用1553nm激光脉冲触发GaAs光电导开关的研究

用15 5 3nm飞秒光纤激光器触发半绝缘GaAs光电导开关的实验表明,当光电导开关处于3 33～10 3kV/cm的直流偏置电场并被脉冲宽度2 0 0fs且单脉冲能量0 2nJ的激光脉冲照射时,开关表现为线性工作模式,开关输出峰值电压为0 8mV .分析表明,开关对波长为15 5 3nm触发激光脉冲表现出的弱光电导现象起因于半绝缘GaAs材料EL2深能级的作用.     

用1064nm激光脉冲触发半绝缘GaAs光电导开关的奇特光电导现象

报道了用1064nm激光脉冲触发半绝缘GaAs光电导开关的一种奇特光电导现象.GaAs光电导开关的电极间隙为4mm,当偏置电场分别为2.0和6.0kV/cm时,用脉冲能量为0.8mJ,宽度为5ns的激光触发开关,观察到开关输出的线性和非线性工作模式.当偏置电场增至9.5kV/cm,触发光脉冲能量在0.5～1.0mJ范围时,观察到奇特的光电导现象,开关先输出一个线性电脉冲,经过大约20～250ns时间延迟后,触发光脉冲消失,开关又输出一个非线性电脉冲.这一奇特光电导现象的物理机制与半绝缘GaAs中的反位缺陷和吸收机制有关.分析计算了线性与非线性电脉冲之间的延迟时间,结果与实验观察基本吻合.     

Analysis of Damage Induced by Repetition-Frequency Optical Pulse in Semi-insulating GaAs PCSS's Material

通过波长为1064 nm的重频激光光脉冲触发半绝缘GaAs光导开关损伤测试实验,观察脉冲激光触发过程中光电导开关电阻率的变化,对比低重频(＜1 kHz)和高重频的激光脉冲对GaAs光电导开关芯片的损伤阈值,分析了不同重复频率的激光脉冲引起光导开关芯片材料光损伤的主要原因,并探讨了损伤机理.研究表明,在重复频率激光作用下GaAs光导开关芯片材料的破坏阈值比在单脉冲作用下低,且不同重复频率的激光辐照下材料表面的温升速率不同.当激励光脉冲重复频率较低(＜1 kHz)时,芯片内的温升效应不显著,此时光损伤与重复频率无明显依赖关系,主要损伤机制为微损伤累积;而当重复频率较高时,开关材料内热积累引起的损伤占主要地位.     

重频光脉冲对半绝缘GaAs光导开关损伤分析

通过波长为1 064 nm的重频激光光脉冲触发半绝缘GaAs光导开关损伤测试实验,观察脉冲激光触发过程中光电导开关电阻率的变化,对比低重频(1 kHz)和高重频的激光脉冲对GaAs光电导开关芯片的损伤阈值,分析了不同重复频率的激光脉冲引起光导开关芯片材料光损伤的主要原因,并探讨了损伤机理。研究表明,在重复频率激光作用下GaAs光导开关芯片材料的破坏阈值比在单脉冲作用下低,且不同重复频率的激光辐照下材料表面的温升速率不同。当激励光脉冲重复频率较低(1 kHz)时,芯片内的温升效应不显著,此时光损伤与重复频率无明显依赖关系,主要损伤机制为微损伤累积;而当重复频率较高时,开关材料内热积累引起的损伤占主要地位。     

半绝缘GaAs光电导开关的击穿特性

研究了在不同触发条件下半绝缘GaAs光电导开关的击穿特性.当触发光能量和偏置电场不同时,半绝缘GaAs光电导开关的击穿损坏程度也不同,分别表现为完全击穿、不完全击穿和可恢复击穿三种类型.通过对击穿实验结果的分析认为,电子俘获击穿机制是导致半绝缘GaAs光电导开关击穿损坏的主要原因.偏置电场和陷阱电荷所产生热电子的数量和动能决定了Ga-As键的断裂程度,Ga-As键的断裂程度则反映半绝缘GaAs光电导开关的击穿类型.     

半绝缘GaAs光电导开关的击穿特性

研究了在不同触发条件下半绝缘GaAs光电导开关的击穿特性 .当触发光能量和偏置电场不同时 ,半绝缘GaAs光电导开关的击穿损坏程度也不同 ,分别表现为完全击穿、不完全击穿和可恢复击穿三种类型 .通过对击穿实验结果的分析认为 ,电子俘获击穿机制是导致半绝缘GaAs光电导开关击穿损坏的主要原因 .偏置电场和陷阱电荷所产生热电子的数量和动能决定了Ga—As键的断裂程度 ,Ga—As键的断裂程度则反映半绝缘GaAs光电导开关的击穿类型     

半绝缘GaAs光电导开关亚皮秒传输特性的研究

 本文应用Ensemble-Monte Carlo方法模拟了半绝缘GaAs(SI-GaAs)光电导开关基于Auston等效电路亚皮秒传输特性.从载流子在开关体内的动态特性出发,研究了光电导开关在飞秒激光脉冲触发下光电导传输特性、电介质弛豫特性、开关储能特性以及开关工作模式;分析了非线性光电导开关对光能阈值和偏置电场阈值要求的物理机制.     

用飞秒激光触发GaAs光电导体产生THz电磁波的研究

报道了用半绝缘GaAs材料研制的光电导偶极天线在飞秒激光脉冲触发下辐射THz电磁波的实验结果.GaAs光电导偶极芯片的两个欧姆接触电极间隙为3mm,采用Si3N4薄膜绝缘保护,在540V直流偏置下被波长800nm,脉宽14fs,重复频率75MHz,平均功率130mW的飞秒激光脉冲触发时产生THz电磁波.用电光取样测量得到了THz电磁脉冲的时域波形和频谱分布.THz电磁波的辐射峰值位于0.5THz左右,频谱宽度大于2THz,脉冲宽度约为1ps.     

用飞秒激光触发GaAs光电导体产生THz电磁波的研究

报道了用半绝缘GaAs材料研制的光电导偶极天线在飞秒激光脉冲触发下辐射THz电磁波的实验结果.GaAs光电导偶极芯片的两个欧姆接触电极间隙为3mm,采用Si3N4薄膜绝缘保护,在540V直流偏置下被波长800nm,脉宽14fs,重复频率75MHz,平均功率130mW的飞秒激光脉冲触发时产生THz电磁波.用电光取样测量得到了THz电磁脉冲的时域波形和频谱分布.THz电磁波的辐射峰值位于0.5THz左右,频谱宽度大于2THz,脉冲宽度约为1ps.     

大功率超快半导体光电导开关的触发瞬态特性

报道了用ns和fs超快脉冲激光器触发GaAs光电导开关的实验结果.用μJ量级的ns光脉冲触发3mm间隙的GaAs光电导开关,观察到线性和非线性工作模式,峰值电流达560A.当用重复率为76MHz的fs激光脉冲串触发同一器件时,电流脉冲上升时间小于200ps.     

Triggering GaAs lock-on switches with laser diode arrays

Progress toward the triggering of high-power photoconductive semiconductor switches (PCSSs) with laser diode arrays, is reported. An 850-W optical pulse from a laser diode array was used to trigger a 1.5-cm-long switch that delivered 8.5 MW to a 38.3-Ω load. Using 166-W arrays, it was possible to trigger a 2.5-mm-long switch delivering 1.2 MW with 600-ps rise-times at pulse repetition frequencies of 1 kHz. These 2.5-mm-long switches survived 10⁵ pulses at 1.0 MW levels. In single-pulse operation, up to 600 A was switched with laser diode arrays. The goal is to switch up to 5 kA in a single-shot mode and up to 100 MW repetitively at up to 10 kHz. At electric fields below 3 kV/cm GaAs switches are activated by creation of one electron-hole pair per photon. This linear mode demands high laser power and, after the light pulse, the carriers recombine in nanoseconds. At higher electric fields GaAs acts as a light-activated Zener diode. The laser light generates carriers as before, but the field induces gain such that the amount of light required to trigger the switch is reduced by a factor of up to 500. The gain continues until the field across the sample drops to a material-dependent lock-on field. The gain in the switch allows for the use of laser diodes     

四路并联光电开关输出电脉冲性能研究

采用波长为1064 nm的ns脉冲激光器作为触发光源,利用光纤分束同时触发四路并联GaAs光电开关.得到能够得到稳定的电脉冲,任意两路电脉冲的同步精度为48ps,满足实际应用指标.     

Terahertz time-domain-spectroscopy system using a 1 micron wavelength laser and photoconductive components made from low-temperature-grown GaAs

A terahertz time-domain spectroscopy (TDS) system based on a femtosecond Yb:KGW laser, photoconductive emitters and detectors made from as-grown and from annealed at moderate temperatures (~400°C) low-temperature-grown GaAs (LTG GaAs) layers was demonstrated. The measured photoconductivity of these layers increased linearly with the optical power, showing that transitions from the defect band to the conduction band are dominant. The largest amplitude THz pulse with a useful signal bandwidth reaching 3 THz and its signal-to-noise ratio exceeding 50 dB was emitted by the device made from the LTG GaAs layer annealed at 420°C temperature. The detector made from this material was by an order of magnitude less sensitive than conventional GaBiAs detectors.     

高压超快GaAs光电导开关的研制

本文首次报导了采用全固态绝缘，微带线低电感输出的Ｓｉ－ＧａＡｓ高压超快光电导开关的研制结果，该器件的耐压强庶３５ｋＶ／ｃｍ，典型的电流脉冲上升时间为２００ｐｓ，电流达１００Ａ。并在实验中观测到典型的高倍增现象。     

The lock-on effect in electron-beam-controlled gallium arsenideswitches

The authors analyze the lock-on effect, which is the inability of photoconductive or electron-beam-controlled semiconductor switches to recover to their initial hold-off voltages following the application of the laser or electron-beam pulse, if the applied voltage exceeds a certain value. For GaAs this threshold voltage corresponds to average electric fields in the range from 4 to 12 kV/cm. Experimental results on semi-insulating GaAs switches indicate that the corresponding lock-on current after e-beam irradiation is identical with the steady-state dark current. The highly resistive state of the switch before e-beam irradiation is shown to be a transient phase towards the much lower steady-state dark resistance, with a duration which depends on the impurity content of the switch material and the applied voltage. The irradiation of the GaAs samples with electrons or photons causes an acceleration of this temporal evolution; at sufficiently high laser or e-beam intensities, lock-on of the dark current after termination of the driving ionization source is observed. Based on the experimental results, a model is developed which describes the lock-on effect in terms of double injection and carrier trapping in deep intraband levels. The model explains the major characteristics of the lock-up effects and is supported by the qualitative agreement of the calculated current-voltage curves with the experimental data     

Light controlled prebreakdown characteristics of a semi-insulating GaAs photoconductive switch

A 4 mm gap semi-insulating(SI) GaAs photoconductive switch(PCSS) was triggered by a pulse laser with a wavelength of 1064 nm and a pulse energy of 0.5 mJ.In the experiment,when the bias field was 4 kV, the switch did not induce self-maintained discharge but worked in nonlinear(lock-on) mode.The phenomenon is analyzed as follows:an exciton effect contributes to photoconduction in the generation and dissociation of excitons. Collision ionization,avalanche multiplication and the exciton effect can supply carrier concentration and energy when an outside light source was removed.Under the combined influence of these factors,the SI-GaAs PCSS develops into self-maintained discharge rather than just in the light-controlled prebreakdown status.The characteristics of the filament affect the degree of damage to the switch.     

Generation and shaping of megawatt high-voltage pulses byoptoelectronic technique

A composite miniature structure used to generate megawatt electrical pulses is described. Two photoconductive switches (one GaAs and the other Si) are used, along with voltage multiplication and pulse forming lines, to generate over 14-kV pulses from a DC bias of only 9 kV. These megawatt pulses have picosecond synchronization and can vary in width from nanoseconds to picoseconds     

Low-temperature growth of GaAs on Si used for ultrafast photoconductive switches

GaAs was grown directly on silicon by molecular beam epitaxy (MBE) at low substrate temperature (/spl sim/250/spl deg/C). Both the silicon wafer cleaning and the GaAs film growth processes were done at temperatures lower than the Si-Al eutectic temperature to enable monolithic integration of low-temperature-GaAs photoconductive switches with finished Si-CMOS circuits. The film surfaces show less than 1 nm rms roughness and the anti-phase domain density is below the detection limit of X-ray diffraction. Metal-semiconductor-metal photoconductive switches were made using this material and were characterized using a time-resolved electrooptic sampling technique. A full-width at half-maximum switching time of /spl sim/2 ps was achieved and the responsivity of switches made from low-temperature GaAs on Si material was comparable to its counterpart on a GaAs substrate.     

Polycrystalline cubic silicon carbide photoconductive switch

The first cubic silicon carbide (3C-SiC) photoconductive switches were fabricated from polycrystalline 3C-SiC. The switches had a dark resistivity of 10⁶ Ω/cm. A breakdown field of 250 kV/cm and a peak photocurrent density of 10 kA/cm² through the switch were obtained. The ratio of off-resistance to on-resistance of the switch reached up to 10⁵. The photocurrent had a pulse width as narrow as 15 ns. The trigger gain of the switch was 4.7