原位XPS分析Al2O3作为势垒层的Er2O3/Si结构

在超高真空条件下,通过脉冲激光沉积(PLD)技术制作了Er2O3/Al2O3/Si多层薄膜结构,原位条件下利用X射线光电子能谱(XPS)研究了Al2O3作为势垒层的Er2O3与Si界面的电子结构.XPS结果表明,Al2O3中Al的2p芯能级峰在低、高温退火前后没有变化;Er的4d芯能级峰来自于硅酸铒中的铒,并非全是本征氧化铒薄膜中的铒;衬底硅的芯能级峰在沉积Al2O 3时没有变化,说明Al2O3薄膜从沉积到退火不参与任何反应,与Si界面很稳定;在沉积Er2O3薄膜和退火过程中,有硅化物生成,表明Er2O3与Si的界面不太稳定,但随着Al2O3薄膜厚度的增加,其硅化物中硅的峰强减弱,含量减少,说明势垒层很好地起到了阻挡扩散的作用.     

(Si,Er)双注入热氧化SiO_2/Si薄膜的表面结构及1.54μm光发射

利用金属蒸气真空弧 (MEVVA)离子源将 Si和 Er离子双注入到不同厚度热氧化 Si O2 / Si薄膜中获得 Er掺杂硅基发光薄膜 .掺杂到热氧化 Si O2 / Si薄膜表面的 Er原子浓度可达到～ 10 % ,即体浓度～ 10 2 1 cm- 3 .热氧化 Si O2膜越厚 ,溅射后 Si O2 保留量越多 ;再结晶硅颗粒结晶程度提高 ,逐渐纳米化 ;未见有大量的 Er偏析或铒硅化物形成 ,Er大部分以固溶形式存在 .在 77K下获得了较强 1.5 4μm光致发光信号 ,室温下发光强度温度猝灭不明显     

SiO_x∶Er薄膜材料光致发光特性的研究

采用射频磁控反应溅射技术,以Er2O3和Si为靶材,制备了SiOx∶Er薄膜材料,在不同温度和不同时间下进行退火处理,室温下测量了样品的光致发光(PL)谱,观察到Er3+在1 530,1 542和1 555 nm处波长的发光,发现退火能明显增强Er3+的发光。研究了退火温度和时间对SiOx∶Er薄膜光致发光的影响,发现Er2O3与Si面积比为1∶1时,1 100℃下20 min退火为样品的最佳退火条件。采用XRD和材料光吸收测试对样品结构和光学性质进行了研究,得到样品中Si晶粒大小为1.6 nm,样品的光学带隙为1.56 eV。对3种不同Er2O3与Si面积比的SiOx∶Er薄膜材料进行研究,得到Er2O3与Si面积比为1∶3为样品的最佳配比,对薄膜材料发光现象进行了探讨。     

SiOx:Er薄膜材料光致发光特性的研究

采用射频磁控反应溅射技术,以Er2O3和Si为靶材,制备了SiOx:Er薄膜材料,在不同温度和不同时间下进行退火处理,室温下测量了样品的光致发光(PL)谱,观察到Er3+在1 530,1 542和1 555 nm处波长的发光,发现退火能明显增强Er3+的发光.研究了退火温度和时间对SiOx:Er薄膜光致发光的影响,发现Er2O3与Si面积比为1∶1时,1 100℃下20 min退火为样品的最佳退火条件.采用XRD和材料光吸收测试对样品结构和光学性质进行了研究,得到样品中Si晶粒大小为1.6 nm,样品的光学带隙为1.56 eV.对3种不同Er2O3与Si面积比的SiOx:Er薄膜材料进行研究,得到Er2O3与Si面积比为1∶3为样品的最佳配比,对薄膜材料发光现象进行了探讨.     

掺铒对激光烧蚀制备纳米硅晶薄膜形貌的影响

在2×10-4 Pa真空下，采用XeCl准分子激光器(波长308 nm)，调整激光单脉冲能量密度为3 J/cm2，交替烧蚀高纯单晶硅(Si)靶和铒(Er)靶，通过调整辐照两靶的激光脉冲个数比来控制掺Er浓度，分别在Si衬底和石英衬底上制备了掺Er非晶Si薄膜。在N2气保护下经高温热退火实现纳米晶化，退火时间为30 min。采用扫描电子显微镜(SEM)观察所得到的样品的表面形貌显示，铒掺杂影响着薄膜的表面形貌，与不掺Er情况相比，掺入适量的Er可以在较低的退火温度下得到晶粒尺寸分布更均匀的薄膜;拉曼谱的测量结果表明，在相同的退火温度下，Er的掺入有利于晶粒的长大，但同时降低了薄膜的晶化度，掺Er非晶Si薄膜要实现完全晶化需要更高的退火温度。     

Er离子注入Al2O3光波导薄膜的发光特性研究

采用溶胶-凝胶和离子注入复合工艺在氧化的Sio2/Si(100)基片上制备掺Er3+:Al2O3光学薄膜.900℃烧结,掺Er3+:Al2O3薄膜的相结构是γ-Al,Er)2O3和θ-(Al,Er)2O3的混合物.室温下测量不同注入剂量的掺Er3+:Al2O3光学薄膜的光致发光谱,均获得了中心波长为1.533 pm的发光曲线.900℃烧结制备掺EPr3+:Al23光学薄膜光致发光强度随着注入剂量从0.2×1016 cm-2增加到4×l016cm-2而逐渐增加.而1200℃烧结制备掺Er3+:Al2O3光学薄膜的光致发光强度随着掺杂浓度从0.2×1016 cm-2增加到4×1016grN-2先增加后减小.     

离子注入制备掺铒富硅氧化硅退火温度对光致发光的影响

研究了离子注入掺铒富硅氧化硅材料的光致发光和发光强度随退火温度的变化.在实验中发现,材料在1.54 μm处的发光波形与发光强度均与退火温度有关.在1100℃退火条件,材料形成较好的硅纳米晶,提高了Er的激发和发光效率.在T>100K时,Er发光的温度淬灭与非晶硅的含量有关,1100℃退火样品的温度淬灭效应比较小.     

a-SiN_xO_y∶Er~(3+)薄膜的光致发光

采用射频 (RF)反应共溅射法制备了 a- Si Ox Ny∶ Er3+薄膜 ,在不同温度下进行退火处理 ,并测量了样品的可见及红外发光 PL谱 ,观察到 Er3+ 在 5 5 0 nm、5 2 5 nm和 15 32 nm的发光以及基质在 6 2 0 nm和 72 0 nm的发光 .发现退火能明显增强 Er3+ 的发光且对可见和红外发光的影响不同 ,讨论了退火明显增强 Er3+ 发光及退火对可见和红外发光影响不同的机理 .测量了 Er3+ 可见发光的变温 PL谱 ,讨论了退火对 Er3+ 不同能级辐射跃迁几率的影响 .根据基质发光随退火温度的变化 ,分析了基质发光峰的起源     

掺Al富Si/SiO2薄膜制备及紫外发光特性研究

采用射频磁控溅射技术制备出掺Al的富Si/SiO2复合薄膜,以不同退火温度对样品进行热处理.对样品进行X射线衍射(XRD)、X射线光电子能谱(XPS)、红外吸收光谱(FTIR)、光致发光(PL)和光致发光激发谱(PLE)检测.结果表明SiO2薄膜中存在纳米Si晶粒,并且含有AlOx成分.室温下,可以观察到位于3.24～3.42 eV的较强紫外光致发光,其发光强度随退火温度和Al含量的变化而变化.分析表明该发光带与SiO2中的氧空位缺陷有关,缺陷分布与纳米Si的形成以及不同Al含量的氧化有关,从而影响薄膜发光强度.     

在SiO_2中掺Al对Au/纳米(SiO_2/Si/SiO_2)/p-Si结构电致发光的影响

利用射频磁控溅射方法 ,制成纳米 Si O2 层厚度一定而纳米 Si层厚度不同的纳米 (Si O2 / Si/ Si O2 ) / p- Si结构和纳米 (Si O2 ∶ Al/ Si/ Si O2 ∶ Al) / p- Si结构 ,用磁控溅射制备纳米 Si O2 ∶ Al时所用的 Si O2 / Al复合靶中的 Al的面积百分比为 1% .上述两种结构中 Si层厚度均为 1— 3nm ,间隔为 0 .2 nm .为了对比研究 ,还制备了 Si层厚度为零的样品 .这两种结构在 90 0℃氮气下退火 30 m in,正面蒸半透明 Au膜 ,背面蒸 Al作欧姆接触后 ,都在正向偏置下观察到电致发光 (EL ) .在一定的正向偏置下 ,EL强度和峰位以及电流都随 Si层厚度的增加而     

脉冲激光溅射沉积光学增益薄膜实验研究

用脉冲激光沉积方法,以多靶交替溅射方式,在SiO2/Si基底上沉积镱铒共掺Al2O3光学薄膜,讨论了脉冲激光能量对薄膜沉积速率、表面形貌、光致发光强度的影响.在脉冲激光能量较高条件下制备出的薄膜的光致发光性能较好,脉冲激光能量较低条件下制备出的薄膜的表面形貌较均匀.综合放大器增益系数对光致发光强度和光刻工艺对薄膜表面形貌的要求,薄膜应该在合适的激光能量下制备.脉冲激光溅射沉积方法与中频磁控溅射方法相比,在抑制上转换发光方面具有优越性.     

Nanostructure of Er3+ doped silicates

We demonstrate nanostructural evolution resulting in highly increased photoluminescence in silicates doped with Er3+ ions. High-resolution transmission electron microscopy (HRTEM) imaging, nano-energy dispersed X-ray (NEDX) spectroscopy, X-ray diffraction (XRD) and photoluminescence analysis confirm the local composition and structure changes of the Er3+ ions upon thermal annealing. We studied two types of amorphous nanopowder: the first is of the composition SiO2/18Al2O3/2Er2O3 (SAE), synthesized by combustion flame-chemical vapor condensation, and the second is with a composition of SiO2/8Y2O3/2Er2O3 (SYE), synthesized by sol-gel synthesis (composition in mol%). Electron diffraction and HRTEM imaging clearly show the formation of nanocrystallites with an average diameter of approximately 8 nm in SAE samples annealed at 1000 degrees C and SYE samples annealed at 1200 degrees C. The volume fraction of the nanocrystalline phase increased with each heat treatment, eventually leading to complete devitrification at 1400 degrees C. Further XRD and NEDX analysis indicates that the nanocrystalline phase has the pyrochlore structure with the formula Er(x)Al(2-x)Si2O7 or Er(x)Y(2-x)Si2O7 and a surrounding silica matrix.     

Photoluminescence from Er-implanted polycrystalline 3C SiC

Erbium (Er) ions were implanted into polycrystalline 3C silicon carbide (SiC), and were characterized by photoluminescence (PL) measurements and Rutherford backscattering spectrometry (RBS) channeling analysis. The optimum annealing temperature and Er dose for SiC:Er were 1600°C and 3×10¹³ cm^-2, respectively. PL intensity decreased at 1700°C, and the bandedge luminescence changed in relation to the luminescence of Er³⁺. The decrease in the PL intensity of Er³⁺ may be due to the sublimation of Si atoms and the decrease in excitation volume of PL. The PL intensity of SiC:Er,O (SiC:Er coimplanted with oxygen) was twice as strong as that of SiC:Er, whereas no other PL peaks were observed. Thermal quenching of the luminescence of Er³⁺ was suppressed by using SiC with a wide band gap as a host material and the Er³⁺-PL was observed at room temperature (RT). Our present results suggest that the transfer of the recombination energy of electron-hole pairs generated in SiC to the Er-4f-shell via the Auger effect causes the luminescence of Er³⁺ in SiC:Er     

PLD法制备ZnO薄膜的退火特性和蓝光机制研究

通过脉冲激光沉积(PLD)方法,在O2中和100～500℃衬底温度下,用粉末靶在Si(111)衬底上制备了ZnO薄膜,在300℃温度下生长的薄膜在400～800℃温度和N2氛围中进行了退火处理,用X射线衍射(XRD)谱、原子力显微镜(AFM)和光致发光(PL)谱表征薄膜的结构和光学特性。XRD谱显示,在生长温度300℃时获得较好的复晶薄膜,在退火温度700℃时获得最好的六方结构的结晶薄膜;AFM显示,在此退火条件下,薄膜表面平整、晶粒均匀;PL谱结果显示,在700℃退火时有最好的光学特性。     

SiO_2:Er和Si_xO_2:Er薄膜室温Er~(3+)1.54μm波长的电致发光

在 n+ -Si衬底上用磁控溅射淀积掺 Er氧化硅 (Si O2 :Er)薄膜和掺 Er富硅氧化硅 (Six O2 :Er,x>1 )薄膜 ,薄膜经适当温度退火后 ,蒸上电极 ,形成发光二极管 (LED)。室温下在大于 4V反偏电压下发射了来自 Er3+的 1 .5 4μm波长的红外光。测量了由 Si O2 :Er/n+ -Si样品和 Six O2 :Er/n+ -Si样品分别制成的两种 LED,其 Er3+1 .5 4μm波长的电致发光峰强度 ,后者明显比前者强。还发现电致发光强度与 Si O2 :Er/n+ -Si样品和 Six O2 :Er/n+ -Si样品的退火温度有一定依赖关系     

RTA effects on the formation process of embedded luminescent Si nanocrystals in SiO2

It is well known that Si ion implantation into SiO₂ and subsequent high temperature anneals induce the formation of embedded luminescent Si nanocrystals. In this work, the potentialities of rapid thermal annealing to enhance the photoluminescence as well as those to induce low temperature formation of luminescent Si nanocrystals have been investigated. Ion implantation was used to synthesize specimens of SiO₂ containing supersaturated Si with different concentrations. The implanted samples were rapidly annealed only for a few minutes. After that, in some cases before that, the samples were annealed for a few hours using a conventional tube furnace to induce Si precipitation. Photoluminescence spectra were measured at various stages of anneal processes. The luminescence intensity is strongly enhanced with a rapid thermal annealing prior to a conventional furnace anneal. The luminescence intensity, however, decreases when rapid thermal annealing follows conventional furnace annealing. It is found that the order of heat treatment is an important factor in intensities of the luminescence. Enhancement is found to be typical for low dose samples. Moreover, the visible photoluminescence is found to be observed even after conventional furnace anneal below 1000 °C, only for rapidly thermal annealed samples. Based on our experimental results, we discuss the mechanism for the enhancement of the photoluminescence, together with the mechanism for the initial formation process of Si nanocrystals.     

The influence of irradiation and subsequent annealing on Si nanocrystals formed in SiO2 layers

Luminescent Si nanocrystals formed in SiO₂ layers were irradiated with electrons and He⁺ ions with energies of 400 and 25–130 keV, respectively. The effects of irradiation and subsequent annealing at 600–1000°C were studied by the methods of photoluminescence and electron microscopy. After irradiation with low doses (～1 displacement per nanocrystal), it was found that photoluminescence of nanocrystals was quenched but the number of them increased simultaneously. After irradiation with high doses (～10³ displacements per nanocrystal), amorphization was observed, which is not characteristic of bulk Si. The observed phenomena are explained in terms of the generation of point defects and their trapping by Si-SiO₂ interfaces. Photoluminescence of nanocrystals is recovered at annealing temperatures below 800°C; however, an annealing temperature of about 1000°C is required to crystallize the precipitates. An enhancement of photoluminescence observed after annealing is explained by the fact that the intensities of photoluminescence originated from initial nanocrystals and from nanocrystals formed as a result irradiation are summed.     

Free-standing SiO2 films containing Si nanocrystals directly suitable for transmission electron microscopy

Free-standing SiO_x films were prepared by molecular beam deposition following back side Silicon (Si) wafer etching in tetramethyl ammonium hydroxide (TMAH) solution. Transmission Electron Microscopy confirms the presence of Si nanocrystals in the as-prepared film. Raman spectroscopy show that deep structural film reorganization appears during high temperature laser treatment. The laser annealing decreases photoluminescence from the films.     

Thermal stability of vertically coupled InAs-GaAs quantum dot arrays

The effect of high-temperature annealing on the optical properties of vertically coupled InAs quantum dots in a GaAs matrix and on the performance of a quantum-dot laser are studied. A strong blue shift of the photoluminescence peak and lasing line, as well as changes in the photoluminescence intensity and temperature dependence of the threshold current density are observed. The reason for this behavior is probably a reduction in the carrier localization energy due to a partial mixing of the In and Ga atoms as well as an improvement in the quality of the low-temperature grown Ga(Al)As layers achieved by high-temperature annealing. Fiz. Tekh. Poluprovodn. 31, 104–108 (January 1997)