from the bare silicon surface by allowing the impinging
atoms for the next epitaxial layer, tellurium (Te), to bind at every other pair of edge atoms, and not the step terrace sites.
This would ensure a nonpolar, B-face growth. 相似文献
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光子晶体微腔发光二极管 总被引:1,自引:0,他引:1
光子晶体微腔因其具有增强自发辐射、定向输出和单模工作的能力而受到广泛关注。介绍了光子晶体微腔发光二极管的基本原理、设计、特性、制作及其典型器件。 相似文献
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基于新型共源共栅电流源的积分方法,设计了一种用于单光子飞行时间(TOF)测量的时间-幅度变换器(TAC)。该方法有效简化了TAC电路结构,减小了TAC占用面积,显著提高了TOF的满量程范围(FSR)。采用0.18 μm标准CMOS工艺设计。集成TAC的单光子探测器像素单元的填充因子可达到26.8%。后仿真结果表明,该TAC在120 ns的FSR内具有230 ps的定时分辨率,微分非线性(DNL)低于0.05 LSB,积分非线性(INL)低于1.1 LSB。蒙特卡洛仿真表明,512个TAC像素间的不均匀性低于0.5 %。该TAC非常适用于高密度时间相关的单光子计数(TCSPC)探测器阵列。 相似文献
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The power generation demand is increasing day-by-day throughout the world, therefore, the use of hybrid systems becomes a significant solution. The hybrid renewable energy system (HRES) is used for delivering power in various regions in order to overcome intermittence of wind and solar resources. Because of increasing environmental problems, for example, greenhouse gas emission and energy cost have interested novel research into substitute methods in favour of electrical power generation. Maximum Power Point Tracking (MPPT) control method is a vast deal of novel research used for enhancing the efficiency of HRES. The authors have revealed that the hybrid techniques i.e. Global MPPT, fuzzy-neuro systems, Adaptive Neuro-Fuzzy Inference System (ANFIS), Perturbed and Observe (P&O) + Adaptive Neural Network (ANN) etc. can provide best results as compared to other MPPT control methods. This paper offering a state of art review of MPPT control techniques for HRES. 相似文献
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级联多个循环冗余校验(CRC)的LDPC译码算法有效地改善了译码的收敛特性。然而在其译码算法中,当CRC检测的整体漏检概率不够低时,出现误码平台。因此,该文提出了改进算法,通过减少在译码算法中CRC检测的次数,降低整体漏检概率,提高了误码性能。仿真表明改进的算法提高了误码性能,译码复杂度也增加不大。 相似文献
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多孔硅发光机制的分析 总被引:4,自引:0,他引:4
从量子力学的基本理论出发讨论了量子限制效应,推导出多孔硅有效禁带宽度增量并用量子限制效应和表面态及其物质在发光中作用的理论解释了PS光致发光的实验现象。 相似文献
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Roskowski A. M. Preble E. A. Einfeldt S. Miraglia P. M. Davis R. F. 《Journal of Electronic Materials》2002,31(5):421-428
High-resolution x-ray diffraction (XRD) and atomic force microscopy (AFM) of pendeo-epitaxial (PE) GaN films confirmed transmission
electron microscopy (TEM) results regarding the reduction in dislocations in the wings. Wing tilt ≤0.15° was due to tensile
stresses in the stripes induced by thermal expansion mismatch between the GaN and the SiC substrate. A strong D°X peak at
≈3.466 eV (full-width half-maximum (FWHM) ≤300 μeV) was measured in the wing material. Films grown at 1020°C exhibited similar
vertical [0001] and lateral [11
0] growth rates. Increasing the temperature increased the latter due to the higher thermal stability of the GaN(11
0). The (11
0) surface was atomically smooth under all growth conditions with a root mean square (RMS)=0.17 nm. 相似文献