氧化铝陶瓷的扩散连接

采用热压方式进行氧化铝陶瓷材料的扩散连接，并探讨了连接工艺对连接强度的影响。结果表明，适当的压力、连接温度、热处理时间可使此种材料产生塑性形变、空洞收缩和闭合，使接触面积增加，扩散充分进行。在１４２０℃、热压６０ｍｉｎ条件下，获得的最高强度为３５７ＭＰａ，超过母材强度；平均连接强度为２５０ＭＰａ，约为母材强度的９０％。     

陶瓷-金属连接工艺研究现状及进展

由于特种结构陶瓷材料具有良好的综合性能,近年来在动力工程和先进发动机上的应用正日益增加,也使陶瓷与金属的连接工艺成为材料工程领域的热点研究课题.综述了陶瓷与金属连接的几种方法:陶瓷与金属活性钎焊连接、扩散焊连接、过渡液相扩散连接及等离子喷涂连接,对其主要连接材料、设计原则以及相应连接工艺进行了介绍,指出了目前存在的主要问题和获得耐高温陶瓷-金属接头的新工艺及发展方向.     

半固态连接不锈钢-铝合金界面断裂性能分析

采用半固态连接技术制备了不锈钢-铝合金双金属材料,参照ASTM-E813标准,对这种双金属材料界面断裂行为进行了试验及数值分析,以KIC为评价指标,对不锈钢-半固态铝合金界面与铝合金基体的断裂韧性进行了比较.研究结果表明：采用三点弯曲实验方法,可以显著降低界面裂纹尖端的复杂应力水平;半固态连接不锈钢-半固态铝合金界面断裂为典型的脆性断裂,界面临界断裂韧性略低于基体铝合金的断裂韧性.     

金属板材轧制-扩散复合机理研究进展

金属板材轧制-扩散复合集合了轧制和扩散连接的特点,对有塑性变形条件下中间层瞬间液相扩散连接过程进行研究,是研究轧制-扩散复合界面结合机理的关键.本文介绍了国内外对瞬间液相扩散连接机理实验、数学模型和数值模拟研究的进展和现状,讨论了存在的一些问题,并提出了解决方法.     

材料超塑性和超塑成形/扩散连接技术及应用

大量的工程材料都具有超塑性,以材料超塑性为理论基础的超塑成形/扩散连接技术是先进制造技术的一种,在航空航天等许多工业部门得到了越来越多的应用.分析了材料超塑性现象,超塑性变形机理研究进展,超塑成形/扩散连接技术的理论基础.以及超塑成形/扩散连接复合工艺的技术优势、研究进展和应用现状,并展望了超塑成形/扩散连接技术的发展趋势.     

W-Fe-Ni合金与铜HIP扩散连接技术研究

以高纯Ti箔作中间过渡层材料.在QIH16型热等静压机内扩散连接W-Fe-Ni合金与紫铜材料.采用SEM对连接界面的元素分布进行了分析,测试了不同温度下连接件的拉伸强度,并分析了连接过程中元素的扩散特点.结果表明,采用145MPa/1050℃/120min热等静压工艺可成功实现W-Fe-Ni合金与铜的冶金结合,随HIP温度升高,界面元素扩散越充分,结合强度更高.     

基于GTN损伤模型的压力连接过程仿真

为了准确地反映压力连接过程中材料的破坏,在仿真模型中引入了GTN损伤模型.研究了损伤模型中影响孔洞形核、成长及聚合的材料参数,模拟了压力连接过程中材料的破坏行为,并分析了连接过程材料最先断裂的位置.结果表明,GTN损伤模型可以较好地反映上板件颈部在连接过程中的断裂,并较好地判断出了连接点断裂的初始位置在上板件颈部处的内侧,更加准确地模拟了连接过程中材料的破坏过程.     

高强钢-铝合金材料的流动应力模型研究及应用

目的 研究常温下无铆连接中高强钢与铝合金材料的应力-应变关系以及本构模型的预测效果.方法 通过拉伸试验初步研究材料性能,主要包括屈服强度、拉伸强度和伸长率等;然后采用4种流动应力模型描述塑性段,即本构模型,分别对两种材料的应力-应变关系进行表述.随后采用相关系数R值和平均绝对相对误差EAARE值评价4种模型预测应力的效果.结果 4种本构模型均能够较好地描述两种材料的应力-应变关系,高强钢与铝合金材料拟合后的R值高于0.99,EAARE值低于2％.结论 通过对比分析,Voce模型表述高强钢材料应力-应变关系的效果更好,Swift模型表述铝合金材料应力-应变关系的效果更好,并成功应用于无铆连接工艺中,且误差均低于5％.     

单螺栓连接梁的非线性连接层建模与参数识别

针对线性的螺栓连接层等效模型无法表征进入微观滑移状态后结合部动力学行为的问题，用Voce本构关系对线性连接层等效模型做出了改进，使其能表征螺栓结合部的非线性动力学行为。以单螺栓连接梁为研究对象，试验探究了不同预紧扭矩对其固有频率的影响，测试了其在不同幅值谐波激励力下的频响函数。通过遗传算法对连接层等效模型的四个非线性参数进行了识别，分别包括初始屈服应力、切线模量和两个形状参数，识别了参数后模型频响函数计算值与试验值的误差在10%以内，表明改进后模型的准确性与可行性。改进后连接层等效模型可以用于装配结构非线性行为的预测。     

TiAl基合金连接研究述评

本文综述了耐高温轻质结构材料TiAl基合金本身及其与其它材料的连接研究。阐述了熔焊、钎焊、扩散焊、摩擦焊等主要连接方法的现状，并指出了实用化研究方向。     

Diffusion behavior at void tip and its contributions to void shrinkage during solid-state bonding

Solid-state diffusion bonding is an advanced joining technique, which has been widely used to join similar or dissimilar materials. Generally, it is easy to observe the diffusion behavior during dissimilar bonding, but for similar bonding the diffusion behavior has yet been observed via experiments. In this study, the diffusion behavior at void tip was firstly observed during similar bonding of stainless steel. Scanning electron microscopy with energy dispersive spectroscopy was used to examine the interface characteristic and diffusion behavior. The results showed that a diffusion region was discovered at void tip. Element concentrations of diffusion region were more than those of void region, but less than those of bonded region. This behavior indicated that the diffusion was ongoing at void tip, but the perfect bond has yet formed. The diffusion region was attributed to the interface diffusion from adjacent region to void tip due to the stress gradient along bonding interface. The mass accumulation at void tip transformed the sharp void tip into smooth one at the beginning of void shrinkage, and then resulted in shorter voids.     

Interfacial microstructure and mechanical strength of WC–Co/90MnCrV8 cold work tool steel diffusion bonded joint with Cu/Ni electroplated interlayer

An important challenge in the design and processing of engineering materials is to combine incompatible properties of materials in the same component. One of the most common processes for joining dissimilar materials is brazing, but as a result of the poor resistance of the joints in service at high temperatures, diffusion bonding is proposed as the best suited alternative bonding process. In the present investigation, a cemented carbide (WC–15%Co) and a cold work tool steel (90MnCrV8) have been diffusion bonded in vacuum, using a ductile interlayer. Effects of the bonding time (30–60 min) and temperature (825–850 °C) on the quality of diffusion bonding interfaces were studied. The maximum tensile strength obtained confirms a very promising technology for industrial applications.     

Reactive Diffusion Bonding of SiCp/Al Composites by Insert Powder Layers with Eutectic Composition

1.IntroductionSiCp reinforced aluminium metal matrix composites(SiCp/Al MMCs)have a unique combination of mechani-cal and physical properties,such as high specific strengthand specific modulus of elasticity,low thermal expansioncoefficient and high wearing resistance,and are expectedto be widely used in aerospace engineering,automotiveindustry,electronic packaging,medical appliances,etc.It is well known that joining is the indispensable pro-cessing for industrial applications of any material…     

Influence of microwave annealing on direct bonded silicon wafers

Strong and nearly void free bonding was achieved using direct bonding followed by microwave annealing. Silicon wafers were cleaned, O₂ plasma surface activated, and bonded at room temperature. After microwave annealing at 400 °C, the bond strength of hydrophilic wafers was found to be in the range between 0.2 and 1.6 J/m². Additional heating of bonded wafers was done at elevated temperatures and for prolonged times using either rapid thermal annealing or microwave annealing. In either case, additional annealing showed no impact on wafer separation area, void, or bond strength. Thus, the initial microwave anneal dictated the ultimate bond strength regardless of subsequent annealing method. The mechanism for wafers bonded in this work involved dipole-dipole bonding and, hydrogen bonding. The initial microwave anneals typically required times less than 60 min. As a result, microwave annealing was shown to be a promising low temperature alternative for wafer bonding when compared to the currently used mechanical furnace anneals.     

冷压焊界面结合机理与结合强度研究现状EI北大核心CSCD

固相焊接因其突出的技术优势在先进金属结构材料焊接中获得越来越多的应用。冷压焊作为一种特殊固相焊接方法,其界面结合机理和结合强度预测是长期以来困扰研究者的两大难题。本文综述了冷压焊界面结合机理理论研究现状,重点讨论了冷压焊接头界面结合强度影响因素及其预测模型,并指出了今后冷压焊界面结合机理需综合考虑扩散、再结晶、位错等因素,同时结合强度预测模型应考虑变形程度、变形速率、变形温度等方面。     

Wafer Scale Solventless Adhesive Bonding with iCVD Polyglycidylmethacrylate: Effects of Bonding Parameters on Adhesion Energies

Initiated chemical vapor deposition (iCVD) polyglycidylmethacrylate (PGMA) thin films are investigated as adhesives for wafer‐scale bonding of 300 mm silicon substrates and demonstrated to form highly uniform, void‐free bond interfaces. The effects of bonding temperature and pressure on critical adhesion energy (G_c) between iCVD PGMA and silicon are studied using the four‐point bend technique. G_c values can be varied over an order of magnitude (0.59–41.6 J m⁻²) by controlling the bonding temperature and the observed dependence is attributed to changes in the physical (diffusion) and chemical (crosslinking) properties of the film. Thermal degradation studies using spectroscopic ellipsometry reveal that the iCVD PGMA films can crosslink when annealed above 120 °C in air. Further, changes in polymer behavior associated with annealing temperature are demonstrated to influence the crack propagation interface between the bonded substrates. These findings demonstrate the feasibility of iCVD polymer films for both temporary “thermoplastic,” and permanent “thermoset” bonding with potential applications in 3D integrated circuit technologies.     

Al2O3/Ti6Al4V diffusion bonding joints using Ag–Cu interlayer

Ceramic materials, such us alumina, are widely used for wear resistant and industrial components as in aircraft applications. On the other hand, Ti6Al4V is commonly used for aeronautical applications, due to its superplasticity, low weight and high mechanical resistance but has poor wear resistance because of its low resistance to plastic shearing. For these reasons numerous techniques have been developed to improve its wear resistance including joining to ceramic materials. Ceramics and alloys can be joined by several different processes and the use of an interlayer can further facilitate this process. In the present work Al₂O₃ and Ti6Al4V alloy have been diffusion bonded using a (Ag–Cu) interlayer. Identification of intermetallic phases formed within the bonded region enables the mechanical behaviour of the joints to be explained. These intermetallic phases are related to the bonding conditions applied (750 °C, 3 MPa with bonding times varied from 10 to 60 min).     

Diffusion bonding of Zr55Cu30Ni5Al10 bulk metallic glass to Cu with Al as transition layer

In this work we demonstrate the diffusion bonding of Zr₅₅Cu₃₀Ni₅Al₁₀ bulk metallic glass (BMG) to aluminum and copper alloy. The process parameters including temperature, pressure and time are investigated experimentally, and we obtain appropriate ones for accomplishing diffusion bonding of the BMG to aluminum alloy successfully. Then we present a two-step diffusion bonding process to bond the BMG to copper alloy by using aluminum alloy as transition layers, and achieve a five-layer bonded joint of BMG/Al/Cu/Al/BMG. The mechanical properties of the multilayer joint are examined. The hardness of the BMG in the joint is enhanced while the bending strength decreases significantly compared with the as-received BMG. Besides, the crystalline metals alleviate and block the extension of cracks in the BMG, which results in the joint fracturing in an explosion-proof glass manner, dissimilar to rupturing in a catastrophic manner that is always happened in the BMGs. Therefore, diffusion bonding of BMG to crystalline metals is a promising way to extend its application.     

Diffusion bonding systems

Worldwide there is a trend to use diffusion bonding for more and more applications, for example for optical components, micro devices and heat transfer elements. Despite that the market for diffusion bonded product is still small today, more than 30 companies offer diffusion bonding systems worldwide. These systems are different, starting from basic concept and type of machine, the principle of heat input and force application. In the presentation an overview of commercially available diffusion bonding system concepts and their differences is given.     

Detailed Evolution Mechanism of Interfacial Void Morphology in Diffusion Bonding

Similar diffusion bonding of 1Cr11Ni2W2MoV stainless steel was conducted at different bonding temperatures. The interface characteristics and mechanical properties of joints were examined, and the evolution of interfacial void morphology was analyzed in detail. The results showed that there were four typical interfacial void shapes generating sequentially: the large scraggly voids, penny-shaped voids, ellipse voids and rounded voids. The variation of interfacial void shape was dominated by surface diffusion, while the reduction of void volume was ascribed to the combined effects of plastic flow of materials around voids,interface diffusion and volume diffusion. Owing to the elimination of void from the bonding interface,the sound joint obtained could exhibit nearly full interfacial contact, and present excellent mechanical properties, in which the microhardness and shear strength of joint matched those of base material.