粗晶/细晶CuCr50触头材料的电弧运动行为及其烧蚀特性

将高能球磨和等离子烧结(SPS)技术相结合制备出粗晶和细晶CuCr50电触头材料，对其成分、密度、显微硬度和电导率、放电过程中触头表面阴极斑点的分布、移动速度和触头表面侵蚀的形貌进行表征，研究了粗晶和细晶CuCr材料的电弧侵蚀特性。结果表明，细晶CuCr50触头的硬度(160.29HV)比粗晶CuCr50触头的硬度(104.15HV)高，在50 Hz工频条件下细晶触头阴极斑点的运动速度为16.9 m/s，比粗晶触头的17.78 m/s低4.9%。这表明，粗晶触头表面的阴极斑点运动到触头边缘的速度略比细晶触头的高。与粗晶触头相比，在燃弧过程中细晶触头表面产生的阴极斑点尺寸小、数量多、亮度低且更均匀；在电流幅值相同的条件下，细晶CuCr触头的电弧电压降比粗晶触头的低。电弧烧蚀后细晶CuCr触头的整体形貌平整，没有明显的大烧蚀坑和液滴喷溅。综合研究结果表明，细化第二相Cr相能显著提高CuCr50触头的整体电接触性能，细晶CuCr50触头的抗电弧烧蚀特性比粗晶触头的高。     

ZF□-252（4）8KBc．551．249动触头加工工艺的研究

分析ZF□－252小型化产品中动触头原加工工艺造成尺寸超差的原因，确定动触头最终加工工艺方案，选用动触头加工的刀具和夹具，解决了动触头尺寸超差的难题。     

银—铜复合触头在DZ—31B中间继电器上的试用

以银-铜复合触头(以下简称复合触头)代替纯银触头,应用在DZ-31B中间继电器上,经过样机的型式试验;加大负荷(2A、100万次;5A、60万次)寿命试验;复合触头和纯银触头分别装机的对比试验证明,复合触头代替纯银触头,完全可以满足DZ-31B中间继电器的技术要求,并且可收到节银66％的效果。现将试验概况简介如下:     

AgSnO2触头材料概述

作为AgCaO材料的替代物,AgSnO2材料具有更广阔的应用前景.介绍了AgSnO2触头材料的发展情况、制备方法,简要描述了内氧化法与粉末冶金法制备AgSnO2触头材料的优缺点并对AgSnO2触头材料目前存在的主要问题进行了分析.在此基础上,对AgSnO2触头材料的后加工方面进行了探讨,并展望AgSnO2电触头材料的发展趋势.     

La掺杂AgSnO2触头材料的电性能

由于Cd有毒性,AgSnO2触头材料逐渐取代了 AgCdO 成为新型触头材料,但由于AgSnO2触头材料中的SnO2近乎绝缘,使得触头材料的接触电阻增大,故改善SnO2的导电性是急需解决的重大难题.本文提出了一种简单的、低成本的La掺杂AgSnO2触头材料的设计方法.采用模拟计算的方法,利用第一性原理的密度泛函理论平面波超软赝势法,建立了SnO2以及不同比例La掺杂的SnO2超晶胞模型,在对其进行几何优化之后分别研究了 La掺杂比为50%、25%、16. 67%、12. 5%、8.34% 的SnO2材料的电子结构,并研究了其晶格参数、能带结构和态密度等.结果表明,掺杂后材料晶胞体积变大. La的5d轨道进入导带,使得导带底向低能端移动,禁带宽度变小.最终得出La掺杂比为16.67% 时导电性最佳.最后进行了不同掺杂比下触头材料的电接触性能试验,得到了接触电阻和燃弧能量等电接触性能参数并验证了模拟结果.因此,本文的研究为触头材料的发展和应用提供了理论依据.     

La掺杂AgSnO_2触头材料的电性能（英文）

由于Cd有毒性,AgSnO_2触头材料逐渐取代了AgCdO成为新型触头材料,但由于AgSnO_2触头材料中的SnO_2近乎绝缘,使得触头材料的接触电阻增大,故改善SnO_2的导电性是急需解决的重大难题。本文提出了一种简单的、低成本的La掺杂AgSnO_2触头材料的设计方法。采用模拟计算的方法,利用第一性原理的密度泛函理论平面波超软赝势法,建立了SnO_2以及不同比例La掺杂的SnO_2超晶胞模型,在对其进行几何优化之后分别研究了La掺杂比为50%、25%、16.67%、12.5%、8.34%的SnO_2材料的电子结构,并研究了其晶格参数、能带结构和态密度等。结果表明,掺杂后材料晶胞体积变大。La的5d轨道进入导带,使得导带底向低能端移动,禁带宽度变小。最终得出La掺杂比为16.67%时导电性最佳。最后进行了不同掺杂比下触头材料的电接触性能试验,得到了接触电阻和燃弧能量等电接触性能参数并验证了模拟结果。因此,本文的研究为触头材料的发展和应用提供了理论依据。     

纳米Ag-SnO_2-TiO_2触头材料的制备工艺及性能研究

介绍了在纳米Ag SnO2 TiO2 触头材料制备过程中工艺参数的确定及触头性能。采用溶胶 凝胶法制备了SnO2 TiO2 混合纳米粉末 ,对压制成型的试样采用分级保温烧结的热处理方法 ,制得的触头材料的电导率为 6 6 .9%IACS ,密度为 9.6 3g cm3,硬度为 92 .3kg cm2 ,性能符合国标且优于美国和日本同类产品的 ,具有良好的应用前景     

大功率真空断路开关用Cu-Cr触头材料研究现状及发展

总结了CuCr合金触头材料的性能，特点及其在国内外的发展现状，指出混粉烧结法，压力浸渗法的缺点；并总结了现有的改进方法，提出用喷射沉积技术生产CuCr合金触头材料，结果表明，用喷射沉积技术生产的CuCr合金触头材料中Cr颗粒进一步细化，而且均匀分布。     

低压继电器用AgSnO2触头材料的研究进展

简述了低压继电器用触头材料的工作状态、性能要求和AgSnO2材料的典型制备工艺.通过分析电弧侵蚀作用后的触头表面组织结构及其对电性能的影响,提出了降低接触电阻、增强界面结合强度和分散电弧的主要改善手段,并展望了AgSnO2材料的发展趋势.     

电触头感应钎焊工艺研究

对Ag-CdO触头与Cu触桥的感应钎焊工艺进行了系统的研究。分析了钎焊温度、保温时间、钎焊间隙对钎着率、组织形态和力学性能的影响规律，并确定了钎着率和组织形态均为良好的最佳工艺规范。通过分析表明：钎料中锌元素烧损是钎缝生成共晶体组织的本质所在；触头的针焊强度不仅与钎着率有关，而且还受钎缝组织形态的影响，即当钎着率在75％以上时，触头钎焊强度随钎缝中共晶体组织的增加而降低。因而应从钎着率和组织形态两方面综合考核触头的针焊质量。     

反应合成银氧化锡电接触材料抗熔蚀性研究

采用反应合成技术和传统粉末冶金技术制备银氧化锡(AgSnO2)电接触材料，利用千瓦级CO2激光器模仿电弧作用在试样表面产生局部熔化。对AgSnO2块体材料进行抗熔蚀性测试，对块体材料及冷拉拔的AgSnO2线材进行显微组织分析(扫描电镜、透射电镜)。研究结果表明，采用反应合成技术可以在银基体中合成尺寸细小、界面新鲜的SnO2颗粒，制备AgSnO2电接触材料；用反应合成法制备的AgSnO2材料中，微米级的SnO2颗粒系由纳米级的SnO2颗粒聚集而成；用反应合成法制备的AgSnO2电接触材料由于改变了银和SnO2的结合状态使材料的抗熔蚀性得到改善和提高。     

Arc erosion behavior of Ag/Ni electrical contact materials

Ag/Ni electrical contact materials tend to be weld together under high current and/or high temperature, which was a key problem to restrict the usage of Ag/Ni electric contact materials. Arc erosion characteristics of Ag/12Ni electrical contact material after 50,000 operations under direct current 19 V, 20 A and resistive load conditions were investigated. The result indicated that the probability distribution and change trend of arc energy and arc time during 50,000 operations were similar and the relationship between arc time and arc energy followed exponential function. On the one hand, “Crater” type erosion pit, island-like melted silver, pore, crack and coral-like structure spitting were observed on erosion surface of Ag/Ni contact materials. On the other hand, distribution of Ag and Ni element on molten pool of movable contact was different from that of stationary contact. For movable contact, element Ni mainly distributed on melted pool root, whereas element Ag mainly distributed inside of melted pool. For stationary contact, however, element Ni and Ag distributed layer by layer. Furthermore, arc erosion of stationary contact is more serious than that of movable contact.     

Untersuchung des Erosionsverhaltens von silberbasierten Kontaktwerkstoffen mittels FIB‐Techniken

Microstructure investigations and arc erosion behaviour of silver‐based contact materials by focused ion beam technique The understanding of the degradation mechanisms of contact materials is a key issue for the development of new materials with enhanced durability. This can be achieved through the investigation of the microstructure modification caused by electrical arcs on the surface of contacts. In this work, the erosion behaviour of pure silver and silver based composites as well as the characterization in two or three dimensions is presented. Single breaking operations were performed with direct current. Using white light interferometry, the size of the craters on the surface as well as the volume of eroded material has been measured. By means of dual beam techniques, the microstructural modifications in the crater have been investigated and reconstructed in three dimensions.     

AgSnO2电触点材料制备方法进展

综合评价了AgSnO2电触点材料的制备方法,对比分析了粉末冶金法、合金内氧化法、预氧化合金粉末法和反应合成法等几种制备方法的优缺点,简要介绍了AgSnO2电触点材料的应用进展及国内外差距,并展望了AgSnO2电触点材料的发展趋势.     

SnO2含量对AgSnO2电接触材料组织与性能的影响

采用粉末冶金法制备出银氧化锡电接触材料，研究了不同含量的氧化锡对材料组织性能的影响，随着氧化锡含量的增加，材料的导电率和抗熔蚀性能越来越差。在氧化锡含量为5wt％和8wt％时材料的性能相差较小，电接触性能较好。从降低成本及不降低材料性能来说，最佳氧化锡含量为8wt％。     

银氧化锡水热体系的共沉积反应协同性研究

研究了水热反应过程中银和二氧化锡共沉积的协同性。分别对水热反应过程中银的还原、二氧化锡的晶化沉积以及银和二氧化锡的共沉积进行了研究,结果表明,水热反应体系中H+或OH-的关联作用使二氧化锡的晶化沉积反应与银的还原反应相适应,并且由于银粉和银氧化锡复合粉体结构形貌上的差异,二者表现出内在的协同性,实现了银和二氧化锡的共沉积。     

Electroless silver plating of oxide particles in aqueous solution

It has been demonstrated that silver could be plated on colloidal oxides by reducing silver salts in the presence of colloidal oxides in aqueous solution. In this electroless plating manner, silver coatings have been applied to colloidal silica, tin oxide and to these colloids which have previously been coated with a few monolayers of tin silicate. Data from this study have demonstrated the technical feasibility of electroless plating for the preparation of silver-tin oxide composites as a source of this material for electrical contact materials.     

Failure analysis of CuW/CuCrZr contact materials in capacitor bank switch

The type test of CuW/CuCrZr arc contact used for ultra-high voltage system capacitor bank switch was conducted. Through the comparative analysis of morphologies, compositions, properties and microstructures of the contact materials before and after failure, it can be found that the abnormal open of moving arc contact and the arc erosion and mechanical wear of static arc contact are the major reasons affecting the arc contact failure. The failure mechanism and main affecting factors were investigated in detail. The results showed that arc erosion and mechanical wear are the two main factors that affect the service lifetime of arc contacts used for ultra-high voltage transmission lines and cannot be ignored. Therefore, improving the arc erosion resistance and mechanical wear resistance simultaneously is the key to prepare the arc contact materials with longer lifetime.     

AgSnO2触头材料及其添加剂的研究与发展

综述了银基氧化物电触头材料的种类和发展状况,主要阐述了银基二氧化锡电触头材料的特性以及添加氧化物添加剂的重要作用,简述了纳米复合触头材料的制备方法,介绍了国内外研究者对纳米复合AgMeO触头材料的研究进展.     

Preparation and Arc Breakdown Behavior of Nanocrystalline W-Cu Electrical Contact Materials

1. IntroductionBecause of high strength and high conductivity cou-pled with low thermal expansion coefficient, W-Cu alloyshave been widely used in the field of power engineer-ing and plasma technology, such as contact materials formedium and high voltage interrupters as well as weld-ing electrode[1,2]. Usually, W-Cu alloys are produced bypowder metallurgy, but this technology often results inthe segregation of copper phase that will influence elec-trical properties of the contact material. I…