硅基外延La-Sr-Co-O/Pb-Zr-Ti-O/La-Sr-Co-O异质结的制备

在外延SrTiO3（STO）作为缓冲层的Si基片上，应用溶胶-凝胶法（sol-gel）和磁控溅射法，在5．50℃温度下制备了外延的La0.5Sr0.5CdO3／Pb（Zr0．2Ti0．8）O3/La0．5Sr0．5CoO3（LSCO／PZT／LSCO）异质结。X射线衍射结果表明，LSCO／PZT／LSCO异质结是c向外延生长的。当外加电压为60V时，LSCO／PZT／LSCO铁电电容器的剩余极化强度为．50．3μC/cm^2.，当电压为30V时，铁电电容器有效极化强度为80μC/cm^2.。其它电学性能表明。PZT铁电电容器具有较高的电阻率和脉冲宽度对极化强度的影响较弱。     

以TiO_2为缓冲层在GaN上外延生长PZT铁电薄膜

采用脉冲激光沉积技术在(0001)取向的GaN基片上以TiO2为缓冲层外延生长了PZT(111)单晶薄膜。X射线衍射分析表明PZT(111)衍射峰的摇摆曲线半高宽为0.4°,说明薄膜结晶性能良好。PZT薄膜疲劳特性测试结果表明,在经过107次翻转后PZT薄膜的剩余极化强度开始出现下降。P-E电滞回线和I-V测试表明PZT薄膜矫顽场(2Ec)为350 kV/cm,剩余极化(2Pr)约为96μC/cm2,在1 V电压下薄膜的漏电流密度为1.5×10-7A/cm2。以上性能测试结果表明,在半导体GaN上外延生长的PZT铁电薄膜性能基本满足铁电随机存储器的需要。     

以Ni-Al为底电极的P(VDF-TrFE)铁电电容器的结构与性能

应用磁控溅射法制备Ni-Al和Pt薄膜,溶胶-凝胶法制备P(VDF-TrFE)铁电共聚物薄膜,在SiO2/Si(001)衬底上首次构架了Pt/P(VDF-TrFE)/Ni-Al异质结电容器。X射线衍射(XRD)结果表明:Ni-Al薄膜为非晶结构,P(VDF-TrFE)薄膜具有较好的结晶质量。研究发现,在20 Hz测试频率下,Pt/P(VDF-TrFE)/Ni-Al电容器具有饱和的电滞回线,在90 V驱动电压下,剩余极化强度与矫顽场分别为7.6μC/cm2和45.7 V。在外加电压为40 V时,薄膜的漏电流密度约为5.37×10-6 A/cm2。漏电机制研究表明,Pt/P(VDF-TrFE)/Ni-Al电容器满足欧姆导电机制。铁电电容器经过109极化反转后没有发现明显的疲劳现象。     

溶胶-凝胶法制备Bi0.975La0.025Fe0.975Ni0.025O3铁电薄膜的结构及物理性能

采用溶胶-凝胶法在Pt/Ti/SiO_2/Si(111)衬底上制备了Bi_(0.975)La_(0.025)Fe_(0.975)Ni_(0.025)O_3(BLFNO)铁电薄膜。利用X射线衍射(XRD)、原子力显微镜(AFM)及其压电模式(PFM)对薄膜的晶体结构、表面形貌以及铁电畴结构进行了研究。研究发现,BLFNO为结晶良好的钙钛矿结构多晶薄膜,且薄膜表面颗粒生长均匀。PFM测试图显示铁电薄膜在自发极化下的铁电畴结构清晰,铁电电容器具有良好的铁电性能。应用铁电测试仪对Pt/BLFNO/Pt电容器进行测量,得到了饱和性良好的电滞回线。在828kV/cm的外加电场下,Pt/BLFNO/Pt电容器的剩余极化强度为74.3μC/cm~2,表明La、Ni的共掺杂没有明显抑制铁电电容器的剩余极化强度,铁电电容器具有良好的铁电性能。漏电流研究结果表明,La、Ni元素的共掺杂有效降低了薄膜的漏电流密度,在277.8kV/cm外加电场下漏电流密度在10-4 A/cm2量级,明显小于纯BFO薄膜的漏电流密度。正半支漏电流曲线满足SCLC导电机制,对于负半支曲线,当电场强度大于22.2kV/cm时,同样遵循SCLC导电机制;但是,当电场强度小于22.2kV/cm时,曲线斜率约为4.8,表明参与导电贡献的电子数较多,归因于极浅陷阱俘获的电子在外加电场作用下参与了导电行为。室温下磁滞回线测试结果表明BLFNO薄膜具有反铁磁性质。     

基于LaNiO_3和Pt电极的Pb(Zr_(0.52)Ti_(0.48))O_3薄膜制备和电学性能研究

采用了溶胶-凝胶(sol-gel)法分别在LaNiO3/Si和Pt/Ti/SiO2/Si基底上制备Pb(Zr0.52Ti0.48)O3(PZT)薄膜。X射线衍射(XRD)结果表明,在相同的工艺参数下PZT/LaNiO3薄膜表现出高度的(100)取向,而PZT/Pt薄膜则呈现(100)和(111)多晶混合取向。扫描电子显微镜(SEM)结果显示,PZT/LaNiO3薄膜表面晶粒尺寸更加均匀。经过铁电和介电性能测试,PZT/LaNiO3和PZT/Pt薄膜的剩余极化强度分别为24.4和15.3μC/cm2,矫顽场分别为130.90和243.23 kV/cm,介电常数分别为1 125和453。电场强度100 kV/cm时,漏电流分别为10-5和10-2数量级,同时铁电疲劳性能也明显改善。这些结果表明PZT/LaNiO3比PZT/Pt薄膜具有更好的电学性能,在铁电和介电器件方面具有良好的应用前景。     

低温制备Pb(Zr0.52Ti0.48)O3铁电薄膜及其性能研究

采用脉冲激光沉积技术（PLD）在（100）p-Si衬底上,低温淀积、快速退火成功地制备了具有完全钙钛矿结构的多晶PZT铁电薄膜,所制备的PZT铁电薄膜致密、均匀,表现出良好的介电和铁电性能,其介电常数和介电损耗100kHz下分别为320和0.08,剩余极化Pr和矫顽场Ec分别为14μC/cm^2和58kV/cm,＋5V电压下漏电流密度低于10^-7A/cm^2。10^7次极化反转后剩余极化仅下降10％,具有较好的疲劳特性。     

LaNiO3底电极上的BiFeO3薄膜的铁电性能

用溶胶一凝胶方法在LaNiO3底电极上制备了500℃退火的BiFeO3薄膜.研究了室温下薄膜的结构,介电与铁电性质和漏电流性质.XRD研究表明薄膜呈R3m结构,没有观察到不纯相.铁电性研究表明,薄膜具有大的剩余极化强度,在600 kV/cm的测试电场下,薄膜的剩余极化强度为20uC/cm2,矫顽场为440 kV/cm.介电性质研究表明,在整个测试频率范围内,薄膜具有小的介电损耗.而漏电流特性测试表明,通过工艺的改进,有效的限制了BiFeO3薄膜的漏电流.     

电泳沉积法制备Ba0.6Sr0.4TiO3厚膜及其电学性能研究

采用电泳沉积法在Pt/Ti/SiO2/Si基底上制备了厚度为33μm的Ba0.6Sr0.4TiO3(BST40)厚膜,研究了其介电调谐特性、漏电流特性和铁电特性.实验结果表明:采用水热法制备纳米BST40粒子,经250MPa高压压制,950°C热处理后,BST40厚膜可形成完整的立方钙钛矿结构且表面致密、无裂纹. ε-V特性表明,1kHz时厚膜调谐率可达59.2%.Ⅰ-Ⅴ特性表明,当电压从-25～25V变化时,漏导电流100μA/cm2.测量了在1kHz,不同温度下厚膜的电滞回线.在0°C时,其剩余极化强度为1.06μC/cm2.     

掺锡氧化铟基底上锆钛酸铅铁电薄膜的制备与表征

用溶胶-凝胶工艺在掺锡氧化铟导电氧化物基底上制备了锆钛酸铅（PZT）铁电薄膜．采用快速热处理工艺改进铁电薄膜的晶格取向，用X射线衍射仪分析了薄膜的结晶取向，分别基于Al／PZT／ITO，1TO／PZT／1TO电容结构利用Sawyer-Tower电路原理测试了薄膜的铁电性能．结果表明，在磁控溅射法生长的1TO表面能够制备出具有钙钛矿结构的（110）取向的PZT铁电薄膜，所得薄膜的相对介电常数达到1000，剩余极化强度Pr达到和Pt基底上接近的15．2uc／cm^2，矫顽场强Ec达到70．8kV/cm．并且利用TF Analyzer 2000铁电分析仪测试了PZT铁电薄膜的疲劳特性，发现ITO底电极上PZT薄膜经过108次反转后，剩余极化强度仅下降15％．研究表明：磁控溅射法制备的掺锡氧化铟透明导电薄膜ITO可以作为铁电薄膜的上下电极．     

硅基高度择优取向PZT厚膜的制备及性能研究

应用溶胶-凝胶法成功地在以SrTiO3(STO)为模板/阻挡层Si(001)基片上制备了La-Sr-Co-O/ Pb(Zr0.5Ti0.5)O3(PZT)/La-Sr-Co-O/STO/Si异质结,PZT的厚度为0.8μm.研究了异质结的结构和性能.实验发现,PZT结晶良好、具有(001)高度择优取向以及较高的极化强度和较小的极化强度对脉冲宽度的依赖性;当外加电压为50V时,电阻率仍＞108Ω·cm.     

脉冲激光淀积法在Pt/TiO_2/SiO_2/Si(001)衬底上制备Pb(Ta_(0.05)Zr_(0.45)Ti_(0.50))O_3薄膜的铁电性质研究

用脉冲激光淀积方法在Ｐｔ／ＴｉＯ２／ ＳｉＯ２／ Ｓｉ（００１） 衬底上制备了掺Ｔａ 的ＰＺＴ 薄膜。此薄膜显示了理想的铁电性。漏电流特性表明这种异质结构中Ｓｃｈｏｔｔｋｙ 场发射机制起主要作用。扫描电镜形貌照片表明ＰＺＴ 薄膜结晶很好并且异质结构界面无明显扩散。     

Improved fatigue properties of lead zirconate titanate films made on oxygen-implanted platinum electrodes

Pb(Zr_0.3Ti_0.7)O₃ (PZT) thin film capacitors fabricated on an oxygen-implanted Pt bottom electrode were studied. Oxygen was implanted at a low acceleration voltage (40 kV) and dose (1×10¹⁵ cm⁻²). Structural examination by grazing-incident X-ray diffraction (GIXD) and chemical analysis by X-ray photoelectron spectroscopy (XPS) revealed that the implantation generated a very thin amorphous top surface layer (approx. 20 nm), which contained approximately 7% of oxygen that stayed in the film in the form of PtO bonding. The amorphous layer, however, resumed the crystalline structure accompanied by the dissociation of PtO under the rapid thermal annealing at 600 °C for 5 min. The remnant polarization of sol–gel derived Pb(Zr_0.3Ti_0.7)O₃ (PZT) films fabricated on the oxygen-implanted Pt was slightly reduced from 11.92 μC/cm² for the PZT capacitors fabricated on a Pt electrode without implanted oxygen to 9.07 μC/cm². Nevertheless, the fatigue endurance was significantly increased. The switching polarization of PtO_x/PZT/Pt (O-implanted) capacitors remained within 95% of the starting value after 4×10¹⁰ switching cycles, which is comparable to that of PZT capacitors made with other conducting oxides.     

Effects of the deposition and patterning processes of the top electrode on the ferroelectric properties of Pt/Pb(Zr,Ti)O<Subscript>3</Subscript>/Pt thin film capacitors

The deformation in the hysteresis loop of Pt/PZT/Pt thin film capacitors due to deposition and patterning processes of the top electrode has been investigated. The PZT film was aged during the deposition of the top electrode and was positively poled during reactive ion etching (RIE) of the top electrode. The PZT film having sputtered top electrode was very sensitive to the RIE process. The film with a thinner top electrode showed less initial switching polarization due to less compressive stress, but better fatigue characteristics due to an enhanced partial switching region.     

Effect of LaNiO3 electrodes and lead oxide excess on chemical solution deposition derived Pb(Zrx,Ti1 − x)O3 films

The effects of LaNiO₃ (LNO) and Pt electrodes on the properties of Pb(Zr_x,Ti_1 − x)O₃ (PZT) films were compared. Both LNO and PZT were prepared by chemical solution deposition (CSD) methods. Specifically, the microstructure of LNO and its influence on the PZT properties were studied as a function of PbO excess. Conditions to minimize the Pyrochlore phase and porosity were found. Remnant polarization, coercive field and fatigue limit were improved in the PZT/LNO films relative to the PZT/Pt films. Additionally, the PZT crystallization temperature over LNO was 500 °C, about ~ 50 °C lower than over Pt. The crystallization temperature reported here is amongst the lowest values for CSD-based PZT films.     

Crystallization behavior and domain structure in textured Pb(Zr0.52Ti0.48)O3 thin films by different annealing processes

Amorphous Pb(Zr_0.52Ti_0.48)O₃ (PZT) thin films were prepared on the Pt/Ti/SiO₂/Si substrates by radio-frequency magnetron sputtering at room temperature. After rapid thermal annealing (RTA) and conventional furnace annealing (CFA) at different temperatures, the films were transformed into polycrystalline PZT thin films with (111) and (100) orientation, respectively. The phase formation and ferroelectric domains correlated with different orientation were systematically investigated by X-ray diffraction and piezoresponse force microscopy. The results showed that the perovskite PZT crystal with [111] orientation hetero-nucleated preferentially on top of the PtPb intermetallic phase at the PZT/Pt interface during RTA process. It is of interest to find that the domain self-organized into a structure with rounded shape at the early stage of crystallization. While the nucleation of the films treated by CFA dominantly homo-nucleated, thus the (100) orientation grains with minimum surface energy were easy to grow. The texture effects on ferroelectric properties of PZT films were also discussed in relation to the domain structure.     

Distribution of pyrochlore phase in Pb(Mg1/3Nb2/3)O3-PbTiO3 films and suppression with a Pb(Zr0.52Ti0.48)O3 interfacial layer

Thin films of the relaxor ferroelectric Pb(Mg_1/3Nb_2/3)O₃-PbTiO₃ (PMN-PT) on Pt/Ti/SiO₂/Si (Pt/Si) substrates both with and without a Pb(Zr_0.52Ti_0.48)O₃ (PZT) interfacial layer were investigated. Perovskite and pyrochlore coexistence was observed for PMN-PT thin films without a PZT interfacial layer. Interestingly, most of the pyrochlore phase was observed in single-coated films and in the first layer of multi-coated films. The pyrochlore phase exhibited grains with an average size of about 25 nm, which is smaller than those of the perovskite phase (about 90 nm). In contrast, for PMN-PT thin films grown on a PZT interfacial layer, the formation of a pyrochlore phase at the interface between PMN-PT layers and the substrate is completely suppressed. Moreover, small grains are not observed in the films with a PZT interfacial layer. The measured polarization-electric field (P-E) hysteresis loops of PMN-PT films with and without PZT layers indicate that enhanced electrical properties can be obtained when a PZT interfacial layer is used. These enhanced properties include an increase in the value of remanent polarization P_r from 2.7 to 5.8 μC/cm² and a decrease in the coercive field E_c from 60.5 to 28.0 kV/cm.     

Fabrication of 3-dimensional PbZr(1-x)Ti(x)O3 nanoscale thin film capacitors for high density ferroelectric random access memory devices

PbZr(x)Ti(1-x)O3 (PZT) thin films were deposited on 3-dimensional (3D) nano-scale trench structures for use in giga-bit density ferroelectric random access memories. PZT thin films were deposited by liquid delivery metalorganic chemical vapor deposition using Pb(thd)2, Zr(MMP)4, and Ti(MMP)4 precursors dissolved in ethyl cyclohexane. Iridium thin films were deposited by atomic layer deposition, and they exhibited excellent properties for capacitor electrodes even at a thickness of 20 nm. The trench capacitor was composed of three layers, viz. Ir/PZT/lr (20/60/20 nm), and had a diameter of 250 nm and a height of 400 nm. Almost 100% step coverage was obtained at a deposition temperature of 530 degrees C. The PZT thin film capacitors with a thickness of 60 nm on a planar structure exhibited a remnant polarization (Pr) of 28 microC/cm2, but the Pr value of the 3D PZT capacitors decreased slightly with decreasing 3D trench pattern size. The transmission electron microscope analysis indicated that the PZT thin films had compositional uniformity in the 3D trench region. Both columnar and granular grains were formed on the sidewalls of the trench capacitors, and their relative proportion exhibited strong size dependence. The trench capacitors with more columnar PZT grains showed good switching behavior under an external bias of 2.1 V and had a remnant polarization of 19-24 microC/cm2.     

High-efficiency ferroelectric-film solar cells with an n-type Cu₂O cathode buffer layer

Because of the existence of interface Schottky barriers and depolarization electric field, ferroelectric films sandwiched between top and bottom electrodes are strongly expected to be used as a new kind of solar cells. However, the photocurrent with a typical order of μA/cm(2) is too low to be practical. Here we demonstrate that the insertion of an n-type cuprous oxide (Cu(2)O) layer between the Pb(Zr,Ti)O(3) (PZT) film and the cathode Pt contact in a ITO/PZT/Pt cell leads to the short-circuit photocurrent increasing 120-fold to 4.80 mA/cm(2) and power conversion efficiency increasing of 72-fold to 0.57% under AM1.5G (100 mW/cm(2)) illumination. Ultraviolet photoemission spectroscopy and dark J-V characteristic show an ohmic contact on Pt/Cu(2)O, an n(+)-n heterojunction on Cu(2)O/PZT and a Schottky barrier on PZT/ITO, which provide a favorable energy level alignment for efficient electron-extraction on the cathode. Our work opens up a promising new method that has the potential for fulfilling cost-effective ferroelectric-film photovoltaic.     

The thickness effect of Bi3.25La0.75Ti3O12 buffer layer in PbZr0.58Ti0.42O3/Bi3.25La0.75Ti3O12 (PZT/BLT) multilayered ferroelectric thin films

A series of PbZr_0.58Ti_0.42O₃ (PZT) thin films with various Bi_3.25La_0.75Ti₃O₁₂ (BLT) buffer layer thicknesses were deposited on Pt/TiO₂/SiO₂/p-Si(100) substrates by RF magnetron sputtering. The X-ray diffraction measurements of PZT film and PZT/BLT multilayered films illustrate that the pure PZT film shows (111) preferential orientation, and the PZT/BLT films show (110) preferential orientation with increasing thickness of the BLT layer. There are no obvious diffraction peaks for the BLT buffer layer in the multilayered films, for interaction effect between the bottom BLT and top PZT films during annealing at the same time. From the surface images of field-emission scanning electron microscope, there are the maximum number of largest-size grains in PZT/BLT(30 nm) film among all the samples. The growth direction and grain size have significant effects on ferroelectric properties of the multilayered films. The fatigue characteristics of PZT and PZT/BLT films suggest that 30-nm-thick BLT is just an effective buffer layer enough to alleviate the accumulation of oxygen vacancies near the PZT/BLT interface. The comparison of these results with that of PZT/Pt/TiO₂/SiO₂/p-Si(100) basic structured film suggests that the buffer layer with an appropriate thickness can improve the ferroelectric properties of multilayered films greatly.     

Microstructure and electrical properties of Pb(Zr0.52Ti0.48)O3 ferroelectric films on different bottom electrodes

The crystalline quality, dielectric and ferroelectricity of the Pb(Zr_0.52Ti_0.48)O₃ (PZT) films deposited on the LaNiO₃ (LNO), LNO/Pt and Pt bottom electrodes were comparatively analyzed to investigate the possibility for their application. LNO thin films were successfully prepared on Si (100) and Pt(111)/Ti/SiO₂/Si substrates by modified metallorganic decomposition (MOD). The PZT thin films were spin-coated onto the LNO, LNO/Pt and Pt bottom electrodes by sol–gel method. The crystallographic orientation and the microstructure of the resulting LNO films and PZT thin films on the different bottom electrodes were characterized by X-ray diffraction analysis. The dielectric and ferroelectric properties of PZT films on the different bottom electrodes are discussed. The PZT films deposited onto Pt/Ti/SiO₂/Si and LNO/Si substrates show strong (110) and (100) preferred orientation, respectively, while the films deposited onto LNO/Pt/Ti/SiO₂/Si substrates show the peaks of mixed orientations. PZT films on LNO and LNO/Pt bottom electrodes have larger dielectric constant and remnant polarizations compared with those grown on the Pt electrode.