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采用润湿平衡法测定了在不同试验温度下Sn-Cu-Ni无铅钎料在Cu,Au/Ni/Cu,SnBi/Cu三种基板上的润湿时间和润湿力,研究了钎焊温度对Sn-Cu-Ni无铅钎料在不同基板上润湿性能的影响.结果表明,温度升高使Sn-Cu-Ni无铅钎料的表面张力减小,能显著缩短钎料在铜片上的润湿时间,提高润湿力;Ni/Au或SnBi等镀层能显著降低钎料/基板界面张力,因此Sn-Cu-Ni无铅钎料在Au/Ni/Cu或SnBi/Cu基板上的润湿性能优于在Cu基板上的润湿性能. 相似文献
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Maximum bubble pressure measurement was employed to evaluate surface tension of Sn-8Zn-3Bi- (0-0.15)Nd and Sn-8Zn-3Bi-(0 -0. 15)La solder melts. Wetting balance method was used to measure wetting force and wetting time on Cu substrate of the two group solders. The experimental results show that minute amount of Nd or La addition to Sn-8Zn-3Bi solder causes significant decrease of the surface tension of the solder melts at 200 - 240 ℃ and Nd addition is more effective on reduction of surface tension than that of La. Nd or La addition has the effect on enhancing the wetting force of the solder melts on Cu substrate, which results from the de- crease of interracial tension between the solder melt and Cu substrate. The wetting force reaches the maximum when 0.1% Nd is added to the base alloy. The contact angle between Sn-8Zn-3Bi base solders and Cu substrate decreases with the addition of Nd or La and the minimum of the contact angle is obtained from the solder with 0.1% Nd addition. 相似文献
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Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys 总被引:1,自引:0,他引:1
Janusz Pstruś Przemysław Fima Tomasz Gancarz 《Journal of Materials Engineering and Performance》2012,21(5):606-613
Wetting properties of Sn-Zn and Zn-Al alloys on Cu and Al substrates were studied. Spreading tests were carried out for 3 min,
in air and under protective atmosphere of nitrogen, with the use of fluxes. In the case of Zn-Al eutectic, spreading tests
were carried out at 460, 480, 500, and 520 °C, and in the case of Sn-Zn eutectic at 250, 300, 350, 400, 450, and 500 °C, respectively.
Solidified solder/substrate couples were cross-sectioned and subjected to microstructure examination. The spreading tests
indicated that the wetting properties of eutectic Sn-Zn alloys, on copper pads do not depend on temperature (up to 400 °C),
but in the lack of protective atmosphere, the solder does not wet the pads. Wettability studies of Zn-Al eutectic on aluminum
and copper substrates have shown a negative effect of the protective nitrogen atmosphere on the wetting properties, especially
for the copper pads. Furthermore, it was noted that with increasing temperature the solder wettability is improved. In addition,
densities of liquid solders were studied by means of dilatometric technique. 相似文献
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The present investigation aimed to evaluate the influence of zinc bath metallurgy on the hotdip galvanizing of a high-manganese-alloyed steel (commercial grade X-IP 1000). Wetting force and contact angle measurements were carried out by the Wilhelmy plate methodology to assess zinc bath compositions. The Wilhelmy plate methodology was particularly suitable for both quantifying liquid zinc wetting and producing coated samples to be characterized. The aluminium content of the zinc bath varied between 0.05 and 1.10 wt % and manganese as well as silicon was additionally added to the bath composition. Best wetting occurred with aluminium contents which are typical for industrial galvanizing baths (0.12-0.22 wt %). But zinc wetting and wetting reactivity decreased with increasing aluminium content > 0.30 wt %. Hence, aluminothermic MnO reduction seems to be ineffective in the present case. Wetting results might be further improved by adding manganese or silicon to the zinc bath due to an improved wetting reaction. However, the formation of additional phases in the coating has to be considered with regard to technical use. 相似文献
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采用平衡润湿测试法研究了270 ℃时,施加超声振动和直流电耦合作用对液态Sn钎料在Cu基体上润湿行为的影响。通过对润湿平衡曲线的测量发现:超声和直流电耦合作用能显著改善Sn钎料的润湿性,随着超声功率和电流强度的增加,最大平衡润湿力也随之增加。对润湿过程中界面微观结构的观察结果显示,超声和直流电耦合作用增强了Cu基体在熔融Sn钎料中的溶解,促进了界面金属间化合物的析出。利用有限元软件对液态Sn钎料内部的声压分布进行模拟,发现最大声压发生在超声探头的端部。在超声振动和直流电耦合作用下,界面析出金属间化合物时所产生的化学驱动力以及超声和直流电作用引起钎料内部强烈的对流作用共同促进了三相线的移动,从而改善了钎料润湿性。 相似文献
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采用润湿平衡法研究了在znC12一NH4C1、中等活性松香(RMA)和免清洗三种不同钎剂作用下,Sn-Zn无铅钎料在Cu基板上的润湿特点.结果表明,使用ZnC12-NH4C1钎剂时,Sn-Zn钎料具有良好的润湿性能;研究了不同钎剂下,Sn-9Zn钎料在Cu基板上的铺展情况,并分析比较了焊点界面金属间化合物层的特征.Sn-Zn钎料与Cu基板界面形成的金属间化合物在靠近Cu基板一侧较为平坦,而在钎料一侧呈扇贝状,而且,不同钎剂能影响钎料在Cu基板上的润湿、铺展性能,界面金属间化合物特征及焊点外观;Sn-Zn钎料表面存在大量ZnO,去除钎料表面ZnO是开发针对Sn-Zn系无铅钎料专用钎剂的关键. 相似文献
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采用润湿平衡法研究了合金元素Ga,Al,Ag复合添加对Sn-9Zn钎料润湿性的影响.结果表明,Ga,Al,Ag的最佳添加量分别为0.2,0.002,0.25(质量分数,%);添加合金元素后钎料的高温抗氧化性能显著提高.俄歇电子能谱分析表明,Sn-9Zn-0.2Ga-0.002Al-0.25Ag钎料表面Al高度富集并形成一层致密的氧化膜,可阻挡氧向液态钎料内部扩散,减少钎料的氧化.Sn-9Zn-0.2Ga-0.002Al-0.25Ag钎料与Cu/Ni/Au基板之间的金属间化合物由一层平坦的AuZn3和颗粒状的AuAgZn2化合物组成.另外,微焊点力学试验表明,采用Sn-9Zn-0.2Ga-0.002Al-0.25Ag钎料时,电子元器件与基板间微焊点的力学性能比Sn-9Zn钎料略有提高. 相似文献
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基于润湿平衡原理测定了不同温度与不同气氛下Sn-Cu-Ni-Ce钎料在Cu基板上的润湿行为,研究了气氛、温度以及微量稀土元素Ce对其润湿性能的影响.结果表明,采用氮气保护时,Cu基板表面张力提高,钎料表面张力降低,润湿时间缩短了20%~50%,润湿力也显著提高;温度升高使Sn-Cu-Ni-Ce钎料的表面张力减小,显著缩短了钎料在Cu基板上的润湿时间;稀土元素Ce可显著降低熔融钎料的表面张力和钎料/基板间的界面张力,从而使Sn-Cu-Ni-Ce钎料的润湿性能较Sn-Cu-Ni钎料有了显著的改善. 相似文献
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In对Sn-8Zn-3Bi无铅钎料润湿性的影响 总被引:4,自引:1,他引:4
首先采用铺展法测试了Sn-8Zn-3Bi-(0~5)In钎料合金的铺展性.结果表明,少量In的加入提高了钎料的润湿性.当In含量达到0.5%时(质量分数,下同),钎料在铜基底上的铺展面积最大.采用气泡最大压力法对Sn-8Zn-3Bi-(0~1.5)In钎料熔体进行了表面张力测试.加入0.5%的In大大降低了Sn-8Zn-3Bi钎料熔体的表面张力,但进一步增加In的含量导致熔体表面张力增大.最后采用润湿平衡法对上述钎料进行了润湿力测试.结果表明0.5%In的加入使合金的润湿力达到最大,其原因是钎料/铜界面的界面张力减小. 相似文献
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分析了Sn2.5Ag0.7Cu/Cu钎料在添加活性元素前后,润湿性能及界面形貌的演变规律.测定了Ge元素含量不同时钎料的铺展面积,用扫描电镜对化合物的形态进行了分析.分析了钎焊时固液相界面张力与活性元素在该处吸附量的关系及其对润湿性能的影响.结果表明,在钎料中Ge元素质量分数为0.5%时,其在界面处的吸附量明显增加,化合物向前生长趋势强烈,润湿铺展面积最大.在质量分数为1.0%时其吸附量依然明显,但润湿效果减弱,且化合物的厚度相对变薄.这说明Ge元素在一定的范围内会降低钎焊界面处的张力,并且当偏聚量较大时可抑制铜和钎料之间的扩散作用,阻碍化合物生长. 相似文献
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Wetting of electroless nickel by the eutectic SnAgCu solder alloy was investigated in the as-deposited and annealed conditions. In the as-deposited state, P content in the nickel had a minimal effect on the solderability of the electroless nickel. Upon annealing, numerous nickel phosphide particles precipitated out of the electroless nickel with a high-P content. The presence of these phosphide precipitates reduced the solderability of the electroless nickel both in terms of the wetting force and wetting kinetics. While weakening in the wetting force is related to the inferior contact condition, the slower wetting kinetics is explained in terms of the reduction in the dissolution rate of the electroless nickel from non-soluble phosphide particles. 相似文献
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采用润湿平衡法,选用商用水洗钎剂,研究了镍添加量及钎焊工艺参数对Sn2.5Ag0.7Cu0.1RE钎料合金在铜引线上的润湿适配性. 结果表明,当Sn2.5Ag0.7Cu0.1RE钎料合金中镍添加量为0.05%时,钎料合金显微组织明显细化;当钎焊温度为255 ℃、钎焊时间为5 s、浸渍速度为20 mm/s、浸渍深度为3 mm的情况下, 其与φ0.6×30 mm的铜引线具有较好的润湿适配性,即具有较短的润湿时间,较小的润湿角,较大的润湿力,符合润湿力、润湿时间和润湿角的相关标准,完全满足现代表面组装技术对无铅钎料润湿性能的要求. 相似文献
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Reaction properties and interfacial intermetallics for Sn−xAg−0.5Cu solders as a function of Ag content 总被引:1,自引:0,他引:1
Jong-Hyun Lee A-Mi Yu Jeong-Han Kim Mok-Soon Kim Namhyun Kang 《Metals and Materials International》2008,14(5):649-654
Wetting and interfacial reactions were investigated for Sn−xAg−0.5Cu alloys, in which the Ag content had a variation from
x=1.0 to x=4.0. Differential scanning calorimetry (DSC) was used to investigate the range of the melting temperature and the
solidification temperature by measuring the endothermic and the exothermic heat flow, respectively. Low Ag contents increased
the melting temperature ranges and deteriorated the wetting properties such as zero cross time and wetting force measured
at two seconds. The extent of undercooling increased and the thickness of intermetallic compounds (IMC) decreased as the Ag
content decreased. As the Ag content decreased, the initial IMC thickness decreased due to the large undercooling and, during
the solid aging at 170°C, the IMC growth slightly decelerated because of the small diffusion coefficient. For the application
of good drop shock reliability, Sn−Ag−Cu solder of low Ag content should be beneficial due to the restraint of the IMC growth
(Cu6Sn5 and Cu3Sn) and of the coarse plate-like IMC (Ag3Sn). 相似文献
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水洗钎剂下SnAgCu系钎料对不同基板的润湿特性 总被引:5,自引:0,他引:5
选用商用水洗钎剂,采用润湿平衡法,研究了低银SnAgCu系钎料合金在表面贴装元器件及紫铜板上的润湿特性。研究结果表明,在Ag的质量分数为2.5%时,SnAg2.5Cu0.7钎料合金具有最大的润湿力和铺展面积及最小的润湿角。其润湿力高于现行商用SnAg3.8Cu0.7钎料合金,完全可满足表面组装元器件对其润湿性能的要求。 相似文献
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《稀有金属(英文版)》2017,(3)
Among the lead-free solder materials,Sn-AgCu alloys have many advantages,such as good wetting property,superior interfacial properties and high creep resistance.In this article,the organization and welding performance of Sn-Ag-Cu material were investigated.The surface morphology of the two alloys was observed by stereoscopic microscope and scanning electron microscope(SEM).Chemical constitution was examined by X-ray energy-dispersive spectroscopy(EDS).The mechanical properties of Sn-Ag-Cu solder were evaluated systematically compared with those of Sn-Cu solder.The results show that Sn-Ag-Cu solder based on different solder pads has different welding properties.The thickness of intermetallic compound(IMC) at the interface increases with aging time.For the gold-plated pads,there are a large number of IMC graphic,and in the welding interface,it can reduce the reliability of electrical connection.The Sn-AgCu solder joints show a superior mechanical property over the traditional Sn-Cu solder.The number of dimples decreases and that of cavities increases for Sn-Cu0.7 alloy and the fracture surfaces of Sn-Ag3.0-Cu0.5 alloy have many small size dimples which are homogeneously distributed. 相似文献