Dynamic study in partial transient liquid phase bonding of Si3 N4

Dynamics in partial transient liquid phase bonding ( PTLP bonding) of Si3N4 ceramic with Ti/Cu/Ti multiinterlayer was systematically studied through micro-analysis of joint interfaces. The results show that growth of reaction layer and isothermal solidification procession do at the same time. Growth of reaction layer and moving of isothermal solidification interface obey the parabolic law governed by the diffusion of participating elements during the PTLP bonding. Coordination of the above two dynamics process is done through time and temperature. When reaction layer thickness is suitable and isothermalsol idification process is finished, the high bonding strength at room temperature and high temperature are obtained.     

Transient liquid-phase bonding of superalloy K465 using a Ni-Cr-Fe-B-Si amorphous interlayer alloy

A kind of Ni-Cr-Fe-B-Si system amorphous alloy was used as interlayer in transient liquid-phase bonding(TLP bonding) of polycrystalline superalloy K465.The bonding behavior,microstructure feature and the tensile properties of the joints were investigated.There are B-rich phase and Si-rich phase formed in the center of the seam after bonding at 1210℃ for 30 min.The isothermal solidification is complete after bonding at 1210℃ for 4 h.The relationship of the average width of the remnant eutectic zone and bonding time at 1210℃ is nonlinear.The tensile strength of the bonded joint at room temperature and 900℃ is comparable to that of K465 alloy.     

A two-step transient liquid phase diffusion bonding process of T91 steels

In this study,a two-step heating process is introduced for transient liquid phase( TLP) diffusion bonding for sound joints with T91 heat resistant steels. At first,a short-time higher temperature heating step is addressed to melt the interlayer,followed by the second step to complete isothermal solidification at a low temperature. The most critical feature of our new method is producing a non-planar interface at the T91 heat resistant steels joint. We propose a transitional liquid phase bonding of T91 heat resistant steels by this approach. Since joint microstructures have been studied,we tested the tensile strength to assess joint mechanical property. The result indicates that the solidified bond may contain a primary solid-solution,similar composition to the parent metal and free from precipitates. Joint tensile strength of the joint is not lower than parent materials. Joint bend's strengths are enhanced due to the higher metal-to-metal junction producing a non-planar bond lines.Nevertheless,the traditional transient liquid phase diffusion bonding produces planar ones. Bonding parameters of new process are 1 260 ℃ for 0.5 min and 1 230 ℃ for 4 min.     

A study on the two-step transient liquid phase diffusion bonding of K640 superalloy

A new technology, the two-step transient liquid phase diffusion bonding （TLP-DB） technology for cobalt-based K640 superalloy, was investigated. The method consists of a short-time high temperature heating to melt interlayer followed by isothermal solidification of liquid phase at a lower temperature than that of the conventional TLP-DB. The result indicates that the two-step TLP-DB can reliably produce an ideal joint with uniform chemical composition, which is superior to the joint welded by conventional TLP-DB in microstructure and mechanical properties. Bonding parameters of new process are 1 250℃ for 0. 5 h and 1 180℃ for 3 h. The high-temperature tensile strength of the joint by two-step TLP-DB reaches 74% of that of the base material on an equal basis, but the high-temperature tensile strength of the joint by conventional TLP-DB is only 58% of that of the base material.     

Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal

A model of dissolution and isothermal solidification during the transient liquid phase (TLP) bonding process of nickel using Ni-15.2wt.%Cr-4.0wt.%B ternary filler metal is presented. The model combined thermodynamic calculation with Thermo-Calc software and diffusion analysis by a finite difference method. The model assumed diffusion-controlled transformation, and the equilibrium compositions at the solid-liquid interface were calculated using Thermo-Calc software. The interface velocity was determined from the mass balance of solutes diffusing into or out from the interface. When a Ni specimen with a 30 μm thick filler metal was kept at 1473 K for 3.6 ks, isothermal solidification was almost complete. On the other hand, when the specimen was kept at 1373 K for 3.6 ks, residual liquid remained in the bonding region. The solidification sequence of the residual liquid during the cooling stage was calculated by the Scheil simulation. The simulation showed that solidification of the residual liquid is completed with a ternary eutectic reaction, L→fcc+Ni₃B+CrB. The calculated width of the eutectic region concurred with the experimental result.     

Diffusion welding process and joint''''s microstructure behavior of SiC_w/6061Al composite

The rules such as process parameters affecting joint properties and the evolution principle of weld's microstructure have been researched by adopting diffusion welding process to connect SiCw/6061Al composite. Experimental results show that there exists a critical temperature region between solid and liquid phase line of SiCw/6061 Al composite, and the region will shrink with the increasing of welding pressure. When diffusion welding occurred under the critical temperature region, welding joint exhibits bad property of bonding, and the matrix and the reinforcement can't bond effectively. When diffusion welding occurred in the critical temperature region, the strength of welding joint changes widely with the variation of welding temperature. When welding temperature varies in 10癈, the strength of welding joint will change obviously. Only when welding temperature is higher than the critical temperature region, stable joint properties can be obtained. Simultaneously the matrix and the reinforcement has bet     

Diffusion welding process and joint＇s microstructure behavior of SiCW／6061Al composite

The rules such as process parameters affecting joint properties and the evolution principle of weld‘s microstructure have been researched by adopting diffusion welding process to connect SiCw/6061Al composite. Experimental results show that there exists a critical temperature region between solid and liquid phase line of SiCw/6061A1 composite, and the region will shrink with the increasing of welding pressure. When diffusion welding occurred under the critical temperature region, welding joint exhibits bad property of bonding, and the matrix and the reinforcement can‘t bond effectively. When diffusion welding occurred in the critical temperature region, the strength of welding joint changes widely with the variation of welding temperature. When welding temperature varies in 10℃, the strength of welding joint will change obviously.Only when welding temperature is higher than the critical temperature region, stable joint properties can be obtained. Simultaneously the matrix and the reinforcement has better interfacial bonded in diffusion welding interface, and no obvious interface reaction occurred, and thus diffusion welding of SiCw/6061Al composite can be successfully realized.     

Transient liquid phase diffusion bonding of a single crystal superaUoy DD6

DD6 alloy was bonded by transient liquid phase (TLP) diffusion bonding. The main compositions of the interlayer alloy employed were similar to those of the base metal, DD6, and a certain amount of element B was added as the melting point depressant. The results show that it is difficult to obtain the joints with the microstructures completely homogeneous. For the joint TLP diffusion bonded at 1290℃ for 12h, about half areas of the beam possessed αγ γ′ microstructure, nearly identical with that of the base metal, and the other local areas consisted ofT-solution, borides, etc. Prolonging the bonding time to 24h, the inhomogeneous areas in the joint reduced, and the joint property improved. The joint stress-rupture strength at 980℃ and 1100℃ reached 90%-100% and 70%-80% of those of the base metal respectively.     

Transformation Mechanism of (γ+γ') and the Effect of Cooling Rate on the Final Solidification of U720Li Alloy

The transformation mechanism of(γ+γ') was studied by analyzing the microstructure and elemental distribution of the U720 Li samples heated at 1250℃ and cooled at the rates in the range of 1–100℃/s. Although the(γ+γ') is deemed to be formed by a eutectic reaction and has been called eutectic(γ+γ'), it was found in the present study that the(γ+γ') precipitation begins with a peritectic reaction of(L+γ) ? γ', and develops by the eutectic reaction of L ?(γ+γ'). The energy for the γ' nucleation is low because the interfacial energy for the γ/γ' interface is about one-tenth of the solid/liquid interface, and hence, the nucleation rate is high and the fine structure of(γ+γ') is formed at the initial precipitation stage. The γ and γ'in(γ+γ') tend to grow into a lamellar structure because it is difficult for them to nucleate directly from the residual liquids, and hence, the γ' precipitates naturally tend to grow divergently direction of the regions rich in Al and Ti, forming a fan-like structure of the(γ+γ'). As a result, the γ' precipitates will coarsen finally because the space between them is enlarged. The solidification of the final residual liquids is a diffusion dependent process. When cooled at a higher rate, a higher degree of super cooling is reached and finally the solidification is finished by the pseudoeutectic reaction of L ?(γ+ boride) and L ?(γ+η), which can absorb Zr and B. When cooled at a rate low enough,most of the residual liquids are consumed by the(γ+γ') growth due to the sufficient diffusion, and the boride and Zrbearing phase are precipitated at a quasi-equilibrium state. Under this condition, Ti is depleted at the(γ+γ') growth front.However, the g-Ni_3 Ti phase is formed there occasionally due to the boride precipitation, because the compositions of the two phases are complementary.     

Effects of Homogenization Treatment on the Microsegregation of a Ni–Co Based Superalloy Produced by Directional Solidification

To reduce microsegregation,a series of homogenization treatments were carried out on a Ni-Co based superalloy prepared through directional solidification(DS).The element segregation characteristics and microstructural evolution were investigated by optical microscopy(OM),scanning electron microscopy(SEM),and electron probe microanalysis(EPMA).The results show that the elements are non-uniformly distributed in the solidified superalloy,in which W and Ti have the greatest tendency of microsegregation.Furthermore,severe microsegregation leads to complicated precipitations,including η-Ni_3Ti and eutectic(γ+γ').EPMA results show that Al and Mo are uniformly distributed between the eutectic(γ+γ')and γ matrix,whereas Ti is segregated in the eutectic(γ+γ') and η phases.The positive segregation element Ti,which is continuously rejected into the remaining liquid during γ matrix solidification,promotes the formation of eutectic(γ+γ') and the transformation of the η phase.According to the homogenization effect,the optimal single-stage homogenization process of this alloy is 1180 ℃ for 2 h because of the sufficient diffusion segregation of the elements.In the present study,a kinetic diffusion model was built to reflect the degree of element segregation during homogenization,and the diffusion coefficients of W and Ti were estimated.     

单晶高温合金的过渡液相扩散焊

为了探明单晶过渡液相(TLP)扩散焊接头组织与性能的关系,采用扫描电镜(SEM)研究接头微观组织,并进行力学性能测试. 结果表明,接头由连接区和基体区所组成. 当等温凝固过程未完成时,连接区由等温凝固区和快速凝固区组成,而等温凝固区主要由γ和γ'相组成,快速凝固区主要是由共晶组织组成. 当等温凝固完成而固态均匀化过程不充分时,连接区由等温凝固区和分布在接头中心的硼化物相组成. 采用低温等温凝固,高温固态均匀化的焊接工艺可以获得高性能的接头.     

IC10单晶过渡液相扩散焊接头微观组织与力学性能

采用扫描电镜（SEM）和能谱分析仪（EDS）研究IC10单晶高温合金过渡液相（TLP）扩散焊接头微观组织演变．结果表明,接头由连接区和基体区所组成,连接区由等温凝同区和快速凝固区组成．快速凝固区可以通过延长保温时间的方法予以消除．随着保温时间从2h增加到8h,基体内的γ＇相尺寸达到了0．9μm．通过限制TLP扩散焊接头内晶界的形成,以及焊后固溶处理的方法可以有效提高接头的力学性能．在温度1000℃下,接头平均抗拉强度为507MPa．在温度1000℃、应力144MPa下接头持久寿命可达到120h以上．     

Ni3Al单晶高温合金过渡液相扩散焊工艺

采用KNi3中间层,对Ni3Al单晶高温合金进行过渡液相扩散焊,分析不同焊接保温时间的接头和基体组织的变化,测试接头的高温持久性能.结果表明,1 240℃保温12 h,TLP扩散焊接头局部区域有少量的γ＋γ＇共晶组织及小块状的硼化物组织,其它区域均为与基体组织一致的γ＋γ＇双相组织;基体γ＇相由四方形转变成不规则状.焊接接头在1 000℃高温持久强度达到标准状态的基体强度90%.试样组织出现γ＇相筏形化,焊缝区域筏形组织粗化,且形状不规则,与持久应力方向呈一定角度.     

标准热处理对采用BNi-9焊料的瞬时液相连接IN-738LC高温合金的影响

研究标准热处理对扩散焊IN-738LC高温合金显微组织和力学性能的影响。对连接样品进行全固溶退火、部分固溶退火和时效处理3个不同的热处理。结果表明,在1120℃下焊接5 min,会导致不完全等温凝固,在焊缝处形成富Ni、Cr的硼化物共晶相。当保温时间延长到45 min时,接头中发生完全等温凝固,形成镍的先共晶固溶体γ相。等温凝固和非等温凝固样品的标准热处理能完全消除扩散影响区的硼化物相,并在等温凝固区形成γ’析出相。然而,在非等温凝固样品的接头区观察到不连续的再凝固产物。等温凝固样品经标准热处理后,剪切强度最高(约801 MPa),为基材剪切强度的99%。     

Microstructural characteristics of a cast IN718 superalloy bonded by isothermal solidification

Isothermal solidification is a key feature of transient liquid phase bonding which prevents the formation of deleterious intermetallic phases in the joint centerline and results in bonds with improved mechanical performance. This paper discusses the metallurgical characteristics and mechanical properties of an as-cast IN718 superalloy bonded by diffusion-induced isothermal solidification of Ni-7Cr-4.5Si-3.2B-3Fe (wt%) filler metal. After transient liquid phase bonding of as-cast IN718 at 1000 °C for 60 min, a bond exhibiting a solid solution microstructure with joint efficiency of 72% in terms of shear strength was obtained. The joining process was effectively able to prevent the formation of hard and brittle nickel and chromium borides, which typically lead to critical problems in brazing. The formation of Nb-rich Laves phase, which is well known as a major issue in the fusion welding of IN718, was not observed. The bonding time, which governs the extent of isothermal solidification, was a critical parameter for controlling the mechanical properties of the joints in terms of shear strength and hardness distribution across the bond.     

Microstructural evolution mechanism during brazing of Hastelloy X superalloy using Ni–Si–B filler metal

The paper aims at understanding solidification phenomena and solid state precipitations during diffusion brazing of Hastelloy X nickel base superalloy using a ternary Ni–4.5Si–3.2 B (in wt-%) filler metal. The joint is featured by the formation of Ni-rich solid solution in an isothermal solidification zone, borides/silicide formation during eutectic-type solidification in an athermal solidification zone, on-cooling precipitation of fine nickel silicides in the joint centerline, in situ precipitation of Mo–Cr-rich borides in the diffusion affected zone and grain growth in the heat affected zone. The implication of the phase transformations on the joint properties is discussed. It is shown that Hastelloy X exhibited very fast isothermal solidification which can be attributed to its high Mo and Cr content that promotes in situ boride precipitation during brazing.     

热处理对80μm间隙下IC10高温合金TLP扩散焊组织及高温性能的影响

采用瞬间液相扩散焊技术焊接了80 μm间隙下的IC10高温合金,利用扫描电镜(SEM/EDS)、纳米压痕仪及高温拉伸试验机对热处理前后IC10接头焊缝组织形貌、弹性模量、显微硬度、高温拉伸、高温持久性能及接头断口形貌进行了测试. 结果表明,当采用SBM-3作为中间焊料,焊缝间隙尺寸为80 μm时,在1 250 ℃,5 MPa,6 h的焊接工艺条件下,焊缝组织与母材组织形貌成分相近. 经过热处理后,测得其在1 100 ℃的温度下,抗拉强度可达268 MPa,高于母材(275 MPa)的97.5%;对焊缝的高温持久性能进行了检测,测得其在温度1 100 ℃,应力为36 MPa的条件下,焊缝持久寿命大于117 h,高于母材的90%. 在接头结构中,较大体积浓度的γ + γ′相存在于焊缝中,接头结构由母材平稳过渡到焊接接头. 高温拉伸及高温持久试验中裂纹从硼化物和碳化物的边缘以及γ + γ′共晶边缘处的微孔扩展. 热处理提高了母材弹性模量的同时降低了焊缝的弹性模量,接头弹性模量的降低提高了TLP扩散焊接头的高温力学强度.     

BNi68CrWB钎焊K24/GH648异种高温合金的界面形成机理

采用BNi68CrWB钎料粉末对K24和GH648异种高温合金进行钎焊连接,分析了接头典型界面组织,提出了钎焊过程反应机理.结果表明,接头由共晶区、等温凝固区和扩散区组成.共晶区由WB,CrB和镍基固溶体组成,等温凝固区为镍基固溶体,GH648侧扩散区由WB,W_xB_y,Cr_xB_y,以及沿晶界析出的镍基固溶体和少量的Cr₂Ni₃相组成,K24侧扩散区与母材差异不明显.钎焊过程由元素富集、母材溶解、等温凝固和共晶凝固四个阶段组成.其中等温凝固阶段是钎焊过程中最关键的阶段,等温凝固不完全时,钎缝中央存在共晶组织,影响接头性能.钎焊温度1 150℃,保温120 min时,等温凝固完全,接头组织均匀,力学性能最优,室温拉剪强度可达323 MPa.     

Microstructure selection in the interdendritic region during directional solidification of a Ni-23at.%Al alloy

Directional solidification experiments of a binary Ni-23at.%Al alloy were carried out to examine the effects of growth velocity on the microstructure selection in the interdendritic region. Only the growth velocity was changed from 5 μm/s to 60 μm/s under a given thermal gradient. As a result, the noticeable change in the microstructure during solidification occurred between the γ dendrites. The γ interdendritic microstructure was varied as a function of growth velocity from rod γ-γ′ coupled peritectic structure to planar γ′ structure and then to eutectic structures consisting of stable γ′-β eutectic and metastable γ-β, eutectic structures. The microstructure selected preferentially among the γ dendrites was considered by calculating the interface temperature of a phase growing into its parent melt. It is shown that the microstructure selection in the γ interdendritic region is determined by a phase or a structure kinetically leading at the highest interface temperature under a given growth condition.     

压力对FGH96/GH4169高温合金惯性摩擦焊接头性能的影响

在惯性摩擦焊机上对FGH96/GH4169高温合金进行了焊接,焊后利用光学显微镜、扫描电镜以及拉伸试验机等设备分析了接头的微观组织形貌、显微硬度、拉伸性能及断口形貌. 结果表明,摩擦焊近界面处最高温度接近1 100 ℃,界面处温度超过强化相固溶温度. 焊缝区组织为细小的等轴晶粒,晶粒尺寸远小于母材,热力影响区发生了拉伸变形. 焊后接头热力影响区处的强化相部分重溶,接头界面细晶区的强化相完全重溶. 随压力增大,Co原子的扩散距离增加,接头室温抗拉强度和高温抗拉强度有所升高,断裂位置位于GH4169侧热力影响区,断裂形式为韧性断裂.