共查询到20条相似文献,搜索用时 187 毫秒
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石墨烯具有超高的比表面积和优异的力学性能, 是铜基复合材料理想的增强体。传统的粉末冶金工艺很难解决石墨烯在铜基体中的分散问题, 以及石墨烯与铜基体结合性差的难题。随着近些年研究者对石墨烯-铜界面问题深入的探索, 一些新的制备工艺不断出现。本文系统地介绍和对比了近几年石墨烯增强铜基复合材料的制备工艺, 概述了关于石墨烯/铜复合材料力学性能的研究进展, 总结了石墨烯增强铜基复合材料力学性能的机理, 并对未来石墨烯增强铜基复合材料的研究重点进行了展望。 相似文献
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不同陶瓷颗粒增强Cu基复合材料的制备及导电性能 总被引:1,自引:0,他引:1
以纯铜为基体,以WC、AlN、TiN、MgB2等具有不同导电性能与密度的陶瓷颗粒为增强相,采用球磨-冷压-烧结工艺制备了WCp/Cu、AlNp/Cu、TiNp/Cu和MgB2p/Cu系列复合材料.研究了制备工艺的不同环节对铜基复合材料导电性能的影响,讨论了不同陶瓷颗粒增强铜基复合材料的导电性能.结果表明相同制备工艺及体积分数条件下,以具有不同导电性能与密度的陶瓷颗粒作为增强相的铜基复合材料的导电性能相近,球磨、冷压、烧结、复压及复烧等工艺环节对铜基复合材料导电性能有不同程度的影响,提高铜基复合材料的致密度为提高其导电性能的关键. 相似文献
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铜基复合材料具有优异的性能及广泛的应用,而随着其应用的愈加广泛,对其摩擦磨损性能的要求也愈加严格。综述了国内外颗粒增强、石墨自润滑、纤维增强和碳纳米管增强铜基复合材料的摩擦磨损性能,并简述了目前铜基复合材料存在的一些问题及展望。 相似文献
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Fabrication and properties of short carbon fibers reinforced copper matrix composites 总被引:2,自引:0,他引:2
Lei Liu Yiping Tang Haijun Zhao Jianhua Zhu Wenbin Hu 《Journal of Materials Science》2008,43(3):974-979
Short carbon fibers (SCFs) reinforced copper matrix composites have been produced by a new electrodeposition plus cold press
and sintering technique. SCFs were copperized directly by the new method, and the electrodeposit had a loose porous structure.
The coating thickness is uniform, and can be controlled by appropriate parameters. A model representing the growth process
of these electrodeposits was presented. SCFs were distributed homogeneously, and no defects were found in the Cu/SCFs composites.
The effects of SCFs volume fraction on mechanical, physical, thermal, and tribological properties of the composites were discussed. 相似文献
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电子束固化复合材料界面粘结性能较低是急待解决的问题。利用阳极氧化技术和偶联剂涂层对碳纤维表面进行处理。处理前后的碳纤维表面性能利用SEM、XPS和接触角测试方法进行分析,通过层间剪切强度表征电子束固化复合材料界面粘结性能,并且与热固化复合材料进行对比。结果表明: 当碳纤维在酸性电解液中进行阳极氧化时,有利于提高电子束固化复合材料界面粘合性能,在碱性电解液中进行阳极氧化时, 则导致较低界面粘接性能。阳极氧化与偶联剂双重增效作用能够提高电子束固化复合材料界面粘合性能。 相似文献
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Superaligned carbon nanotube (SACNT) reinforced copper matrix laminar composites have been fabricated by means of the traditional copper sulfate electroplating process. The mechanical properties and transport properties of the Cu/SACNT composites with different SACNT content have been studied systematically, and the experimental results show that the as-prepared composites possess a better comprehensive performance than pure copper. The simple rule of mixtures (ROM) has been used to estimate the potential maximum properties of the Cu/SACNT composites. The Cu/SACNT composite is considered to be a promising material for electronics and communications applications. 相似文献
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《Materials Research Bulletin》2013,48(11):4811-4817
Graphite fiber reinforced Cu-based composites have good thermal conductivity, low coefficient of thermal expansion for heat sink applications. In these composites, the quality of interfacial bonding between the copper matrix and the graphite fibers has significant influence on the thermal properties of composites. In this study, two different carbide coatings (Mo2C or TiC) were synthesized on graphite fiber to promote the interfacial bonding in composites. Fibers/Cu composites had been produced by spark plasma sintering process. The results showed that the densification, interfacial bonding and thermal conductivity of coated composites were improved distinctly compared to that of uncoated ones. The enhanced composites present 16–44% increase of thermal conductivity in X–Y plane. An original theoretical model was proposed to estimate the interface thermal resistance. The result showed that the interfacial thermal resistance was largely reduced by one order of magnitude with the introduction of carbide interlayer. 相似文献
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Comparative study of high temperature composites 总被引:5,自引:0,他引:5
Two classes of composite made using either ceramic matrix with high temperature fibers or carbon/carbon have been used for various applications that require high temperature resistance, over three decades. However, their use has been limited to special applications because of the high costs associated with fabrication. Typically the composites are cured at more than 1000°C, and in most instances the heating has also to be carried out in controlled environments. In addition, because of the high processing temperature, only certain type of expensive fibers can be used with the ceramic matrices. A recently developed inorganic matrix, called polysialate can be cured at temperatures less than 150°C, making it possible to use carbon and glass fibers. Composites made using carbon, glass and combinations of carbon and glass fibers have been tested in bending and tension. This paper presents the comparison of processing requirements and mechanical properties of carbon/carbon composites, ceramic matrix composites made with silicon carbide, silicon nitride and alumina fibers and carbon/polysialate composites. The results indicate that carbon/polysialate composite has mechanical properties comparable to both carbon/carbon and ceramic matrix composites at room and high temperatures. Since the polysialate composites are much less expensive, the authors believe that it has excellent potential for more applications in aerospace, automobile and naval structures. 相似文献
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碳纳米管因特殊结构带来的优异性能而被海内外学者广泛关注,以碳纳米管为增强相制备铜基复合材料是使铜基导体同时具有高强度和高导电性能的有效途径。然而,由于碳纳米管表面能高、表面反应活性低,碳纳米管/铜复合材料制备的过程中存在增强体分散性差和界面结合强度弱两大问题,从而阻碍了复合材料高性能的实现。在碳纳米管/铜复合材料的制备过程中,采用适当的方法对碳纳米管进行表面处理能改变碳纳米管的表面结构和反应活性,在改善碳纳米管的分散性的同时增强碳纳米管与铜基体的界面结合,从而提高碳纳米管的增强效率,保证复合材料良好的综合性能。然而,表面处理过程可能会破坏碳纳米管的结构完整性,影响碳纳米管的本征性能,进而影响其增强效果,或可能在基体中引入其他杂质,影响复合材料的导电和导热性能。因此,在进行表面处理时应综合考虑其对碳纳米管结构性能及复合材料增强作用的影响。近年来,研究者们通过优化碳纳米管表面处理工艺突破了碳纳米管/铜复合材料在制备过程的难点,在保证铜基体优异的导电、导热性能的同时,大幅提高了碳纳米管/铜复合材料的力学性能。碳纳米管表面处理工艺类型大致可分为机械球磨、化学表面改性、表面镀层和联合表面处理四类。传统的机械球磨表面处理对碳纳米管的结构破坏较大;化学表面改性又分为共价表面改性和非共价表面改性,非共价表面改性在保持碳纳米管完整的管状结构和优异性能的同时,提高了碳纳米管在溶液中的分散性,但用于复合材料制备时会给基体引入有机杂质,影响复合材料性能;共价表面改性和表面镀层是铜基复合材料制备过程中最为常用和有效的表面处理方法,其能够在提高碳纳米管在基体中的分散性能的同时改善碳纳米管表面的反应活性,从而形成碳纳米管和铜基体之间强度较高的反应结合界面,实现碳纳米管/铜复合材料高强高导的综合性能。此外,可通过综合利用各种表面处理方法,结合各表面处理工艺的优势,获得更为优异的改性效果。本文从碳纳米管表面处理工艺的基本类型以及碳纳米管表面处理对铜基复合材料结构和性能的影响两方面阐述了碳纳米管表面处理在铜基复合材料中的应用和研究进展,并对其未来的研究方向进行了展望。 相似文献
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陶瓷纤维及其陶瓷基复合材料 总被引:2,自引:0,他引:2
介绍了连续陶瓷纤维及其陶瓷基复合材料在近年的研究进展,重点评述了陶瓷纤维以及陶瓷基复合材料制备工艺的研究现状,并对连续纤维陶瓷基复合材料的前景进行了展望。 相似文献