光伏组件用EVA封装胶膜的老化研究进展

综述了自上世纪80年代以来乙烯一醋酸乙烯酯共聚物（EVA）的老化机理及研究成果,介绍了光伏组件用EVA配方及结构对封装胶膜老化性能和使用寿命的影响。提出了光伏组件封装胶膜老化研究存在的问题。     

光伏组件封装EVA的热空气老化研究

对光伏组件封装EVA胶膜进行了热空气老化研究。将EVA胶膜置于不同温度下进行热空气老化,测试了老化过程中EVA的抗拉强度、透光率和黄度指数,采用FT-IR、GPC、DSC技术对老化后的EVA进行分析。结果表明,随着老化的进行,EVA的抗拉强度快速下降,老化温度越高,抗拉强度下降越快,甚至完全失效,失去弹性;老化过程中EVA会变黄,透光率逐渐下降;老化失效原因主要是发生氧化降解,EVA的交联网状结构破坏,进而失去力学性能。     

光伏组件封装用EVA材料的老化研究进展

光伏组件封装用EVA材料的耐老化性是光伏系统能否长期稳定输出电能的关键。本文综述了乙烯醋酸乙烯共聚物(EVA)封装材料的老化研究进展,包括EVA材料老化对光伏组件性能的影响,比如EVA老化引起的光伏组件的褪色、分层、起泡;以及EVA材料的抗老化研究进展,包括添加无机颗粒抗老化、添加助剂抗老化和交联抗老化。     

轻质化PMMA/玻纤光伏组件封装材料的研究及应用

目前光伏建筑一体化(BIPV)及各类轻质化光伏都偏向与轻和柔,但传统光伏组件封装使用的玻璃制成组件重量较重,诸如屋顶或者户外会存在一定的便携和安全问题。本文通过甲基丙烯酸甲酯(MMA)树脂涂覆玻纤交联的方法制备了轻质光伏组件封装材料,采用高温高湿老化机(双85)、耐紫外老化机(UV)、紫外分光光度计、万能材料试验机、耐溶剂测试分别表征了封装材料的耐老化、耐紫外、拉伸强度、弯曲模量、耐溶剂等性能。研究结果表明,在树脂含量60%,厚度0.3mm、引发剂含量1%时,经过300kW·h紫外辐照,双85测试3000h和耐溶剂测试后,封装材料透光率保持在89%,拉伸强度433MPa,水透1.2g/d·m²。     

太阳能封装胶膜EVA变色分析

晶体硅光伏组件在制造、测试及使用过程中,封装材料EVA经常发生变色,影响了组件外观及功率.本文通过各种化学分析,分别研究了EVA的几种变色模式,分析了其变色失效机理,提出了避免EVA变色的方法.     

光伏组件封装EVA的湿热老化研究

对光伏组件封装EVA胶膜的湿热老化进行了研究，采用FT-IR法对湿热老化中的EVA进行测试和分析。实验结果表明，在湿热老化过程中，EVA发生了水解反应，产生乙酸，提高温度和相对湿度均会加快水解；EVA吸水率越高，越容易发生水解。     

高分子光伏组件封装膜的研究进展

光伏组件的寿命为25～30年，在光伏组件的正常运行期间，需要组件一直保持稳定的输出效率和最佳的工作状态，这和组件封装膜选择密不可分。本文总结了作为封装膜的乙烯-醋酸乙烯酯(EVA)的相关研究；对聚烯烃封装膜的相关发展状况进行了综合；并对EVA和聚烯烃封装膜的对比研究进行和总结，探讨聚烯烃材料替代EVA成为新一代光伏组件封装膜的优势和局限性。     

影响光伏压延玻璃透过率的原因分析与对策

光伏玻璃是光伏电池组件封装的关键材料,要求光伏玻璃具有较高的透过率,以实现电池组件高效的光电转化。本文简要从生产工序分析了影响透过率的原因,从机理上进行了分析并根据生产实践提出了一些相应的对策措施和建议。     

环保喷涂型光伏组件用双组分室温硫化阻燃密封材料的制备

分析了不同种类及用量的交联剂、催化剂以及填料对硅橡胶性能的影响,确定生产工艺及适用于光伏组件封装材料的生产配方,利用国产原料和设备开发的环保喷涂型光伏太阳能电池用双组分室温硫化阻燃封装材料,其各项性能符合GB/T 29595—2013《地面用光伏组件密封材料硅橡胶密封剂》的要求。     

光伏建筑一体化系统中光伏组件封装工艺探讨

为了实现光伏和建筑一体化,太阳能电池组件需要被制作成夹层产品和中空产品直接应用于建筑幕墙、屋顶上.目前大部分组件封装厂家采用传统层压机生产,不仅效率低、产品品质差,还易造成破损.本文结合汽车和建筑夹层玻璃工艺对该类型组件封装工艺进行探讨,相对于传统的封装工艺,新型封装技术不但使太阳电池组件具有长寿命,不易受损等优点而且能实现规模化、产业化制造.大幅度降低光伏电池组件成本.     

大功率LED器件封装材料的研究现状

LED灯具有高效节能、绿色环保等优点,在照明市场的前景备受各国瞩目,对LED封装材料的研究也备受关注.本文介绍环氧树脂及有机硅的LED封装材料的研究现状以及存在的问题.有机硅封装材料被认为是大功率LED器件封装的最佳材料.高性能有机硅封装材料将具有广阔的应用前景及巨大的经济效益.     

Effect of Cooling Press on the Optical Transmission Through Photovoltaic Encapsulants

In certain laminators for poly (ethylene-co-vinyl acetate) (EVA) encapsulation process of photovoltaic modules, cooling press (CP) is applied to the module after encapsulation. Here, the effect of CP on the optical transmission through common PV encapsulants is studied. Interestingly, CP is shown to reduce drastically the scattering of the light between 400 and 700 nm traveling through the thermoplastic polyolefin (TPO)-based encapsulant. Post-annealing tests prove this effect to be stable at the temperature up to 85°C. This work has discovered a simple solution to mitigate the milky appearance of the TPO encapsulant and hence greatly enhanced its competitiveness against EVA.     

Adhesion of underfill and components in flip chip encapsulation

The underfill material is a polymeric adhesive used in flip chip packaging. It encapsulates the solder joints by filling the gap between a silicon die and an organic substrate or board. Within a typical flip chip structure, there are interfaces between the various components, namely, substrate, solder mask, flux residue, underfill encapsulant and die passivation layer, etc. Maintaining a good adhesion condition, both as-made and after temperature/humidity aging, is vital for these interfaces because of the expected performance of the flip chip device, where the underfill material is employed to enhance the reliability of the flip chip interconnect. We have studied the adhesion strength between the various components for different process variables as measured with the lap shear and die shear test configurations. The effects of the assembly factors, i.e. solder mask, flux residue, underfill, and die passivation, etc., were evaluated and the adhesion strength was found to depend greatly on these factors. The die shear strength of a passivated die assembled onto an organic board coated with a solder mask was much higher after using a no-clean flux on the solder mask than for the assembly without such a no-clean flux. The influence of some accelerated aging tests on the adhesion durability was also investigated. A die passivation layer of benzocyclobutene exhibited better capability in retaining the die shear strength than a passivation layer of silicon nitride or polyimide, especially for the initial aging period. The knowledge obtained in this study should provide insights into the interfacial adhesion in the flip chip assembly structure.     

Effects of the complexed moisture in metal acetylacetonate on the properties of the no‐flow underfill materials

A potential no‐flow (compression filling of encapsulant) underfill encapsulant for simultaneous solder joint reflow and underfill cure has been reported by the authors. The encapsulant is based on a cycloaliphatic epoxy/organic anhydride/Co(II) acetylacetonate system. The key of this no‐flow encapsulant is the use of a latent metal acetylacetonate catalyst that provides the solder reflow prior to the epoxy gellation and fast cure shortly after the solder reflow. However, most of the metal acetylacetonates can easily absorp moisture as their ligand. Therefore, it is of practical importance to understand the effect of the complexed water on the properties of the no‐flow material before and after cure. In this paper, differential scanning calorimetry, thermal gravimetric analysis, thermal mechanical analysis, dynamic mechanical analysis, and Fourier transform infrared spectrometry were used to validate the existence of complexed moisture in the Co(II) acetylacetonate. The effects of the complexed water on the curing profile, glass transition temperature, and storage modulus of the cured no‐flow underfill material were studied. A possible catalytic mechanism of the metal acetylacetonate in the cycloaliphatic epoxy/anhydride system was subsequently discussed and proposed. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 103–111, 1999     

HWG系列有机热稳定剂在PVC制品中的应用

通过动态热老化实验、静态热老化实验、转矩流变实验及刚果红实验对HWG系列有机热稳定剂与国内外同等牌号的稳定剂进行了研究,发现HWG系列有机热稳定剂具有优良的热稳定性能及加工流变性能,能满足聚氯乙烯(PVC)各类软硬制品的加工要求。     

封装用有机硅材料的制备及性能研究

具有高效节能、绿色环保等优点的半导体自光照明LED灯在照明市场的前景备受各国瞩目,对LED封装材料的研究也备受关注。文章采用复合硅树脂和有机硅油混合,在催化剂的条件下发生加成反应,得到无色透明的有机硅封装材料。采用红外光谱仪、紫外可见分光光度计、同步热分析仪等仪器设备对有机硅封装材料进行测试和分析。将制备的有机硅封装材料应用于大功率自光LED上,研究有机硅封装材料的透光率对LED出光效率的影响。     

Adhesion failure of antiscratch coatings on polycarbonate under UV irradiation

The adhesion failure of antiscratch (AS) coatings on unmodified and plasma‐modified polycarbonate (PC) substrate was studied using both chemical and physical methods while considering the surface and interface changes between coatings and PC under ultraviolet (UV) irradiation. The differences in the wettability and surface elemental compositions of the PC surface (PCs) and AS coatings after UV ageing were evaluated by contact angle and Fourier transform infrared (FTIR) measurements. The nanoindentation technique was employed for the quantitative assessment of the changes in the nanomechanical properties of both PCs and AS coatings under UV irradiation. The adhesion of coating on plasma‐modified PC was found to be significantly better than that of unmodified substrates. The hydrophilicity and polarity of PCs covered by AS coatings were significantly increased because of the photodegradation of PCs, whereas silicon coatings remained invariant. Nanoindentation tests revealed an obvious enhancement in stiffness of the coating and exposed PC after ageing. Based on these experiments, we proposed that adhesion failure under UV irradiation may be caused by two reasons: first, the photodegradation that occurred at the PCs covered by AS coatings; and second, the stress induced by the changes in stiffness of both AS and PCs under UV ageing. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40507.     

Study on adhesion strength,thermal creep resistance,and light transmittance of ethylene‐polypropylene copolymer grafted with silane for photovoltaic application

We investigated the possibility of using PP as an encapsulant in a photovoltaic module. PP is inexpensive but shows low adhesion strength to glass (and silicon wafer) due to its nonpolar nature as well as opacity due to its crystalline nature. We resolved these problems by employing metallocene catalyzed ethylene‐propylene copolymer (EPR) and a nucleating agent to increase the transparency. Five EPRs having various propylene/ethylene ratios were investigated. EPRs having higher propylene content showed higher adhesion strength to the glass substrate. However, it is not appropriate to use EPRs with higher propylene content because they show low processability in calendaring processing. We therefore used a blend of two EPRs. The blend of the two EPRs showed somewhat low transparency. When the nucleating agent was incorporated in the blend, the transparency was remarkably increased. The adhesion strength to the glass plate was enhanced by a silane coupling agent. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016 , 133, 43464.     

Effects of moisture and temperature ageing on reliability of interfacial adhesion with black copper oxide substrate

The reliability of adhesion performance of bare Cu, as-deposited and surface-hardened black oxide coatings on Cu substrates was studied. The interfacial adhesion with a polyimide adhesive tape and an epoxy moulding compound was measured using the button shear and tape peel tests after hygrothermal ageing in an autoclave, high temperature ageing and thermal cycles. Moisture adsorption and desorption studies at different aging times suggested that the black oxide coating was effective in reducing the moisture adsorption. The bond strengths for all substrates remained almost unchanged after thermal ageing at 150°C for 8 h. Thermal cycling between ?50°C and 150°C for 500 cycles reduced by about 20% the button shear strength of the as-deposited black oxide substrate, but it did change much the bonding performance of the bare Cu substrate. Hygrothermal ageing at 121°C/100% RH in an autoclave was most detrimental to adhesion performance because of the combined effect of elevated temperature and high humidity. The reduction in button shear strength after the initial ageing for 48 h was 50–67%, depending on the type of coating. In all accelerated ageing tests, the residual interfacial bond strengths were consistently much higher for the black-oxide-coated substrates than the bare Cu surface, confirming a higher reliability of black oxide coating. Fracture surfaces analysis of tape-peeled bare copper substrates after 500 cycles of thermal loading revealed a transition in failure mechanism from interfacial to cohesive failure. In contrast, the failure mechanism remained unchanged for black-oxide-coated substrates. The observations made from the button shear and tape peel tests were generally different because of the different fracture modes involved.     

加成型阻燃导热有机硅电子灌封胶的研制

以乙烯基硅油、舍氢硅油为基料,铂络舍物为催化剂制得双纽分加成型有机硅灌封胶。通过添加导热和阻燃填料提高灌封胶的导热性和阻燃性,加入增粘剂改善有机硅的粘接性能。结果表明,100份乙烯基硅油（乙烯基质量分数1％）中含氢硅油（活性氢质量分数0.18％）15份、铂含量10×10^-6、导热填料40份、阻燃剂含量50×10^-6、增粘剂1份,所得灌封忮具有较好的综合性能,能够满足大功率电子元器件的灌封要求。