共查询到19条相似文献,搜索用时 109 毫秒
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近年来,较高熔点的无铅钎料合金已经开始在微电子互连制造中广泛应用,传统的红外或热风等整体加热方法所造成芯片和印刷线路的热影响问题更加突出。采用不加热源的超声波倒装焊接方法,有助于解决上述热影响问题。本文以Sn3.5Ag无铅钎料凸点为对象,验证了室温下Sn3.5Ag无铅钎料凸点超声倒装焊接的可行性和可操作性,分析了多类互连焊点的宏观形态和显微组织,研究表明添加钎剂和改变焊接材料体系均可显著改善互连焊点成型。 相似文献
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随着射频集成电路向小型化、高集成方向发展,基于金凸点热超声键合的芯片倒装封装因凸点尺寸小、高频性能优越成为主流技术之一。以GaAs芯片上倒装Si芯片的互连金凸点为研究对象,通过有限元仿真方法,分析了温度和剪切力作用下不同高度金凸点的等效应力,得到金凸点的最优高度值。通过正交试验,研究键合工艺参数(压力、保持时间、超声功率、温度)对金凸点高度和键合强度的影响规律。通过可靠性试验,验证了工艺优化后倒装焊结构的可靠性。结果表明:键合工艺参数对凸点高度的影响排序为压力>超声功率>温度>保持时间,对剪切力的影响排序为压力>超声功率>保持时间>温度。 相似文献
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FC(倒装片)和WLP(圆片级封装)均要在圆片上制作各类凸点,它们与基板焊接互连后,由于各材料间的热失配可能造成凸点——基板间互连失效,从而影响了器件的可靠性和使用寿命。解决这一问题的通常做法是对芯片凸点与基板间进行下填充。本文介绍的柔性凸点技术是在焊球下面增加一层具有弹性的柔性材料,当器件工作产生热失配时,由于柔性材料的自由伸缩,将大大减小以至消除各材料间的失配应力,使芯片凸点与基板下即使不加下填充,也能达到器件稳定、长期、可靠地工作的目的。 相似文献
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为了满足射频系统小型化的需求,提出了一种基于硅基板的微波芯片倒装封装结构,解决了微波芯片倒装背金接地的问题.使用球栅阵列(BGA)封装分布为周边型排列的GaAs微波芯片建立了三维有限元封装模型,研究了微波芯片倒装封装结构在-55~125℃热循环加载下金凸点上的等效总应变分布规律,同时研究了封装尺寸因素对于金凸点可靠性的影响.通过正交试验设计,研究了凸点高度、凸点直径以及焊料片厚度对凸点可靠性的影响程度.结果表明:金凸点离芯片中心越近,其可靠性越差.上述各结构尺寸因素对凸点可靠性影响程度的主次顺序为:焊料片厚度>金凸点直径>金凸点高度.因此,在进行微波芯片倒装封装结构设计时,应尽可能选择较薄的共晶焊料片来保证金凸点的热疲劳可靠性. 相似文献
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A flip-chip bonding (FCB) method suitable for the surface acoustic wave (SAW) filter was developed. In this method, the gold-ball bumps formed on the chip are directly bonded onto the ceramic substrate by thermosonic bonding. After FCB, they are sealed with a cap without using underfill resin. To obtain high bond strength, characteristic properties of the substrate electrode and the ball bump, were optimized. Furthermore, bondability has been improved by adopting a ramp-up loading profile. The reliability test was carried out with 6-pin SAW chips, and we confirmed the sufficient reliability of bonds. 相似文献
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Chia-Ju Chen Chih-Ming Chen Ray-Hua Horng Dong-Sing Wuu Jhih-Sin Hong 《Journal of Electronic Materials》2010,39(12):2618-2626
The thermal management of high-power GaN-based light-emitting diodes (LEDs) soldered with Sn-3 wt.%Ag-0.5 wt.%Cu (SAC305)
solder and diamond-added SAC305 solder was evaluated. Diamond addition was found to significantly reduce the surface temperature
and total thermal resistance of the LEDs, revealing that diamond-added SAC305 solder is a promising die-attach material for
high-power LED packaging. Interfacial reactions in the LED solder joints were also investigated. The thin Au wetting layer
in the chip’s backside metallization was rapidly consumed in the initial stage of reflow, forming an AuSn4 phase at the interface. Subsequently, the AuSn4 phase detached from the interface, leading to dewetting of the SAC305 solder from the LED chip. To avoid dewetting, a new
backside metallization of LED chips should be developed for SAC305 solder. 相似文献
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Cheng-Li Chuang Jong-Ning Aoh Qing-An Liao Chun-Chieh Hsu Shi-Jie Liao Guo-Shing Huang 《Journal of Electronic Materials》2008,37(11):1742-1750
The purpose of this study was to develop the thermosonic flip-chip bonding process for gold stud bumps bonded onto copper
electrodes on an alumina substrate. Copper electrodes were deposited with silver as the bonding layer and with titanium as
the diffusion barrier layer. Deposition of these layers on copper electrodes improves the bonding quality between the gold
stud bumps and copper electrodes. With appropriate bonding parameters, 100% bondability was achieved. Bonding strength between
the gold stud bumps and copper electrodes was much higher than the value converted from the standards of the Joint Electron
Device Engineering Council (JEDEC). The effects of process parameters, including bonding force, ultrasonic power, and bonding
time, on bonding strength were also investigated. Experimental results indicate that bonding strength increased as bonding
force and ultrasonic power increased and did not deteriorate after prolonged storage at elevated temperatures. Thus, the reliability
of the high-temperature storage (HTS) test for gold stud bumps flip-chip bonded onto a silver bonding layer and titanium diffusion
barrier layer is not a concern. Deposition of these two layers on copper electrodes is an effective and direct method for
thermosonic flip-chip bonding of gold stud bumps to a substrate, and ensures excellent bond quality. Applications such as
flip-chip bonding of chips with low pin counts or light-emitting diode (LED) packaging are appropriate. 相似文献
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Thermosonic flip-chip bonding process with a nonconductive paste (NCP) was employed to improve the processability and bonding strength of the flip-chip onto flex substrates (FCOF). A non-conductive paste was deposited on the surface of the copper electrodes over the flex substrate, and a chip with eight gold bumps bonded onto the copper electrodes by the thermosonic flip-chip bonding process.For the chips and flex substrates assembly, ultrasonic power is important in the removal of some of the non-conductive paste on the surface of copper electrodes during thermosonic bonding. Accordingly, gold stud bumps in this study were directly bonded onto copper electrodes to form successful electrical paths between chips and the flex substrate. A particular ultrasonic power resulted in some metallurgical bonding between the gold bumps and the copper electrodes, increasing the bonding strength. The ultrasonic power was not only to remove the NCP from the copper electrodes, but also formed metallurgical bonds during the thermosonic flip-chip bonding process with NCP.In this study, the parameters of the bonding of chips onto flex substrates using thermosonic flip-chip bonding process with NCP were a bonding force of 4.9 N, a curing time of 40 s, a curing temperature of 140 °C and an ultrasonic power of 14.46 W. The processability and bonding strength of flip-chips on flex substrates using thermosonic bonding process with NCP was verified in this study. This process has great potential to be applied to the packaging of consumed electronic products. 相似文献
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介绍了Si衬底功率型GaN基LED芯片和封装制造技术,分析了Si衬底功率型GaN基LED芯片制造和封装工艺及关键技术,提供了产品测试数据。Si衬底LED芯片制备采用上下电极垂直结构与Ag反射镜工艺,封装采用仿流明大功率封装,封装后白光LED光通量达80 lm,光效达70 lm/W,产品已达商品化。与蓝宝石和SiC衬底技术路线相比,Si衬底LED芯片具有原创技术产权,可销往任何国家而不受国际专利的限制。产品抗静电性能好,寿命长,可承受的电流密度高,具有单引线垂直结构,器件封装工艺简单,而且生产效率高,成本低廉。其应用前景广阔,是值得大力发展的一门新技术。 相似文献
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Sang-Su Ha Jong-Woong Kim Jeong-Won Yoon Sang-Ok Ha Seung-Boo Jung 《Journal of Electronic Materials》2009,38(1):70-77
The electromigration of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu (in wt.%) solder bumps was investigated with a high
current density of 2.5 × 104 A/cm2 at 423 K using flip-chip specimens comprised of an upper Si chip and a lower bismaleimide triazine (BT) substrate. Electromigration
failure of the Sn-37Pb and Sn-3.0Ag-0.5Cu solder bumps occurred with complete consumption of electroless Ni immersion Au (ENIG)
underbump metallization (UBM) and void formation at the cathode side of the solder bump. Finite element analysis and computational
simulations indicated high current crowding of electrons in the patterned Cu on the Si chip side, whereas the solder bumps
and Cu line of the BT substrate had a relatively low density of flowing electrons. These findings were confirmed by the experimental
results. The electromigration reliability of the Sn-3.0Ag-0.5Cu solder joint was superior to that of Sn-37Pb. 相似文献
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A nickel layer and a silver bonding layer have been deposited on copper electrodes over flex substrates to improve the bondability and die-shear force performance of chip?Cflex substrate assemblies when using the thermosonic flip-chip bonding process. For bonding temperature of 200°C, the maximum die-shear force was achieved by combining parameter values of 20.66?W ultrasonic power, 625?gf bonding force, and 0.5?s bonding time. The improved bondability and die-shear force could be attributed to better transfer of ultrasonic power across the bonding interface during thermosonic flip-chip bonding, owing to the high rigidity of the copper electrodes provided by the nickel layer. Experimental results also indicated that high bonding load is necessary at elevated ultrasonic power range to provide firm contact between the bumps and electrodes to enable smooth ultrasonic power transfer across the bonding interface. Moreover, prolonged bonding time caused cracks between the bumps and flex substrate. Close examination of the fracture morphologies after die-shear testing and after ultrasonic separation provided insight into the die-shear force performance as influenced by the process parameters and by the deposition of the nickel layer on the copper electrodes over the flex substrate. 相似文献
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文章基于LED芯片和LED单灯的工作原理和制程工艺,探讨了LED芯片封装以后正向电压K升高和降低的常见原因,并提出了改善措施。对于GaN基双电极芯片,由于芯片工艺制程或后续封装工艺因素,造成芯片表面镀层(ITO或Ni/Au)与P—GaN外延层之间的结合被破坏,欧姆接触电阻变大。对于GaAS基单电极芯片,由于封装材料和工艺因素,导致芯片背金(N—electrode)与银胶,或银胶与支架之间的接触电阻变大,从而LED正向电压VF升高。LED正向电压VF降低最常见的原因为芯片PN结被ESD或外界大电流损伤或软击穿,反向漏电过大,失去了二极管固有的I-V特性。 相似文献
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Study of Phosphor Thermal-Isolated Packaging Technologies for High-Power White Light-Emitting Diodes
Bingfeng Fan Hao Wu Yu Zhao Yulun Xian Gang Wang 《Photonics Technology Letters, IEEE》2007,19(15):1121-1123
A novel packaging configuration for high-power phosphor-converting white light-emitting diodes (LEDs) application is reported. In this packaging configuration, a thermal-isolated encapsulant layer was used to separate the phosphor coating layer from the LED chip and the submount. Experimental and finite-element method simulation results proved that this thermal management can prevent the heat of LED chip from transferring to the phosphor coating layer. The surface temperature of the phosphor coating layer is a 16.8degC lower than that of the conventional packaging at 500-mA driver current for 1-mm power GaN-based LED chip. Experimental results also show that this packaging configuration can improve the light-emitting power performance and color characteristics stability of the white LED, especially under high current operating condition. 相似文献