频闪白光干涉技术（英文）

频闪白光干涉技术(SWLI)能够对被测系统进行动态模式的重建和表征,在微机电系统(MEMS)或微光机电系统(MOEMS)等振动样品测量中具有很高的实用性。传统频闪方法不能预先检测或分析具有单个振动激励源的微结构,而频闪白光干涉技术则解决了这一问题。为全面了解这一新开发的技术,本文从理论、技术方法和该技术各种应用的实验结果及分析进行了介绍。该技术为MEMS,MOEMS甚至微纳尺度生物体动态性能的重建和分析提供了一种有效的方法。实验结果和分析证明了频闪白光干涉技术在实际应用中具有良好的可行性和准确性。     

频闪干涉仪在微机电系统动态表征中的应用

微机电系统(MEMS)测试的主要目的是为工程开发中的设计和模拟过程提供数据反馈，其中一个重要方面就是MEMS器件动态特性的高速可视化．介绍了一种基于计算机控制的频闪干涉测试系统，用来测量可动MEMS器件的离面运动，实现了纳米级分辨力，该系统采用改进的相移干涉算法，使用一个大功率激光二极管(LD)作为频闪照明的光源，可以实现1MHz范围内大幅值(十几微米)的微运动测量，这种高离面灵敏度的测量方法特别适合进行微机械(光学)元件的动态特性测量．通过研究一个多晶硅微谐振器的动态特性说明了系统的强大功能。     

浅析微机电系统（MEMS）的发展瓶颈及趋势

文章简要介绍微机电系统（MEMS）的发展现状及应用，并根据发展和应用现状分析MEMS发展的瓶颈和面临的问题。在此基础上，阐述MEMS的发展趋势。     

基于分形小波变换的MEMS动态模糊图像亚像素检测技术

基于机器微视觉的微机电系统（MEMS）动态测试系统,提出了一种分形小波变换亚像素检测技术提取MEMS运动轨迹算法.该算法结合电耦合器件（CCD）成像机理,利用图像的分形参数进行随机分形插值对图像边缘进行重建,通过小波变换实现重建后图像亚像素精度的边缘检测.在连续光照明条件下,对MEMS平面微运动模糊图像进行检测处理,提取和分析了MEMS运动轨迹.将该方法和在频闪条件下测得的MEMS器件的平面微运动幅值的结果进行了比对分析和讨论.由实验结果可以看出,本方法有较高的测量精度,其测量绝对误差小于0.02像素.     

白光频闪散斑干涉术的研究

在利用白光对振动物体进行测量时,由于白光的相干性较差,难以得到质量较好的图像,为了克服这一缺点,本文提出了一种用白光光源照明进行振动测量的新方法-白光频闪散斑干涉术.阐述了白光频闪散斑干涉术的基本原理,分析了提高图象质量的主要原因,采用了相干性较好的白光光源和合理的光路,使系统的时间相干性和空间相干性得到提高,从而提高了图像的质量.实验结果表明,该方法用于振动的测量,能给出物体在任一瞬时的振动信息,得到清晰的、高对比度的全场干涉条纹图,图像的质量得到大大提高.     

高深宽比微结构深度测量技术的研究进展

高深宽比孔/槽微结构现广泛应用于微机电系统（MEMS）与三维集成电路（3D-IC）等领域,是微纳器件的基础性工艺结构。随着器件微型化与功能化的发展需求,孔/槽微结构的深宽比不断提升。深度作为重要参数对器件加工工艺、器件性能有直接影响,微孔/槽结构深度的精确测量具有重要意义,但测量方法面临巨大挑战,成为测量领域的难题之一。针对这一问题,按照非光学和光学测量方式将测量方法分为两大类,介绍了扫描电子显微镜、扫描探针术、白光显微干涉技术、共焦显微技术和反射光谱技术等测量方法的工作原理,在微孔/槽深度测量方面的研究现状,尝试从中总结每种测量方法的优缺点,最后,讨论了未来高深宽比微结构深度测量发展趋势以及研究重点,为之后高深宽比微结构深度的测量技术研究提供帮助。     

利用Linnik显微干涉技术测量微结构动态特性

为了实现微结构的离面运动、幅频特性和谐振频率等动态参数的测量,设计开发了微结构动态测试系统,采用Linnik显微干涉结构,具有放大倍率高和工作距离长的特点.首先,系统利用频闪成像技术、五步相移方法和分割线去包裹算法测量微结构离面运动,然后,再通过扫频技术得到微结构的幅频特性和谐振频率.利用该测试系统对硅微悬臂梁的离面振动和幅频特性进行了测试,实验结果表明:硅微悬臂梁的谐振频率为13.03kHz,离面振动测量重复性误差小于10nm.系统具有较好的测量可重复性和较高的测量精度,能满足微结构动态特性测量对测试系统的性能要求.     

MEMS微构件动态特性测试的激励技术和方法

在微机电系统(MEMS)微构件动态特性的测试中,激励是基本环节,通过激励使微构件振动,并测量和分析振动响应信号,实现对微构件动态特性的测试.由于MEMS微构件的尺寸小、谐振频率较高,限制了传统的激励技术和方法在其动态特性测试中的应用.目前应用在MEMS微构件动态特性测试中的激励技术和方法,根据实现激励的方式不同,归纳为三类:利用外部场能的激励方法、内部集成激励元件的方法和基于底座激励的方法.具体介绍了声波激励、超声激励、静电激励、磁激励、电热激励、光热激励和压电激励等具体激励方式的原理及其特点,并对各种激励方法的特点进行了比较和分析.     

MEMS扫描镜机电特性测量系统的设计

本文在微机电(MEMS)技术上设计并加工出了一种新型基于SOI工艺的谐振式微扫描镜,设计了MEMS扫描镜机电特性测量系统,对MEMS扫描镜的工作原理、机电特性、系统测量方法、系统方案实现和系统精度评定等方面进行了研究.首先,介绍了MEMS扫描镜的工作原理,对其结构设计及机电特性进行了研究.其次,研究了MEMS扫描镜的频...     

永磁交流伺服精密驱动系统机电耦合振动特性分析

为了研究永磁交流伺服精密驱动系统中存在的多物理过程、多参量复杂耦合关系,提出了对该系统进行机电耦合振动特性分析的观点。从全局机电耦合的角度,对永磁交流伺服精密驱动系统进行了机电耦合分析,将该系统归纳为三质量两轴系统,建立了三质量两轴系统的机电耦合振动数学模型和仿真模型,仿真分析了由于电流调节器参数、阻尼、谐波扰动、间隙以及负载扰动等因素引起的系统机电耦合振动动态过程,并通过实验验证了机电耦合振动仿真模型的正确性。该机电耦合振动特性分析对提高系统的动态性能具有重要的意义。     

基于高速图像采集与时间序列图像相关的微陀螺动力学特性测试

研究微结构与微机械电子系统(MEMS)的动力学特性测量与试验方法,对于优化MEMS的结构设计以及提高其可靠性与稳定性具有重要的意义。基于高速图像采集技术和数字图像相关方法,提出了一种用于MEMS动力学特性测试与研究的时间序列数字图像相关方法。由于数字图像相关方法是以图像子区作为单元通过相关搜索计算出相关动力学参量,如同在试件上安装没有任何附加质量和附加力的影响的“微传感器”,因此该方法对试件表面要求低,测试结构简单,测量的数据精度高,可靠。给出了用该方法对稳定谐振和自由阻尼振动情况下微陀螺的动力学特性的测试结果,为进一步研究分析微陀螺的稳定性提供了重要的参数。     

3D heterostructures and systems for novel MEMS/NEMS

Abstract

In this review, we consider the application of solid micro- and nanostructures of various shapes as building blocks for micro-electro-mechanical or nano-electro-mechanical systems (MEMS/NEMS). We provide examples of practical applications of structures created by MEMS/NEMS fabrication. Novel devices are briefly described, such as a high-power electrostatic nanoactuator, a fast-response tubular anemometer for measuring gas and liquid flows, a nanoprinter, a nanosyringe and optical MEMS/NEMS. The prospects are described for achieving NEMS with tunable quantum properties.     

微结构运动特性表征中的全场三维重建方法

微机电系统(MEMS)测试的主要目的是为工程开发中的设计和模拟过程提供数据反馈,其中一个重要方面就是MEMS器件运动特性的高速可视化。基于计算机控制的频闪干涉测试系统,文中提出了一种时间轴和空间轴双向解包裹的干涉条纹分析方法,实现了MEMS器件离面运动参数的精确测量,并与微结构平面结构图像模板相结合,可以进行MEMS器件全视场运动的分析,达到了纳米级分辨力。     

Micro/nanomechanical characterization of ceramic films for microdevices

Microelectromechanical systems (MEMS) are currently fabricated using single-crystal silicon, various polysilicon films and other ceramic materials. Silicon carbide (SiC) film has recently been pursued as a material for use in MEMS devices owing to its excellent mechanical properties and high-temperature capabilities. Since physical and chemical properties, friction and wear are important issues in such small-scale devices, it is essential that the materials used in MEMS have good micro/nanomechanical and tribological properties. Micro/nanomechanical characterization of single-crystal 3C-SiC (cubic or β-SiC) films, undoped and doped (n⁺-type) polysilicon films have been carried out. For comparision, measurements on undoped single-crystal Si(100) have also been made. Hardness, elastic modulus and scratch resistance of these materials were measured by nanoindentation and microscratching using a nanoindenter. Fracture toughness was measured by microindentation using a microindenter. Friction and wear properties were measured using an accelerated ball-on-flat tribometer. It is found that the 3C-SiC film exhibits higher hardness, elastic modulus and scratch resistance as well as lower friction compared to other materials. These results show that the 3C-SiC film possesses desirable micro/nanomechanical properties that make it an ideal material for use in MEMS devices.     

Hot wire chemical vapor processing (HWCVP) — A prospective tool for VLSI

Today the Very Large Scale Industry (VLSI) is looking towards process solutions, which will avoid the problems associated with the conventional or presently employed technologies. This demand has become more intense with the VLSI industry extending their horizons towards Micro electro-mechanical systems (MEMS) based devices and Application-Specific Integrated Circuits ASICs). The areas of concern are development of high-k dielectric thin films, highly conducting polysilicon thin films, ultra thin diffusion barriers on low dielectric constant layers with electromigration resistant metal interconnects. Over the last few years, work carried out on the hot wire chemical vapor process (HWCVP) has shown that, this technique has great potential to yield the desired materials at low processing temperatures. This paper discusses the results we have obtained in the above areas and also the extension of application of this technique to areas like MEMS and ASICs.     

利用频闪成像方法进行微机电系统的计量

为了实现MEMS器件的计量,一个基于频闪成像原理的MEMS动态测试平台被构建,用于在全频率、相位和电压输入范围内表征器件的全三维运动。系统利用高亮度LED和LD作为脉冲光源,有效冻结MEMS器件的面内和离面运动,能在从静止状态到1MHz很宽的频率范围内对MEMS器件进行表征,达到了纳米级分辨力。通过实验对一个微谐振器进行了三维运动测量,在扫频和扫幅两种工作模式下,配合强大的数据分析软件,给出器件运动的幅频和相频特性曲线,为分析器件的动态性能提供了可靠数据。     

Silicon Nanowires Driving Miniaturization of Microelectromechanical Systems Physical Sensors: A Review

The miniaturization of microelectromechanical systems (MEMS) physical sensors is driven by global connectivity needs and is closely linked to emerging digital technologies and the Internet of Things. Strong technical advantages of miniaturization such as improved sensitivity, functionality, and power consumption are accompanied by significant economic benefits due to semiconductor manufacturing. Hence, the trend to produce smaller sensors and their driving force resemble very much those of the miniaturization of integrated circuits (ICs) as described by Moore's law. In this respect, with its IC-, and MEMS-compatibility, and scalability, the silicon nanowire is frequently employed in frontier research as the sensor building block replacing conventional sensors. The integration of the silicon nanowire with MEMS has thus generated a multiscale hybrid architecture, where the silicon nanowire serves as the piezoresistive transducer and MEMS provide an interface with external forces, such as inertial or magnetic. This approach has been reported for almost all physical sensor types over the last decade. These sensors are reviewed here with detailed classification. In each case, associated technological challenges and comparisons with conventional counterparts are provided. Future directions and opportunities are highlighted.     

First-passage reliability of high-dimensional nonlinear systems under additive excitation by the ensemble-evolving-based generalized density evolution equation

The reliability analysis of high-dimensional stochastic dynamical systems subjected to random excitations has long been one of the major challenges in civil and various engineering fields. Despite great efforts, no satisfactory method with high efficiency and accuracy has been available as yet for high-dimensional systems even when they are linear systems, not to mention generic nonlinear systems. In the present paper, a novel method by imposing appropriate absorbing boundary condition on the newly developed ensemble-evolving-based generalized density evolution equation (EV-GDEE) combined with a feasible numerical method is proposed to capture the time-variant first-passage reliability of high-dimensional systems enforced by additive white noise excitation. In the proposed method, the equivalent drift coefficients in EV-GDEE can be estimated by analytical expression or captured by some representative deterministic dynamic analyses. Further, imposing the absorbing boundary condition and then solving the EV-GDEE, a one-or two-dimensional partial differential equation (PDE), yield the remaining probability density of the response of interest. Consequently, by integrating the remaining probability density, the numerical solution of time-variant first-passage reliability can be obtained. Several numerical examples are illustrated to verify the efficiency and accuracy of the proposed method. Compared to the Monte Carlo simulation, the proposed method is of much higher efficiency. Problems to be further studied are finally discussed.     

Incorporating organizational factors into Probabilistic Risk Assessment (PRA) of complex socio-technical systems: A hybrid technique formalization

This paper is a result of a research with the primary purpose of extending Probabilistic Risk Assessment (PRA) modeling frameworks to include the effects of organizational factors as the deeper, more fundamental causes of accidents and incidents. There have been significant improvements in the sophistication of quantitative methods of safety and risk assessment, but the progress on techniques most suitable for organizational safety risk frameworks has been limited. The focus of this paper is on the choice of “representational schemes” and “techniques.” A methodology for selecting appropriate candidate techniques and their integration in the form of a “hybrid” approach is proposed. Then an example is given through an integration of System Dynamics (SD), Bayesian Belief Network (BBN), Event Sequence Diagram (ESD), and Fault Tree (FT) in order to demonstrate the feasibility and value of hybrid techniques. The proposed hybrid approach integrates deterministic and probabilistic modeling perspectives, and provides a flexible risk management tool for complex socio-technical systems. An application of the hybrid technique is provided in the aviation safety domain, focusing on airline maintenance systems. The example demonstrates how the hybrid method can be used to analyze the dynamic effects of organizational factors on system risk.     

Linnik白光干涉仪自动对焦及光程差最小化

众所周知由于两个干涉臂光路不匹配和参考镜面与被测表面的离焦,要得到相干长度非常短的Linnik白光干涉仪的干涉条纹是非常困难的.本文提出了一种自动调节的方法来解决这个问题.为了实现参考镜面和被测表面的对焦,在商用DVD读取头的基础上,对其像散法进行改进,具体方法是对和信号SS设定一个阈值,通过此阈值对归一化后的FES曲线(NFES)进行裁剪,从而获得一个与离焦距离成单调关系的曲线(TNFES),其过零点对应的就是焦点.经过实验证明,改进后的自动对焦系统的动态范围为190 μm,平均灵敏度70 mV/μm,平均标准偏差0.041 μm,分辨率4.4 nm,不确定度55 nm.此外为了最小化两个干涉臂的光程差,本文采用均方根RMSFC算法来计算成像在CCD上的干涉条纹的对比度,通过找到其最大值来最小化光程差.实验证明本文提出的自动方法可以有效地获得Linnik白光干涉仪的干涉条纹.