Aging response of transient liquid phase bonded wrought IN718 superalloy: influence of post-bond heat treatment

Aging response of transient liquid phase Nb bearing wrought IN718 nickel base superalloy is studied. The aging behaviour of the joint is influenced by low Nb+Al+Ti content of isothermal solidification zone (ISZ) and formation of Nb–Cr–Mo based boride precipitates in diffusion affected zone (DAZ). It was shown that applying a post-bond heat treatment which was able to eliminate the diffusion induced boride precipitates in DAZ and increase the Nb+Al+Ti content of the ISZ improved the aging response and shear strength of the joint.     

Thermal Properties of Ni-Cr-Si-B-Fe Based Interlayer Material and Its Application in TLP Bonding of IN 718 Superalloy

A new Ni-Cr-Si-B-Fe filler material is prepared for transient liquid-phase (TLP) bonding of Inconel 718 superalloy by mechanical alloying technique. The melting temperature range of the filler material and its activation energy of melting are determined by differential scanning calorimetry technique. The activation energy and melting temperature of the alloy powder decrease with increasing milling time. Inconel 718 alloy was joined via TLP by using the newly developed filler material. The effect of TLP bonding temperature and time on microstructural evolution and mechanical properties of the joint was investigated. Three distinct microstructural regions were observed in the bonding area: isothermal solidification zone consisting of a single-phase solid solution, diffusion affected zone consisting of extensive diffusion-induced precipitates of metallic boride, and unaffected base material. The ultimate shear strength and microhardness of the TLP-bonded joint increase with bonding time and temperature.     

Microstructure－properties relationship of transient liquid phase diffusion bonded a third generation single crystal superalloy joint

Microstructure of transient liquid phase( TLP) diffusion bonded a third generation single crystal superalloy joint was investigated using scanning electron microscopy( SEM),and mechanical properties test of joint was carried out,for obtaining relationship between microstructure and mechanical properties of joint. The results showed that the joint contained bonding zone and base metal. The diffusion zone was obviously observed. When it was not finished for isothermal solidification process,the bonding zone would contain isothermal solidification zone and rapid solidification zone. Metallographic examination revealed that isothermal solidification zone was consisted of γ and γ' phase. Rapid solidification zone was consisted of two different structures,which were ternary eutectic of borides,γ and γ' phase developing at the edge of joint,binary eutectic of γ and γ' phase appearing in the portion of joint. When it was not enough for homogenization process under the condition of finishing isothermal solidification process,the bonding zone would contain isothermal solidification zone and borides at the interface. Under the conditions of relatively high welding temperature and long welding time,average tensile strength of joint was equivalent to that of parent material.     

Formation process, microstructure and mechanical property of transient liquid phase bonded aluminium-based metal matrix composite joint

1　INTRODUCTIONThealuminium basedmetalmatrixcomposites(MMCs)areadvancedmaterialsthathavesuperiorproperties ,especiallyincreasedstiffness ,highstrength ,goodwearresistanceandsuperiorelevatedtemperatureproperties .Theyhavereceivedconsider ableattentionascandidatesforadvancedindustrialapplications[1,2 ] .But ,theirapplicationshavebeenseverelyrestrictedbythelackofasuitablejoiningmethod[3] .AlthougthfusionweldingmethodscanbeusedtojointheMMCs ,themethodsnormallytendtoresultinunfavourablejoint…     

Microstructural and mechanical properties assessment of transient liquid phase bonding of CoCuFeMnNi high entropy alloy

The transient liquid phase (TLP) bonding of CoCuFeMnNi high entropy alloy (HEA) was studied. The TLP bonding was performed using AWS BNi-2 interlayer at 1050 °C with the TLP bonding time of 20, 60, 180 and 240 min. The effect of bonding time on the joint microstructure was characterized by SEM and EDS. Microstructural results confirmed that complete isothermal solidification occurred approximately at 240 min of bonding time. For samples bonded at 20, 60 and 180 min, athermal solidification zone was formed in the bonding area which included Cr-rich boride and Mn₃Si intermetallic compound. For all samples, the γ solid solution was formed in the isothermal solidification zone of the bonding zone. To evaluate the effect of TLP bonding time on mechanical properties of joints, the shear strength and micro-hardness of joints were measured. The results indicated a decrement of micro-hardness in the bonding zone and an increment of micro-hardness in the adjacent zone of joints. The minimum and maximum values of shear strength were 100 and 180 MPa for joints with the bonding time of 20 and 240 min, respectively.     

瞬时液相异种连接FSX-414/MBF80/IN738体系的固/液界面位置的预测(英文)

采用有限元差分法模拟FSX-414/MBF80/IN738体系异种瞬时液相(TLP)连接的等温凝固过程。将TLP连接模型分为2部分,并运用一个移动的液/固界面模型来研究他们。使用扩散方程对每部分接头进行预测,直到等温凝固过程结束;分别预测了这2部分的等温凝固完成时间、浓度分布曲线和固/液界面位置,认为这2部分固/液界面的交点是等温凝固的终点。为了获得一些必要的扩散数据,在不同温度、时间和真空条件下进行FSX-414/MBF80/IN738体系的瞬时液相连接实验。结果表明,实验结果与预测结果一致。     

Role of interlayer composition in microstructure and mechanical properties during TLP bonding of GTD-111/IN-718 superalloys

An investigation was carried out to assess the applicability of transient liquid phase bonding of two dissimilar super-alloys with different interlayers. The effect of using three types of interlayer such as BNi-2, BNi-3, and BNi-9 on microstructure and mechanical properties was studied in the GTD-111/IN-718 system at 1100 °C for different bonding time. To determine the compositional changes and microstructure in the joint region, field emission scanning electron microscopy equipped with energy dispersive spectroscopy was utilized. The formation of Ni₃B in the athermally solidified zone (ASZ) is controlled by the B content and, accordingly, the morphology of Ni₃Si is governed by the Si content. The Cr content might impede the relocation of B from the interlayer into the base metal and the formation of CrB inside the ASZ is dominated by the Cr content. The high micro-hardness of the eutectic compounds is originated from the formation of boride matrixes such as Ni or Cr boride. The shear strength of the joint using BNi-9 after the completion of isothermal solidification is lower compared that that using BNi-3 and BNi-2, which could be related to the absence of Si in the filler metals constituent and the significant presence of Cr in BNi-9.     

IC10单晶过渡液相扩散焊接头微观组织与力学性能

采用扫描电镜（SEM）和能谱分析仪（EDS）研究IC10单晶高温合金过渡液相（TLP）扩散焊接头微观组织演变．结果表明,接头由连接区和基体区所组成,连接区由等温凝同区和快速凝固区组成．快速凝固区可以通过延长保温时间的方法予以消除．随着保温时间从2h增加到8h,基体内的γ＇相尺寸达到了0．9μm．通过限制TLP扩散焊接头内晶界的形成,以及焊后固溶处理的方法可以有效提高接头的力学性能．在温度1000℃下,接头平均抗拉强度为507MPa．在温度1000℃、应力144MPa下接头持久寿命可达到120h以上．     

单晶高温合金的过渡液相扩散焊

为了探明单晶过渡液相(TLP)扩散焊接头组织与性能的关系,采用扫描电镜(SEM)研究接头微观组织,并进行力学性能测试. 结果表明,接头由连接区和基体区所组成. 当等温凝固过程未完成时,连接区由等温凝固区和快速凝固区组成,而等温凝固区主要由γ和γ'相组成,快速凝固区主要是由共晶组织组成. 当等温凝固完成而固态均匀化过程不充分时,连接区由等温凝固区和分布在接头中心的硼化物相组成. 采用低温等温凝固,高温固态均匀化的焊接工艺可以获得高性能的接头.     

A two-step transient liquid phase diffusion bonding process of T91 steels

In this study,a two-step heating process is introduced for transient liquid phase( TLP) diffusion bonding for sound joints with T91 heat resistant steels. At first,a short-time higher temperature heating step is addressed to melt the interlayer,followed by the second step to complete isothermal solidification at a low temperature. The most critical feature of our new method is producing a non-planar interface at the T91 heat resistant steels joint. We propose a transitional liquid phase bonding of T91 heat resistant steels by this approach. Since joint microstructures have been studied,we tested the tensile strength to assess joint mechanical property. The result indicates that the solidified bond may contain a primary solid-solution,similar composition to the parent metal and free from precipitates. Joint tensile strength of the joint is not lower than parent materials. Joint bend's strengths are enhanced due to the higher metal-to-metal junction producing a non-planar bond lines.Nevertheless,the traditional transient liquid phase diffusion bonding produces planar ones. Bonding parameters of new process are 1 260 ℃ for 0.5 min and 1 230 ℃ for 4 min.     

Dynamic study in partial transient liquid phase bonding of Si3 N4

Dynamics in partial transient liquid phase bonding ( PTLP bonding) of Si3N4 ceramic with Ti/Cu/Ti multiinterlayer was systematically studied through micro-analysis of joint interfaces. The results show that growth of reaction layer and isothermal solidification procession do at the same time. Growth of reaction layer and moving of isothermal solidification interface obey the parabolic law governed by the diffusion of participating elements during the PTLP bonding. Coordination of the above two dynamics process is done through time and temperature. When reaction layer thickness is suitable and isothermalsol idification process is finished, the high bonding strength at room temperature and high temperature are obtained.     

A study on the two-step transient liquid phase diffusion bonding of K640 superalloy

A new technology, the two-step transient liquid phase diffusion bonding （TLP-DB） technology for cobalt-based K640 superalloy, was investigated. The method consists of a short-time high temperature heating to melt interlayer followed by isothermal solidification of liquid phase at a lower temperature than that of the conventional TLP-DB. The result indicates that the two-step TLP-DB can reliably produce an ideal joint with uniform chemical composition, which is superior to the joint welded by conventional TLP-DB in microstructure and mechanical properties. Bonding parameters of new process are 1 250℃ for 0. 5 h and 1 180℃ for 3 h. The high-temperature tensile strength of the joint by two-step TLP-DB reaches 74% of that of the base material on an equal basis, but the high-temperature tensile strength of the joint by conventional TLP-DB is only 58% of that of the base material.     

瞬间液相扩散焊与钎焊主要特点之异同

从焊接进程、凝固、氧化物的破碎、中间层与钎料的区别、接头组成、脆性相的形成与消除、压力的作用、接头强化机理等方面总结分析了瞬间液相扩散焊与钎焊的区别。强调指出了下述关键点 :(1)中间层的选取是获得两种不同焊接方法接头的首要前提 ;(2 )在钎焊中侧重点是润湿性 ,它是保证接头获得一定强度的首要前提与主要手段 ;(3 )在瞬间液相扩散焊过程中 ,除了润湿性之外 ,更为关注的是降熔元素的扩散。中间层中降熔元素向母材的持续扩散是TLP接合中液态区增宽、破碎氧化膜、等温凝固、均匀化现象的本质原因 ;降熔元素向母材的充分扩散及由此而出现的中间层成分的合理改变是TLP焊接成败的命脉     

Transient liquid phase bonding of 304 stainless steel using a Co-based interlayer

Transient liquid phase bonding of AISI 304 austenitic stainless steel was carried out using a Co-based interlayer with 40?μm thickness. The effect of bonding time and solid-state homogenisation time on the microstructure and mechanical properties of samples was investigated. The results showed that isothermal solidification was completed within 30?min at a constant temperature of 1180°C. With increasing homogenisation time, at 1000°C, a more uniform distribution of alloying elements and hardness profile across the joint region was achieved. The average shear strength of homogenised samples was about 72% that of the base metal at the same heat treatment cycle.     

瞬间液相扩散焊过程中的接触熔化与等温凝固模型

接触熔化与等温凝固是瞬间液相扩散焊过程中两个非常重要的阶段,是获得优质连接接头的关键,一直以来也是学术界研究的热点.综述了接触熔化与等温凝固过程的动力学模型,包括接触熔化与等温凝固时间的解析解,接触熔化过程中反应层厚度与连接时间符合扩散控制的抛物线规则,以及等温凝固过程中液/固界面迁移的速度方程.并对现有模型进行了分析和讨论.     

Microstructure and mechanical properties of dual phase steels,with different martensite morphology,produced during TLP bonding of a low C-Mn steel

In this research, production of ferrite - martensite dual phase Steels with different martensite morphology was considered during transient liquid phase bonding of a low carbon steel. The steel was bonded using an iron base interlayer with melting point of 1443 K and 40 μm thickness. Bonding process carried out at 1473 K, under pressure of 0.5 MPa, at different holding time of 10, 20, 30 and 40 minutes. Microstructural studies of joint region showed that isothermal solidification completed at the bonding time of 40 minutes. Microstructure of joints made at the bonding time of 10, 20, and 30 minutes consists of two distinct region, athermal and isothermal solidified zones. Microstructure of these zones was studied and chemical composition of these zones was determined by EDS. Joints made with bonding time of 40 minutes were homogenized at 1008 K and then cooled into cold water to produce dual phase ferrite and martensite microstructure with different martensite morphology. According to shear test results, it was found that the shear strength of ferrite - fibrous martensite microstructure is greater than those with ferrite - continuous martensite and ferrite - blocky martensite microstructure.     

Effect of Interlayer Thickness on Joint Formation Between Ti-6Al-4V and Mg-AZ31 Alloys

The joining of a Ti-6Al-4V alloy to a Mg-AZ31 alloy was performed using Ni electroplated coatings during the TLP bonding process. In this work, different coating thicknesses were used ranging from 1 to 20 μm. The effect of the coat thickness on microstructural developments and mechanical properties was studied. The bonded specimens were examined by metallographic examination, scanning electron microscopy, and X-ray diffraction analysis. It was observed that as the coat thickness increased from 1 to 12 μm, the joint shear strength increased from 9 to 47 MPa. A further increase in coat thickness had a detrimental effect on the bond strength, and a lower value of 11 MPa was recorded. The mechanism of joint formation includes three stages: solid-state diffusion, eutectic formation, and isothermal solidification.     

Effect of bonding temperature on transient liquid phase bonding behavior of a Ni-based oxide dispersion-strengthened superalloy

The effect of joining temperature on the transient liquid phase (TLP) bonding of MA758 superalloy was investigated. The TLP bonds were made at temperatures of 1100 and 1200 °C. Analysis was undertaken to determine the changes within the joint microstructure. The bonding temperature affected the extent of parent metal dissolution, the time for isothermal solidification, and the attainment of microstructural continuity across the joint region. Bonding at 1100 °C did not result in extensive parent metal dissolution, and subsequent shear testing showed failure through the center of the joint. However, bonding at 1200 °C increased parent metal dissolution resulting in significant agglomeration of Y₂O₃ particles at the joint interface. Failure was observed along the joint interface in regions depleted of strengthening particles. Bonding at a higher temperature reduced the time for isothermal solidification but also reduced the strain energy of the oxide dispersion-strengthened alloy so that grain growth across the joint region could not be achieved.     

TiNi形状记忆合金与不锈钢的瞬时液相扩散焊

采用AgCu金属箔作中间过渡层,对TiNi形状记忆合金与不锈钢进行了瞬时液相扩散焊,分析了接头的显微组织、元素分布和物相组成等,研究了接头的抗剪强度和断裂方式。结果表明:接头界面区由TiNi侧过渡区,中间区,不锈钢侧过渡区组成,主要相分别为Ti(Cu,Ni,Fe),AgCu,TiFe等。连接温度为860℃,保温时间为60min,连接压力为0.05MPa时,接头最大抗剪强度为239MPa。断裂发生在TiNi母材和AgCu中间层扩散界面上,断口为混合断裂形貌。通过中间层等温凝固过程动力学模型,结合界面形貌和元素扩散分析,认为TiNiSMA与不锈钢异种材料瞬时液相扩散焊过程存在明显的非对称性。     

Transient liquid phase diffusion bonding under a temperature gradient: modelling of the interface morphology

Imposing a temperature gradient when transient liquid phase (TLP) diffusion bonding results in reliable joints with shear strengths as high as those of the parent material (e.g. aluminium-based alloys and composites). The key feature of this new method relies on the formation of non-planar interfaces as a consequence of morphological instability at the solid/liquid interface during solidification of the liquid layer (normally with a eutectic composition) at the bonding temperature. A model is proposed in this paper which is capable of predicting interface morphology and the bonding conditions which result in the formation of non-planar bond lines when using this new bonding method. The results of model provide an insight to the nature of the solidification process. The proposed model was verified experimentally when bonding pure aluminium and also an aluminium alloy (6082) using copper interlayers.