实现多层混合刻蚀薄膜大面积均匀的方法浅探讨

采用多层光刻工艺结合氩离子铣的混合刻蚀方法，刻蚀高Ｔｃ超导ＹＢａＣｕＯ／ＺｒＯ２（１００）薄膜图形，取得了较好的结果，在进行氩离子铣的工艺步骤中，使用普通氩离子铣设备，但采取了一定的措施－使被刻样吕在刻蚀台座上可移动。     

YBa_2Cu_3O_（7－δ）高温超导薄膜线列探测器的研究

采用准分子激光扫描消融法淀积性能均匀的ＹＢａ_２Ｃｕ_３Ｏ_（７－δ）高温超导薄膜，用离子束刻蚀进行器件的图形制备，获得了非均匀性小于１０％的ＹＢａ_２Ｃｕ_３Ｏ_（７－δ）高温超导薄膜８元线列探测器．测试了器件在８～１４μｍ波段的性能及光响应特性，单元探测器为４０×１００μｍ２的微桥结构．器件的平均归一化探测率为１．４４×１０９ｃｍＨｚ１／２ｗ－１，平均噪声等效功率为４．４×１０－１２ＷＨｚ－１／２，Ｄ的非均匀性小于１０％．研究结果表明：该线列探测器具有良好的均匀性，证实了该工艺适用于制备均匀性良好的高温超导薄膜红外探测器阵列．     

（Pb,La）TiO3铁电薄膜的制备及热释电性能研究

讨论了ＰＬＴ１５铁电薄膜的溶胶－凝胶制备技术,及ＰＬＴ薄膜的结构和电性能研究。结果表明,在Ｓｉ基片上成功地生长出钙钛矿型结构多晶铁电薄膜,在（１１１）Ｐｔ／Ｔｉ／ＳｉＯ２／Ｓｉ上外延生长出（１１１）ＰＬＴ１５铁电薄膜。溶胶－凝胶制备的ＰＬＴ１５铁电薄膜具有优良的热释电性能,其热释电系数ｐ为５．２５×１０－８Ｃｃｍ－２Ｋ－１,电压响应率优值ＦＶ达到０．７８×１０－１０Ｃｃｍ／Ｊ,探测率优值Ｆｍ为１．１３×１０－８Ｃｃｍ／Ｊ,适于制备热释电红外探测器     

不锈钢基底高电流密度YBCO超导线材

室温下应用Ａｒ＋ 离子源辅助准分子脉冲激光沉积（００２）取向的ＹＳＺ（Ｙｔｔｒｉａ－ｓｔａｂｉｌｉｚｅｄ ｚｉｒｃｏ－ｎｉａ）过渡层薄膜于不锈钢基底上;基底加温至７５０℃,用准分子脉冲激光沉积高电流密度ＹＢＣＯ（ＹＢａ２Ｃｕ３Ｏ７－ ｘ） 高温超导线材。实验结果表明：ＹＢＣＯ 超导线材临界温度Ｔｃ ≥９０ Ｋ （Ｒ＝０）,临界电流密度Ｊｃ ≥１×１０６ Ａ／ｃｍ ２（７７ Ｋ,０ Ｔ）。     

高速集成电路中高温超导连线技术研究

本文研究了ＹＢＣＯ高温超导薄膜中原位溅射法生长优质膜的成膜技术，ＹＢＣＯ薄膜的Ｔｃｏ为９０Ｋ，Ｊｃｏ（７７Ｋ）为１０＾６Ａ／ｃｍ＾２；并建立了直流磁控溅射淀积速率的模型，还研究了微细加工形成超导薄膜导线的薄膜成形技术，在ＥＤＴＡ腐蚀法中，Ｔｃｏ仅下降１Ｋ，对超导特性影响下，本文着重研究了超导导线与高速集成电路的连续工艺，研制成功用高温超导连线的ＨＣＭＯＳ集成电路。     

YBCO薄膜红外探测器研究的新进展

用ＹＢＣＯ／ＬａＡｌＯ＿３薄膜制成的１ｍｍ红外探测器，经技术保护之后，寿命已达３年。其Ｄ（５００，１０，１）＝３．７×１０￣９ｃｍＨｚ￣（１／２）Ｗ￣（－１），ＮＥＰ（５００，１０，１）＝２．４×１０￣（－１１）ＷＨｚ￣（－１／２）；超导微桥（５０μｍ×１０μｍ）红外探测器，其Ｄ（５００，１０，１）＝１×１０￣９ｃｍＨｚ￣（１／２）Ｗ￣（－１），ＮＥＰ（５００，１０，１）＝２．３×１０￣（－１２）ＷＨｚ￣（－１／２）。     

2×8元列阵高温超导探测器研制

选用高Ｔｃ超导薄膜ＹＢａ２Ｃｕ３Ｏ７－８，引用半导体集成工艺，制出２×８元列阵红外探测器，其探测率Ｄ均达到１０＾８￣１０＾９ｃｍ·Ｈｚ＾１／２·Ｗ＾－１，工作温度为８９Ｋ。     

高性能5μm640×480蓝宝石衬底碲镉汞焦平面阵列

已研制出一种高性能５μｍ６４０×４８０蓝宝石衬底的ＨｇＣｄＴｅ／ＣｄＴｅ／Ａｌ＿２Ｏ＿３红外焦平面阵列（ＦＰＡ），在低于１２０Ｋ温度下，它有全电视兼容分辨率和优良的灵敏度．在９５Ｋ工作温度和１０￣（１４）光子数ｃｍ￣（－２）Ｓ￣（－１）的背景通量下，平均焦平面阵列Ｄ￣＊受背景限制，其值约为１×１０￣（１２）ｃｍＨｚ￣（１／２）Ｗ￣（－１），典型的平均量子效率为６０％～７０％。制造这种大面阵、高灵敏度器件的关键工艺，是在有稳定的ＣｄＴｅ缓冲层的蓝宝石衬底上，外延生长ＨｇＣｄＴｅ材料。在低于或等于１２０Ｋ的工作温度和３．４～４．２μｍ的波段内，相机的平均噪声等效温差ＮＥ△Ｔ为０．０１３Ｋ；该值比目前可实用的ＰｔＳｉ焦平面阵列相机的高一个数量级，而ＰｔＳｉ焦平阵列相机要求制冷到低于或等于７７Ｋ，才能保持其性能。     

半导体激光对GLC—82低分化肺腺癌细胞生长的影响

目的：研究波长６３０ｎｍ，功率密度３ｍＷ／ｃｍ＾２的半导体激光对ＧＬＣ－８２你分化肺腺癌细胞生长增殖的影响。方法：体外培养的ＧＬＣ－８２细胞按照射时间（剂量）的不同分为５且，分别为：对照组，２ｍｉｎ（６Ｊ／ｃｍ＾２）照射组，５ｍｉｎ１５Ｊ／ｃｍ＾２）照射组，１０ｍｉｎ（３０Ｊ／ｃｍ＾２），１５ｍｉｎ（４５Ｊ／ｃｍ＾２）照射组，用相关显微镜观察、四唑盐比色（ＭＴＴ）、生长曲线测定、软琼脂培养集落形成     

高温超导GdBa2Cu3O7—δ薄膜测辐射热型红外探测器研究

用高ＴｃＧｄＢａ２Ｃｕ３Ｏ７－δ薄膜设计并研制了单元及２×２阵列型红外探测器。其中２×２阵列型器件的四个单元探测器的Ｔｃ值及Ｒ－Ｔ特性相差≤３％。使用５００Ｋ黑体及Ｈｅ－Ｎｅ激光作为辐照源。单元及阵列器件最好的结果为噪声等效功率ＮＥＰ（５００，１０，１）分别为３．６×１０－１２和４．１×１０－１２Ｗ／Ｈｚ１／２，归一化探测率分别为１．６×１０１０和１．２×１０１０ｃｍＨｚ１／２／Ｗ；响应率分别为８．２×１０４和７．２×１０４Ｖ／Ｗ。     

Si-YBaCuO intermixing and reactive patterning technique

A novel Si-YBaCuO intermixing technique has been developed for patterning YBaCuO superconducting thin films on both insulating oxide substrates (MgO) and semiconductor substrates (Si). The electrical, structural, and interfacial properties of the Si-YBaCuO intermixed system have been studied using resistivity, x-ray diffraction, scanning electron microscopy, x-ray photoelectron spectroscopy and Auger depth profiling measurements. The study showed that the reaction of Si with YBaCuO and formation of silicon oxides during a high temperature process destroyed superconductivity of the film and created an insulating film. On a MgO substrate, the patterning process was carried out by first patterning a silicon layer using photolithography or laser-direct-writing, followed by the deposition of YBaCuO film and annealing. For a silicon substrate, thin metal layers of Ag and Au were patterned as a buffer mask which defines the YBaCuO structures fabricated thereafter. Micron-sized (2-10 Μm) superconducting structures with zero resistance temperature above 77 K have been demonstrated. This technique has been used to fabricate current controlled HTS switches and interconnects.     

Patterning amorphous fluoropolymer films by reactive ion milling

Amorphous fluoropolymer films have low dielectric constants and high chemical resistance and, so, have potential to be used as the insulator for high speed interconnects and as protection layers. Many applications would require high resolution patterning of the fluoropolymer film. We have found that these films are easily etched by reactive ion beam etching using an O₂/Ar gas mixture. High etching rates of 600 nm/min with a 0.2 mA/cm^-2,500 eV ion beam were obtained. This technique allows good selectivity with typical underlayers such as Si, Au, and photoresist. We have also found that a short Arion milling of the fluoropolymer surface allows good wettability of the film by photoresist.     

Three-dimensional interconnect with excellent moisture resistance for low-cost MMICs

The moisture resistance of three-dimensional (3-D) interconnects using organic insulator films and Au metals has been investigated to ascertain the feasibility of housing monolithic-microwave integrated circuits with these interconnects in inexpensive nonhermetic packages. By comparing polyimide and benzocyclobutene (BCB) for organic insulator films, it was found that although polyimide has higher moisture absorption than BCB, it has a greater moisture resistance. This suggests that moisture absorption is not the dominant factor in moisture resistance and that BCB has higher water permeability than polyimide. As an adhesion layer between Au metal and insulator film, W and WN have better moisture resistance than WSi and WSiN; adhesion layer compositions containing Si oxidize easily. Further, the metal patterning method has an effect on moisture resistance in terms of leakage current. Reactive ion etching (RIE) with SF/sub 6/ gas is necessary in order to completely remove the metal atom residue left after ion milling with Ar gas. An interconnect using polyimide insulator film, W or WN adhesion metal, and metal patterned by ion milling and RIE, did not fail in terms of contact resistance and leakage current under stress of 85/spl deg/C and 85% relative humidity with a bias for 1000 h.     

Optical properties of YBaCuO thin films at Far-Infrared monochromatic light

By using monochromatic sources of radiation we measured the reflectivity and transmission vs temperature behavior of YBaCuO thin film in the Far Infrared region in the range 300-20 K. A smooth change of optical properties is observed from critical temperature down to 40 K with an evident reduction of the losses for all the frequencies we examined. To analyze the use of YBaCuO films as semireflecting elements in submillimeter devices we made a preliminary study of the optical properties of the substrate in the same conditions. The permanence of the sample in a superconducting phase can be deduced from its room-temperature transmittance, as it changes drastically if some degeneracy occurs in the film.     

两种离子束方法制备Cr膜的分析研究

在室温下,采用离子束溅射同时经100 keV Ar 离子轰击的动态离子束混合技术和采用离子束溅射技术这两种方法制备Cr膜,并用XPS,SEM及AES对薄膜的结构、表面形貌、薄膜与基体附着力的影响等进行分析对比。结果表明,与离子束溅射技术制备的Cr膜相比较,动态离子束混合技术制备的Cr膜表面平滑,膜致密呈无气隙的柱状结构,且薄膜元素与基体元素混合形成的组分过渡层较宽,因而有效地提高了Cr膜的附着力。     

Comparison of TEM specimen preparation of perovskite thin films by tripod polishing and conventional ion milling

In this article, the effects of the transmission electron microscopy (TEM) specimen preparation techniques, such as ion milling and tripod polishing on perovskite oxides for high-resolution TEM investigation, are compared. Conventional and liquid nitrogen cooled ion milling induce a new domain orientation in thin films of SrRuO(3) and LaFeO(3) grown on (001)-oriented SrTiO(3) substrates. This is not observed in tripod-polished specimens. Different ion milling rates for thin films and substrates in cross-section specimens lead to artefacts in the interface region, degrading the specimen quality. This is illustrated by SrRuO(3) and PbTiO(3) thin films grown on (001)-oriented SrTiO(3). By applying tripod polishing and gentle low-angle, low-energy ion milling while cooling the sample, the effects from specimen preparation are reduced resulting in higher quality of the TEM study. In the process of making face-to-face cross-section specimens by tripod polishing, it is crucial that the glue layer attaching the slabs of material is very thin (<50 nm).     

Effects of annealing on the characteristics of ZnO films deposited in various O2/(O2+Ar) ratios

C-axis oriented ZnO films are deposited on polished diamond substrates in various O₂/(O₂+Ar) ratios using the radio frequency (RF) magnetron sputtering technique and are subsequently annealed in oxygen ambience under the same conditions. Structural, morphologic and electrical properties of ZnO films are characterized by X-ray diffraction (XRD), high-resistance instrument, energy dispersive X-ray spectroscopy (EDS) and scanning electronic microscopy (SEM). As the O₂/(O₂+Ar) ratio increasing from 1/12 to 5/12, the crystallinity of the as grown ZnO films becomes better and the electrical resistivity increases slowly. After annealing, the ZnO films deposited in O₂/(O₂+Ar) =1/12 and 3/12 are improved greatly in crystallinity, and their electrical resistivity is enhanced by two orders of magnitude, while those deposited in O₂/(O₂+Ar) =5/12 are scarcely changed in crystallinity, and their resistivity is only increased by one order. In addition, the ZnO films deposited in O₂/(O₂+Ar) =3/12 and annealed in oxygen are with the best crystal quality and the highest resistivity.     

BF_2~+,F~+ +B~+和Ar~++B~+注入硅快速退火剩余损伤及对浅P~+N结的影响(英文)

The residual damage is analysed by transmission electron microscopy (TEM) for BF2+, F+ + B+ and Ar+ + B+ implanted silicon after rapid thermal annealing(RTA). And the reverse leakage current of the implanted diodes is measured using a FJ-356 electrometer. The results show that 1 ) The residual damage due to BF2+ implantation is less than that of F+ + B + and Ar++ B+ implantation. 2) The reverse leakage current of BF2+ implanted diodes is less than that of F+ + B+ and Ar++ B + implanted diodes. 3) The reverse leakage current of F++B+ and Ar++ B+ implanted diodes increases with the increase of F+ and Ar+ energies, respectively. Therefore the physical behaviour of the interaction between molecular ion and silicon is different from that of the interaction between individual atom ion and silicon.     

Chemically assisted ion beam etching of gallium nitride

Chemically assisted ion beam etching of gallium nitride (GaN) grown by metalorganic chemical vapor deposition has been characterized using an Ar ion beam and Cl₂gas. The etch rate of GaN was found to increase linearly with Ar ion beam current density, increase linearly then saturate with Ar ion beam energy, vary slightly with Cl₂ flow rate, and lastly, increase moderately with substrate temperature. Etch rates as high as 330 nm/min were obtained at high beam energies and 210 nm/min at a more nominal level of 500 eV. The anisotropy of etched profiles improved in the presence of Cl₂ in comparison to those etched by Ar ion milling only. Elevated substrate temperatures further enhanced the anisotropy to obtain near-vertical profiles for fairly deep-etched structures. Auger electron spectroscopy was used to investigate etch-induced surface changes. Oxygen contamination was observed on the as-etched surface but a dilute HC1 treatment restored the stoichiometry of the material to its unetched state.     

Iron nitride mask and reactive ion etching of GaN films

One of the major GaN processing challenges is useful pattern transfer. Serious photoresist mask erosion and hardening are often observed in reactive ion etching of GaN. Fine pattern transfer to GaN films using photoresist masks and complete removal of remaining photoresist after etching are very difficult. By replacing the etch mask from conventional photoresist to a sputtered iron nitride (Fe-8% N) film, which is easily patterned by wet chemical etching and is very resistive to Cl based plasmas, GaN films can be finely patterned with vertical etched sidewalls. Successful pattern transfer is realized by reactive ion etching using Cl (H) containing plasmas. CHF₃/Ar, C₂ClF₅/Ar, C₂ClF₅/Ar/O₂, SiCl₄, and CHCl₃ plasmas were used to etch GaN. The GaN etch rate is dependent on the crystalline quality of GaN. Higher crystalline quality GaN films exhibit slower etch rates than GaN films with higher dislocation and stacking fault density.