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脉冲激光沉积类金刚石膜红外增透技术研究 总被引:1,自引:1,他引:0
针对传统方法制备类金刚石(DLC)膜存在的3~5μm波段红外透过率低这一难题,采用飞秒脉冲激光沉积(PLD)法在红外材料硅基底上镀制DLC膜.重点考查了靶材与基片的间距、背景气压、激光单脉冲能量、负偏压、温度以及掺硅量等工艺参数对其透过率的影响,经过大量的实验与优化分析,总结出一套有效的脉冲激光沉积DLC膜工艺来制备优良的光学保护增透膜.相比传统工艺,大大提高了3~5μm波段的平均红外透过率,在硅基底上单面镀制DLC膜的最高红外透过率达到了68.2%,与理论最高值的68.7%仅相差0.5%. 相似文献
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用脉冲激光沉积(PLD)法在热解C制作的人工心脏机械瓣膜上沉积类金刚石(DLC)薄膜,并用3KeV的氩离子轰击(AIB)DLC薄膜。采用拉曼(Raman)光谱和X射线光电子能谱(XPS)分别对AIB前后的DLC薄膜进行检测分析,用光学显微镜观察AIB前后的DLC薄膜表面。实验结果表明:AIB不影响薄膜的黏附性。但是可以在一定程度上导致薄膜微观结构的变化和sp3/sp2比值的提高,可以在薄膜中掺杂微量的Ar元素,可以有效消除薄膜表面吸附的O,但对薄膜中C-O、C=O和COOH的影响较小。因此,离子轰击法可以作为一种改进类金刚石薄膜质量的方法。 相似文献
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非金属掺杂类金刚石膜的研究进展 总被引:3,自引:0,他引:3
非金属掺杂类金刚石(DLC)膜可以优化纯类金刚石膜的一些性能.例如:掺磷DLC膜电阻率小,还可以明显提高其血液相容性;掺氮DLC膜不仅电阻率小,可作为半导体材料.还具有热稳定性好的优点;掺氟DLC膜在憎水性、耐蚀性、热稳定性和降低介电常数等方面更为优异;硅掺杂使膜中氢含量减少、内应力减小、粗糙度和摩擦系数降低.对非金属掺杂DLC膜的进展做了概括及分析,展现出其广泛的应用前景. 相似文献
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类金刚石(DLC)膜具有宽光谱高透射率、高硬度、高热传导及高稳定性等优点,是红外窗口增透保护膜的优选,但现有方法制备的类金刚石膜难以满足高马赫数或海上盐雾等恶劣条件下的应用。激光法相比其他制备方法具有诸多优点,介绍了激光法制备DLC膜的原理及特点,并分析了实现工程应用的难题及关键技术。采用激光沉积法制备出综合性能优异的类金刚石膜,纳米硬度高达44 GPa、内应力仅0.8 GPa、临界刮擦载荷附着力为59.1 mN。正面镀DLC膜,背面镀普通增透膜的硫化锌、硅、锗等红外窗口的平均透射率达82%~91%。实现了150 mm基片的激光法大尺寸均匀薄膜,膜厚不均匀性≤±2%。制备的DLC膜红外窗口通过军标环境适应性试验,并已实现工程化应用。 相似文献
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采用GexC1-x(碳化锗)、BP(磷化硼)和-Si(非晶硅)作为高折射率材料,DLC(类金刚石)作为低折射率材料,在ZnS(硫化锌)、GaAs(砷化镓)、Ge(锗)等常用红外光学窗口表面研制了用于长波红外(8~12 m)波段的GexC1-x/DLC、BP/DLC及-Si/DLC系列多层保护膜。通过对比试验,研究了多层红外光学窗口保护膜的光学性能、显微硬度及海洋环境适应性。结合红外窗口及膜系材料特性,对试验结果进行了分析讨论。结果表明:GexC1-x/DLC多层红外保护膜具有最佳的光学性能,BP/DLC多层红外保护膜在海洋环境下具有最佳的保护效果。 相似文献
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程控数字交换机的用户电路(SLC)是典型的模数混合、机电混合式电路。对SLC的测试与诊断,被认为是对传统测试技术的挑战。本文通过建立SLC的图模型和故障模型,给出了一种基于故障集排除法思路的SLC一般测试与诊断方法,并针对典型SLC电路,给出测试设计举例。 相似文献
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The removal of deformed submicron particles from silicon wafers by spin rinse and megasonics 总被引:1,自引:0,他引:1
Fan Zhang Ahmed A. Busnaina Michael A. Fury Shi-Qing Wang 《Journal of Electronic Materials》2000,29(2):199-204
In order to successfully clean particulate contamination from wafer surfaces, it is necessary to understand the adhesion and
deformation between the particles and the substrate in contact. The adhesion and removal mechanisms of deformed submicron
particles have not been addressed in many previous studies. Submicron polystyrene latex particles (0.1–0.5 μm) were deposited
on silicon wafers and removed by spin rinse and megasonic cleanings. Particle rolling is identified as the major removal mechanism
for the deformed submicron particles from silicon wafers. Megasonics provides larger streaming velocity because of the extremely
thin boundary layer resulting in a larger removal force that is capable of achieving complete removal of contamination particles. 相似文献
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激光等离子体对精密元件表面微纳米粒子的有效去除,在纳米科研领域中有很大的应用潜力。为了深入研究激光等离子体对微粒的去除机理和条件,采用纳秒脉冲激光等离子体,对硅基底表面的微纳米粒子进行去除实验,观测了微粒的去除效果,并理论分析了等离子体的作用效应。结果表明,等离子体向外辐射宽谱光,紫外短波部分加速周围空气电离,使等离子体体积剧增,并有效提升基底和粒子温度;基底与粒子两者热膨胀度不同,使粒子更易于从基底剥离;同时等离子体向周围膨胀扩散形成高压冲击波,冲击波的压强高达GPa量级,可以克服微粒与基底之间的范德华力,而去除微纳米粒子,尤其对粒径大于0.5μm的去除效果尤其明显;在实际去除过程中,等离子体与基底的距离应该保持在0.2mm~2mm之间,这样既保证了微粒的有效去除,又不会造成基底的损伤。激光等离子体对微粒的去除效果明显,是等离子体辐射效应和冲击波效应的综合作用的结果。 相似文献
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纺织厂在生产运作过程中产生大量的粉尘,这些种类不同的粉尘的粒径差别很大,对纺织厂的生产和人体的健康产生很大影响。对西安某纺织厂细纱车间粉尘浓度进行分析,细纱机工作区的空气粉尘浓度值几乎都在2.0 mg/m3以下,喷水室对粉尘的总净化效率为75%。运用专业粉尘颗粒物分析软件Ima ge-Pro Plus6.0研究粉尘粒径分布规律,得到含尘气流在经过喷水室前后粉尘数量分散度的变化;粒径>15μm的大颗粒粉尘的分级效率达到了83.5%,而粒径≤5μm的微粒分级效率为30.4%,说明喷水室对大颗粒粉尘除尘效果较好,加强对微细颗粒的去除是下一步研究的重点。 相似文献
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Itano M. Kern F.W. Jr. Miyashita M. Ohmi T. 《Semiconductor Manufacturing, IEEE Transactions on》1993,6(3):258-267
Particle removal from silicon wafer surfaces was studied using acid and alkaline solutions employed in wet cleaning processes found in semiconductor manufacturing. It was demonstrated that alkaline solutions are superior to acid solutions in terms of particle removal efficiency. The following particle removal mechanism in the alkaline solutions was confirmed: the solutions etch the wafer surfaces to lift off particles, and the particles are then electrically repelled by the wafer surfaces. It was determined experimentally that an etch rate of 0.25 nm/min or more is required to lift off the particles adsorbed on the wafer surfaces. It was also confirmed that when the pH value of NH4OH-H2O2-H2O solution becomes higher, polystyrene latex spheres and natural organic particles are oxidized, with their surface turning into a gel and their shape changing. The particle removal efficiency was demonstrated to be degraded by the oxidation of organic particles. The results suggest that the mixing ratio of the NH4OH-H2O2-H 2O solution should be set at 0.05:1:5 相似文献
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针对高功率固体激光装置反射镜表面的颗粒引起的损伤问题,分别进行离线实验和在线实验,采用风刀及暗场成像系统相结合研究表面颗粒去除率。研究结果表明:当风刀偏转角度为0°且风刀距离大口径反射镜镜面10 mm时,对灰尘颗粒的去除效果最好,可达96.5%,而对相同尺寸的Al2O3颗粒和Fe颗粒效果次之,对SiO2颗粒效果最差,在线平均去除率可达84.9%。通过对反射镜表面颗粒污染物的在线沉积规律研究表明采用风刀吹扫技术一周洁净一次可实现反射镜表面长期洁净,该技术可推广至大口径高能激光装置及未来超大型高功率激光装置中。 相似文献
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为了提高Si片的抛光速率,采用复合磨粒抛光液对Si片进行化学机械抛光。根据检测到的聚合物微球的Zeta电位,利用DLVO理论分析计算了PS,PMMA和BGF聚合物微球与SiO2磨粒在抛光液中的作用势能;利用TEM观察了SiO2磨粒与聚合物微球的吸附状况。分析计算和TEM观察均表明三种聚合物微球在抛光液中都能与SiO2磨粒相互吸附。通过Si片化学机械抛光实验,分别分析了抛光液中聚合物微球浓度、三种不同聚合物组成的复合磨粒抛光液对抛光速率的影响,研究了聚合物微球在Si片化学机械抛光中的作用机制。 相似文献
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The removal of nanoparticles form patterned wafers is one of the main challenges facing the semiconductor industry. In this paper, the removal of 100 and 200 nm polystyrene latex (PSL) particles from silicon trenches was investigated. Red fluorescent PSL particles were utilized in the cleaning experiments and were counted using fluorescent microscopy. All the experiments were conducted in a single wafer megasonic tank using deionized water (DI). Trenches were fabricated with widths varying from 200 nm to 2 μm and with an aspect ratio of one. Results show that removal of particles from larger trenches is faster compared to smaller trenches and that megasonics power is more important in the removal process than cleaning time. 相似文献
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Investigations have been conducted on the feasibility of removal of particles from silicon wafers in electrolyte solutions of different ionic strengths irradiated with megasonic waves. Cleaning experiments have been performed using potassium chloride (KCl) as a model electrolyte and silica particles as model contaminant particles. Particle removal efficiency (PRE) increases with KCl concentration and transducer power density and much lower power densities may be used at higher KCl concentration for a comparable level of cleaning. Enhanced cleaning in KCl solutions has been explained as due to two types of electro-acoustic potentials, namely, ionic vibration potential (IVP) and colloidal vibration potential (CVP) that arise when the sound wave propagates through the electrolyte solution. Theoretical computations have shown that the removal forces due to CVP are much larger in magnitude than those due to IVP and are comparable to van der Waals adhesion forces.The effect of ionic strength on cavitation has been investigated through the measurement of acoustic pressure in solutions using a hydrophone. Using Fourier transformation of time dependent pressure data, the size distribution of stable bubbles in KCl solutions of different concentration has been obtained. 相似文献