Study on interracial structure and strength of Si3N4/Ti/Cu/Ti/Si3S4 PTLP bonding

Partial transient liquid-phase bonding （PTLP bonding） of Si3N4 ceramic with Ti/Cu/Ti multi-interlayer is performed with changing the thickness of Ti foil. The influence of Ti foil thickness on interface structure and joint strength was discussed. The joint interface structures are investigated by scanning electron microscope （SEM） and energy dispersion spectroscopy（EDS）. The results show that the maximum joint strength of 210 MPa is obtained at room temperature in the experiments. When joining temperature and time are not changed and the process of isothermal solidification is sufficient , interface structure, reaction layer thickness and isothermal solidification thickness change with the thickness of Ti foil.     

Dynamic study in partial transient liquid phase bonding of Si3 N4

Dynamics in partial transient liquid phase bonding ( PTLP bonding) of Si3N4 ceramic with Ti/Cu/Ti multiinterlayer was systematically studied through micro-analysis of joint interfaces. The results show that growth of reaction layer and isothermal solidification procession do at the same time. Growth of reaction layer and moving of isothermal solidification interface obey the parabolic law governed by the diffusion of participating elements during the PTLP bonding. Coordination of the above two dynamics process is done through time and temperature. When reaction layer thickness is suitable and isothermalsol idification process is finished, the high bonding strength at room temperature and high temperature are obtained.     

FEM simulation on residual stress distribution during diffusion bonding between Ti （ C,N） metallic ceramic/interlayer/40Cr steel

Based on ANSYS FEM software, the distribution of residual stress in the diffusion bonding joints between Ti（ C,N） metallic ceramic/interlayer/4OCr steel was calculated and experimentally ver~ed. The results showed that the trend on the distribution of residual stress field in the joints was not changed with the use of interlayer. The maximum residual stress was always located in metallic ceramic with area ranging from 1 mm to 4 mm to the interlayer. The maximum residual stress in the joints was also affected by diffusion temperature. The satellite pulse current during the initial stage on diffusion bonding can promote the formation of liquid film at the interface, by which diffusion temperature and loading pressure can be greatly decreased. The crack initiation was easily produced at the corner of Ti （ C, N） metallic ceramic close to the interlayer. If a higher residual stress produced in the joints, the crack was propagated into the whole ceramic.     

Development of Si_3N_4/Al composite by pressureless melt infiltration

1 Introduction Composites of ceramic/metal or metal/ceramic are expected to have properties superior to their constituents alone[1?4]. However, the fundamental difference in atomic bonding between metals and ceramics results in quite different physical a…     

Effect of bonding parameters on microstructure and properties of Si3S4／Si3S4 joint brazed by Cu-Zn-Ti filler alloy

Si3N4 ceramic was jointed to Si3N4 ceramic using a filler alloy of Cu-Zn-Ti at 1 123-1 323 K for 0.3- 2.7 ks. Ti content in the Cu-Zn-Ti filler alloy was 15% (molar fraction). The effect of bonding parameters on the microstructure and mechanical properties of the Si3N4/Si3N4 joint were investigated. The results indicate that with increasing brazing temperature from 1 123K to 1 323 K and brazing time from 0.3 ks to 2.7 ks, the thickness of the interracial reaction layer between the filler alloy and the Si3 N4 ceramic and the size and amount of the reactant products in the filler alloy increase, leading to an increase in shear strength of the joint from 163 MPa to 276 MPa. It is also found that the fracture behavior of the Si3 N4/Si3 N4 joint greatly depends on the microstructure of the joint.     

Interface evolution of TiAl／Ti6242 transient liquid phase joint using Ti, Cu foils as insert metals

The interface evolution of TiAl/Ti6242 joint produced by transient liquid phase(TLP) bonding with Ti,Cu foils as insert metals was investigated. The results show that the surface oxide layer on TiAI plays a very important role in the formation process of the joint. A ‘bridge‘ effect is observed because of the presence of the oxide layer on the surface of TiAl. The diffusion behavior of Cu atoms in TiAl is strongly controlled by the vacancies beneath the surface of TiAl. Based on the interface diffusion and interface wettability, a mechanism for the effect of bonding pressure, bonding temperature, holding time and stacking sequence of the insert foils on the joint formation process were proposed.     

Photoelectrocatalytic properties and reactivity of Ti/Au-TiO2 mesh electrodes

A kind of photoelectrode was innovated by anodising titanium mesh in H2SO4 solution and photo-reduced in HAuCl4 solution and named Ti/Au-TiO2 mesh electrode.The structural and surface morphology of the Ti/Au-TiO2 mesh was examined by X-ray diffraction,laser Raman spectra,scanning electronic microscopy(SEM) and X-ray photoelectron spectroscopy respectively.The results indicate that its crystal structure,morphology and the size of pore are affected greatly by gold deposition.XPS measurement show that the valence band of Ti/TiO2 has two peaks:a wide one at 4.97eV and a narrow one at 6.61eV,which correspond mainly to π(nonbonding)and σ(bonding)O 2p orbitals,The emission intensity of O 2p orbitals becomes stronger and the width of the valence band increases with the increase of Au content.And the emission of nonbonding shifts toward lower binding energy and that of bonding O 2p orbitals shifts toward higher binding energy.The photoelectrocatalytic(PEC) oxidation of humic acid( HA) was investigated in terms of TOC.The PEC oxidation efficiency of Ti/Au-TiO2 mesh with optimal content of gold is higher than that of Ti/TiO2 mesh.It is suggested that the recombination of electrons and holes is hindered owing to gold deposition.The investigation shows that PEC oxidation is a convenient way to mineralize organic matter for water treatment.     

Bonding of Al2O3 ceramic and Nb using transient liquid phase brazing

The brazing of Al2O3 to Nb was achieved by the method of transient liquid phase (TLP) bonding. Ti foil and Ni-5V alloy foil were used as interlayers for the bonding. The base materials were brazed at 1423-1573 K for 1-120 min. The results show that the shear strength of the joint first increases and then decreases with increasing holding time and brazing temperature. The joint interface microstructure and elements distribution were investigated. It can be concluded that a composite structure, in which the base metals are solid solution Nb(V) and Nb(Ti) reinforced by Ni3Ti, is formed when the brazing temperature is 1473 K and holding time 15 min, and a satisfactory joint strength can be achieved. The interaction of Ti foil and Ni-5V foil leads to the formation of liquid eutectic phase with low melting point, at the same time the combination of Ti come from the interlayer with O atoms from Al2O3 results in the bonding of Al2O3 and Nb.     

Effect of Bonding Temperature on the Microstructures and Strengths of C/C Composite/GH3044 Alloy Joints by Partial Transient Liquid-Phase（PTLP） Bonding with Multiple Interlayers

With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon(C/C) composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on the microstructures and strengths of the joints was investigated.The results showed that gradient structural multiple interlayers composed of ‘‘C–Ti reaction layer/Ti–Ni intermetallic compound layer/Ni–Cu sosoloid/residual Cu layer/Ni-GH3044 diffusion layer' were formed between C/C composite and GH3044.The shear strength of the C/C composite/GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 °C.In addition,the fracture morphology showed that the fracture mode changed with the increase of bonding temperature.     

Stress-induced martensitic transformation in （Ni47Ti44）100-xNbx shape memory alloys with wide hysteresis

The effect of deformation via stress-induced martensitic transformation on the reverse transformation behavior of the （Ni47Ti44）100-xNbx （x=3, 9, 15, 20, 30, mole fraction, %） shape memory alloys was investigated in detail by differential scanning calorimetry （DSC） after performing cryogenic tensile tests at a temperature of Ms＋30 ℃. The results show that Nb-content has obvious effect on the process of stress-induced martensitic transformation. It is also observed that the stress-induced martensite is stabilized relative to the thermally-induced martensite （TIM） formed on cooling, and Nb-content in Ni-Ti-Nb alloy has great influence on the reverse transformation start temperature and transformation temperature hysteresis of stress-induced martensite（SIM）. The mechanism of wide transformation temperature hysteresis was fully explained based on the microscopic structure and the distribution of the elastic strain energy of （Ni47Ti44）100-xNbx alloys.     

Diffusion bonding of Ti-6Al-4V to ZQSn10-10 in vacuum

The experimental investigation of the direct diffusion bonding of Ti-6Al-4V to ZQSn10-10 was carried out in vacuum. The microstructure of bonded joint was studied by scanning electron microscopy （SEM）, energy dispersive spectroscopy （ EDS ） and the mechanical properties were detected by the tensile experiments. The microstructure and tensile strength of the joint mainly depend on the bonding temperature and bonding time. A satisfying diffusion bonded interface with a tensile strength of 73.9 MPa can be obtained under the condition of bonding temperature 850℃ for 30 rain. Three kinds of reaction products were observed in the bonded interface, namely β-Ti, CoaTi and CuSn3Ti5. And the brittle Cu3Ti and CuSn3 Ti5 are mainly responsible for lowering the strength of the bonded joint. The diffusion distances of Sn , Cu and Ti and square root of bonding time are approximately linear relationship. And diffusion velocity of Sn, Cu and Ti in the diffusion reaction layer are 0. 013 9,0. 069 7 and 0. 056 4 mm^2/s.     

PLASMA SPRAYED Ti AND HA COATINGS： A COMPARATIVE STUDY BETWEEN APS AND VPS

Titanium (Ti) and hydroxyapatite (HA) coatings have been prepared via air (APS) and vacuum plasma spraying (VPS), and then their composition, structure, bonding strength and bioactivity were examined. The results obtained reveal that in APS process many of Ti were oxidized, but in VPS the oxidization was avoided. VPS Ti coating possesses better bonding condition than APS Ti coating. As for HA coating, higher crystallinity has been obtained while the coating was deposited by VPS as compared with APS. The simulated body fluid (SBF) tests show that both of APS and VPS HA coatings possess good bioactivity. As compared with APS, VPS is recommended as a better method to deposit Ti and HA coatings that can be applied as hard tissue replacement implants.     

Formation mechanism of the porous zone at the bonded Si3 N4/Ni interface

Diffusion bonding of Si3N4 ceramic to itself was performed using Ni interlayer. A flat Si3N4/Ni interface was found at a lower temperature （ 1 273 K）. Whereas at a higher temperature （ 1 473 K）, a porous zone located at the Si3N4/Ni interface and some petal-like Ni3 Si compounds precipitated in the Ni interlayer were observed. The formation mechanism of the porous zone was investigated based on a fracture analysis. An additional stress （O＇add ） generated at the Si3NJNi interface played an important role in the formation of the porous zone, which was resulted from the aggregation of nitrogen during the bonding process. A calculation equation of the O＇aaj was derived to analyze its effects. The results indicated that %~ was directly in dependent with diffusion bonding temperature and dwell time.     

Ferroelectric properties of dysprosium-doped Bi4Ti3O12 thin films crystallized in various atmospheres

Dysprosium-doped Bi4Ti3O12 （Bi3.4Dy0.6Ti3O12, BDT） ferroelectric thin films were deposited on Pt（111）/Ti/SiO2/Si（111） substrates by chemical solution deposition （CSD） and crystallized in nitrogen, air and oxygen atmospheres, respectively. X-ray diffraction （XRD） and scanning electron microscopy （SEM） were used to identify the crystal structure, the surface and cross-section morphology of the deposited ferroelectric films. The results show that the crystallization atmosphere has significant effect on determining the crystallization and ferroelectric properties of the BDT films. The film crystallized in nitrogen at a relatively low temperature of 650 ℃, exhibits excellent crystallinity and ferroelectricity with a remanent polarization of 2Pr = 24.9 ℃/cm^2 and a coercive field of 144.5 kV/cm. While the films annealed in air and oxygen at 650 ℃ do not show good crystallinity and ferroelectricity until they are annealed at 700 ℃. The structure evolution and ferroelectric properties of BDT thin films annealed under different temperatures （600-750 ℃） were also investigated. The crystallinity of the BDT films is improved and the average grain size increases when the annealing temperature increases from 600 ℃ to 750 ℃ at an interval of 50 ℃. However, the polarization of the films is not monotonous function of the annealing temperature.     

Preparation of Ti-based amorphous brazing alloy

A new kind of amorphous active brazing alloy foil with the composition of Ti40Zr25Ni15Cu20 was successfully synthesized using melt spinning in roll forging machine in argon atmosphere. The amorphous structure and composition were examined by X-ray diffraction, differential thermal analysis and energy dispersive X-ray detector. The results show that the Ti40Zr25Ni15Cu20 amorphous alloy foil has excellent wettability on Si3N4 ceramic and demonstrate a strong glass forming ability. The reduced glass transition temperature （Trg） and the temperature interval of supercooled liquid region before crystallization are 0.76 and 78 K, respectively.     

Investigation on diffusion bonding of TiAl intermetallic to Ti3AlC2 ceramic with Ni interlayer

In this study, vacuum atmosphere. The diffusion bonding of TiAI alloy and Ti3AlC2 ceramic was carried out using Ni foil as interlayer in a interfacial microstructures and the mechanical properties of the diffusion bonded joints were evaluated. Result showed that the interfacial microstructure of the joint from TiAl to Ti3AlC2 side could be divided into Al3NiTi2 , AlNi2 Ti , Ni3 （ Al, Ti） , Ni , Ni3 （ Al , Ti） , Ni （ Al , Ti ） , Ni3Al ＋ TiC~ ＋ Ti3AlC2 , respectively. The shear strength test showed that an average value of 45.9 MPa was achieved. The crack propagated along the interface between TiAl intermetallic and Ni interlayer during the shear test. The mechanisms f or formation of those compound layers during bonding process and the determinant of the fracture location were also discussed.     

Synthesis of Ti3SiC2 by spark plasma sintering(SPS)of elemental powders

Ti3SiC2 materials have been fabricated by spark plasma sintering of the elemental powders with the addition of Al.At the heating rate of 80℃/min and under the pressure of 30MPa,the ideal synthesis temperature of Ti3SiC2 is in the range of 1150-1250℃.The addition of Al is in favor of the formation of Ti3SiC2.The synthesized compound has the molecular of Ti3Si0.8Al0.2C2 and lattice parameters of α=0.3069nm,c=1.7670nm.Its grain is plane-shape with a size of about 50μm in the elongated dimension.The prepared material has Vickers hardness of 3.5-5.5GPa(at 1N and 15s) and is as readily machinable as graphite‘s.     

Effect of microstructure on tensile properties and fracture behavior of intermetallic Ti2AlNb alloys

The tensile properties and fracture behaviors of Ti-22Al-27Nb and Ti-22Al-20Nb-7Ta alloys were investigated in the temperature range of 25-800℃ Three typical microstructures were obtained by ifferent thermomechanical processing techniques.The results indicate that the duplex microstructure has an optimum combination of tensile yield strength and ductility both at room and elevated temperatures.Adding Ta to Ti2AlNb alloy can improve the yield strength,especially at high temperature while retain a good ductility.The study on crack initiation and propagation in dedformed microstructure of Ti2AlNb alloys indicates that microstructure has ikmportant effect on the tensile fracture mechanism of the alloys.The cracks initiate within primary O/α2 grains along O/B2 boundaries or O phase laths in B2 matrix,and propagate along primary B2 grain boundaries for the duplex microstructure.The fracture mode is transgranular with ductile dimples for the duplex and the equiaxed microstructures,but intergranular for the lath microstructure.     

Fabrication of Ti_3AlC_2 ceramic material by mechanical alloying

Ti3AlC2 has the properties of ceramics and metals.These excellent properties indicate that Ti3AlC2 is a very promising material to extensive applications.Ti3AlC2 ceramic material was prepared by mechanical alloying.The effects of milling time and sintering temperature on the fracture,microstructure and mechanical properties of Ti3AlC2 ceramic material were analyzed by laser particle analyzer,X-ray diffraction,and scanning electron microscopy.The experimental results showed that Ti3AlC2 had the best comprehensive properties after the composite powder was milled for 3 h and sintered at 1630℃ for 2 h.The relative density,bending strength,and hardness of the sample reached 92.23%,345.2 MPa,and HRA 34.1,respectively.The fracture surface indicated that the fracture of the material belonged to ductile rapture.     

Ceramic bonding and joint＇s strengthening through forming intermetallic compounds in situ

The transient liquid phase diffusion bonding of Si3N4 ceramics with Ti/Ni/Ti and Al/Ti/AI multiple interlayers was performed. The formation of intermetallic compounds in situ and their effects on the joints‘ strengths were investigated. The Ti/Ni/Ti interlayers produce NiTi and Ni3Ti layers with considerable room temperature ductility and high elevated temperature strength to strengthen the bonding zone metals and the joints. The joints with 142 MPa shear strength at room temperature and 88 MPa shear strength at 800℃ are achieved under appropriate parameters, respectively. Al/Ti/Al interlayers transform into a special bonding zone metal with a large amount of Al3 Ti particles and a small amount of Al-based solid solution, and in this case, the joints are strengthened significantly. Their strengths at room temperature and 600℃ reach 90 MPa and 30 MPa, respectively.