电子产品可靠性评价与物理模型应用探讨

该文以电子产品的故障为出发点,从集成电路-封装、集成电路-芯片、电路板(或线路板)、电子元件、系统和多系统的角度论述了不同任务环境下电子器件的故障机理特点。系统论述了故障模式、影响及危害性分析(FMECA)和故障模式、机理与影响分析(FMMEA)两种故障机理分析方法,同时结合低周疲劳、高周疲劳、裂纹萌生、反应论模型、芯片失效等失效机理对故障物理元模型进行分类讨论,对电子产品可靠性评价与物理模型应用进行了系统的探讨,为电子产品可靠性评价及失效物理评估模型的选取提供了依据。     

电子元器件可靠性增长的分析技术

从元器件可靠性物理分析技术角度,系统地阐述了失效信息的收集与分析、失效分析、破坏性物理分析、密封器件内部气氛分析、失效模式及机理与工艺的相关性分析、失效模式与影响分析等元器件的质量与可靠性分析技术。将元器件质量与可靠性分析技术融入元器件产品设计、制造过程是实现元器件可靠性增长的必然趋势。     

加强可靠性物理基础研究,提升应用技术能力

对研制生产、使用中元器件失效的原因和机理进行研究分析,提出改进措施,不断提高元器件可靠性是元器件可靠性科研和技术服务的任务所在.近年来元器件可靠性物理及其应用技术研究条件实现了跨越式发展,研究领域不断延伸、拓展,科研成果和应用技术支撑了元器件可靠性的提高.加强元器件可靠性基础研究,建设可靠性分析和评价公共技术平台是未来发展的目标.     

《电子元器件失效分析与典型案例》出版

为了加快发展电子元器件的失效分析工作,提高电子元器件的使用可靠性,电子5所组织失效分析领域的专家,针对电子设备研制中的质量问题归零要求,规范了相应的电子元器件失效分析程序及要求;在分析、总结元器件的一般失效规律及失效特点的基础上,描述了各门类元器件的主要失效模式     

元器件测试筛选先后次序的决定原则

从元器件失效的原理出发,叙述了分析元器件失效的具体失效模式与引起各种元器件失效的失效模式之间的相互关联性、各种元器件测试筛选方法可能引发的元器件失效模式,以及不同元器件测试筛选先后次序对最终测试结果的影响,从理论上推导出一种较好的决定元器件测试筛选先后次序的原则。实践表明,应用这种原则,可以最大限度提高测试筛选的有效性和经济性,在最短时间内迅速找出有有缺陷、质量不符合要求的产品,而且失效模式定位准确,为查明失效的产生机理提供数据支持,是一种有效的安排元器件测试筛选先后次序的原则。     

电子元器件的失效机理和常见故障分析

电子元器件在使用过程中,常常会出现失效和故障,从而影响设备的正常工作。分析了常见的电阻器类、电信器类、电感和变压器类以及集成块类电子元器件的失效模式和失效机理、失效原因和常见的故障现象。实践证明:只有了解电子元器件的失效机理和常见故障,才能保证设备或系统的可靠性工作。     

表贴元器件常见的失效模式及机理分析

由于表贴元器件具有体积小,重量轻,集成度高,性能优良的优点,随着武器装备系统向着小型化、智能化方向发展,表贴元器件越来越多地应用在高新武器装备系统中.但是,由于器件本身的结构以及材料等方面的原因,表贴元器件在应用中容易产生一些特有的失效模式.本文通过一些表贴元器件典型的失效案例,分析了元器件的失效机理,重点剖析了元器件失效与其本身结构及材料方面的关系.     

机载电子设备中电磁继电器失效机理和失效分析

在机载电子设备维修过程中,常常会出现电子元器件失效,从而影响电子设备的正常工作。文中阐述了常见的电阻器类、电容器类、电感和变压器类、集成块类及接触器类元器件的主要失效模式,并着重分析了机载电子设备中常用的电磁继电器的失效机理和失效模式。针对两例因电磁继电器失效引起机载电子设备故障的案例,开展电磁继电器失效原因分析。     

电子元器件失效分析技术的工程应用

简述了电子元器件失效分析的常用技术手段和失效元器件的失效现象、失效模式、失效机理。对失效现场应收集的信息内容进行了介绍，并提出要注意的事项；对元器件的失效进行了分类——失效分为固有失效和使用失效，并对工程上的失效分布作了进一步的分析。最后，通过两个典型的工程实践事例，说明进行失效分析在工程上的应用和工程意义重大：失效分析能够改进和提高元器件制造单位的水平，也能够促进和提高元器件使用单位的设计水平。     

几种电子元器件长期储存的失效模式和失效机理

通过对几种元器件长期储存期间的失效进行分析,探讨了这几种元器件的失效模式及其失效机理。     

Parameter selection for health monitoring of electronic products

This paper presents an approach for selecting precursor parameters for health monitoring of electronic products. The approach includes failure modes, mechanisms, and effects analysis (FMMEA) and life cycle profile analysis of a product. The criticality of the failure mechanisms is established using a risk priority number (RPN), where the RPN for each failure mechanism is calculated as a product of the occurrence and the severity of each mechanism. Performance parameters that can be associated with the critical failure mechanisms should be selected for health monitoring of the product. These parameters could be used for diagnostic purposes. A case study is presented to demonstrate the parameter selection approach for a computer server system. FMMEA was performed on the server, and precursor parameters of the server were selected for monitoring based on the failure modes and mechanisms that posed the highest risk. The utilization of identified parameters for fault detection is presented through a diagnostic algorithm. This approach can be used to select parameters for health monitoring of any system.     

Long term storage reliability of antifuse field programmable gate arrays

Field Programmable Gate Arrays (FPGA) with antifuse elements are preferred in aerospace applications due to their non-volatility and demonstrated radiation hardness. Because aerospace applications typically involve long operating life, there is a requirement to store un-programmed antifuse FPGA parts for long periods and program them when necessary to support the system. No study on the long term reliability of un-programmed antifuse FPGAs in the storage environment is reported in literature. In this paper, antifuse structures, programming process, and failure mechanisms of antifuse FPGAs are discussed. A failure modes, mechanisms and effects (FMMEA) analysis was performed for storage conditions and critical failure mechanisms were identified. High temperature storage tests of a select number of antifuse FPGAs were performed to accelerate the identified failure mechanisms. These parts were subsequently programmed and yield data was analyzed to determine the effects of high temperature storage.     

Multiphysics modeling approach for micro electro–thermo–mechanical actuator: Failure mechanisms coupled analysis

The lifetime of micro electro–thermo–mechanical actuators with complex electro–thermo–mechanical coupling mechanisms can be decreased significantly due to unexpected failure events. Even more serious is the fact that various failures are tightly coupled due to micro-size and multi-physics effects. Interrelation between performance and potential failures should be established to predict reliability of actuators and improve their design. Thus, a multiphysics modeling approach is proposed to evaluate such interactive effects of failure mechanisms on actuators, where potential failures are pre-analyzed via FMMEA (Failure Modes, Mechanisms, and Effects Analysis) tool for guiding the electro–thermo–mechanical-reliability modeling process. Peak values of temperature, thermal stresses/strains and tip deflection are estimated as indicators for various failure modes and factors (e.g. residual stresses, thermal fatigue, electrical overstress, plastic deformation and parameter variations). Compared with analytical solutions and experimental data, the obtained simulation results were found suitable for coupled performance and reliability analysis of micro actuators and assessment of their design.     

Failure mechanism models for material aging due to interdiffusion

This tutorial illustrates design situations where material aging due to interdiffusion in some components can compromise system performance over time, thereby acting as a wearout failure mechanism. Microstructural diffusion mechanisms, continuum diffusion models, and interdiffusion analysis techniques are presented to design against such failures. An example illustrates the application of the mechanisms, models, and techniques in electronic packaging     

电子元器件的贮存可靠性及评价技术

综述了国内外元器件的贮存可靠性研究现状,分析了元器件贮存失效模式及原因,表明减少元器件自身缺陷、改善固有可靠性是提高其贮存可靠性的关键。并从应用性角度出发,对现场贮存、长期自然贮存试验、极限应力、加速贮存寿命试验等贮存可靠性评价技术进行了对比分析。     

Toward comprehensive reliability assessment of electronics by a combined loading approach

Many electronic applications, such as portable handheld devices or automotive electronics, experience various loadings during their common operation. Recent investigations have shown, however, that the interactions of the different load components can be highly significant. The commonly employed standardized single load tests neglect these interactions and, therefore, do not represent well enough the use environment loading conditions of many electronic devices. Thus, it has become clear that modifications to the reliability evaluation procedures are necessary. But before loading conditions can be combined in a meaningful manner, the failure mechanisms under single load environments and their possible interactions must be clarified. This paper makes a brief review to the reliability of electronic assemblies under different loading conditions from the perspective of failure modes and mechanisms. The failure modes and mechanisms under pure thermal cycling, power cycling, mechanical shock impact, or vibration conditions are discussed first. Thereafter, the interactions of the loading conditions, when they are combined consecutively or concurrently, are discussed.     

Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions

Failure modes and mechanisms under mechanical shock loading were studied by employing the statistical and fractographic research methods, and the finite element (FE) analysis. The SnAgCu-bumped components were reflow-soldered with the SnAgCu solder paste on Ni(P)|Au-coated and organic solderability preservative-coated multilayer printed wiring boards with and without micro-via structure in the soldering pads. The component boards were designed, fabricated, assembled, and drop tested according to the JESD22-B111 standard for portable electronic products. The test data were analyzed by utilizing the Weibull statistics, and the characteristic lifetimes (eta) and shape parameters (beta) were calculated. Statistically significant differences in the reliability were found between the different coating materials and pad structures. The results on the failed assemblies showed good correlation between the failure modes and the FE calculations. Under high deformation rates the solder material undergoes strong strain-rate hardening, which increases the stresses in the interconnections as compared to those in the thermal cycling tests. Therefore, the failure mechanisms under high deformation rates differed essentially from those observed in thermal cycling tests     

基于故障物理的电子产品可靠性仿真分析方法

基于故障物理的电子产品可靠性仿真分析方法首先对产品进行故障模式、机理与影响分析（FMMEA）,得到所有潜在故障点的故障模式、机理与对应的物理模型.利用产品材料、结构、工艺、应力等参数建立产品的仿真数字模型,并进行应力分析,利用概率故障物理（PPoF）模型进行损伤分析,得到各潜在故障的寿命分布.最后利用时间竞争的原理对其进行数据融合,得到产品故障率、平均故障间隔时间（MTBF）等可靠性指标.通过某型单板计算机的可靠性仿真过程说明了该方法的实施流程.这种基于故障物理的可靠性仿真的方法从微观角度将可靠性与产品的结构、材料及所承受的应力联系在一起,有助于发现产品的薄弱环节并采取切实有效的措施,是目前基于手册数据的可靠性预计方法的有益补充.