真空溅射镀膜机中工作气体对镀件色差的影响

真空溅射镀膜机镀件的色差是衡量一件镀件质量好坏的重要的指标,也是评估一台设备质量的重要技术指标.影响镀件色差有多种因素,工作气体是其中一个重要因素.从真空溅射机的工作原理、工作气体对膜层的影响及试验研究入手,从气体压力和气体分布均匀性两个方面探讨了真空溅射机镀膜过程中工作气体对镀件色差的影响.为镀件色差分析、真空溅射镀膜机工作气体进气管的设计和镀件质量的提高提供了新的思路和参考.     

基于PLC的真空均质乳化机设计与实现

介绍了真空均质乳化机的组成及工作原理,根据乳化机的自动化控制要求,设计了基于PLC的控制系统,包括控制系统总体方案的设计,控制系统硬件和软件的设计,并对真空均质乳化机进行了现场调试。结果表明,设计的控制系统能够满足真空均质乳化机智能控制的要求,实现了乳化的自动控制,设备运行效果良好。     

用于溅射薄膜的光学厚度监控器

本文叙述对提供溅射薄膜光学厚度的实时监控工业用的溅射装置的改进。允许通过氦氖激光束时,设计利用在靶中心有个真空小窗口,通过溅射膜增长调节反射光强容许就地测量其厚度。     

基于PLC设计真空调压铸造智能控制系统

本文对PLC技术进行分析,使PLC技术能够和铸造控制系统相结合,设计了基于PLC技术真空调压铸造智能控制系统。本文设计的真空掉牙铸造智能控制系统能够实现真空制造过程工艺的智能化控制,且在外界发生变化的过程中修改其控制参数。     

溅射MoS2膜对轴承形状及尺寸精度的影响

溅射法形成固体润滑膜是一种先进的加工工艺，MoS2是真空润滑性能最好的固体润滑剂，溅射MoS2膜的润滑性与基体材料及工艺参数有关。对不同基体材料、不同尺寸的轴承采用不同的溅射参数溅射MoS2膜，分析了镀膜对轴承尺寸及形状精度的影响。     

大型等离子处理设备真空系统设计

为使大尺寸印制板能够进行低温等离子处理,设计了大型等离子处理设备,该设备具有真空度可调的真空系统、电极可冷却的电源系统及基于可编程逻辑控制器(Programmable Logic Control,PLC)和触摸屏的控制系统。文中简要介绍了大型等离子处理设备的组成及工作方式,详细阐述了真空系统设计,包括真空泵组选型计算和基于有限元的真空腔体结构优化设计。实践证明,该设备具有等离子体产生速度快、腔体温度控制效果好等特点,达到了国内领先水平。     

X射线激光自支撑Mo滤光膜的制备及特性研究

用直流平面磁控溅射方法在抛光玻璃衬底上淀积 Mo薄膜 ,将薄膜在真空环境中进行热处理 ,用扫描探针显微镜 ( SPM)方法观察了薄膜的表面形貌 ,X-射线衍射方法分析了薄膜中应力各向异性特征及其与淀积时溅射气体压强和真空热处理的关系。发现薄膜中晶粒具有明显的择优取向 ,内应力沿径向对称分布 ,切向应力比径向应力更具有压应力特性 ,应力的各向异性特征与溅射原子的入射方向有关。真空热处理对薄膜中压应力的释放作用不明显 ,然而能有效地释放薄膜中的张应力。用 HF酸腐蚀衬底的方法制备了自支撑 Mo薄膜 ,发现脱膜前后薄膜表面微观形貌未产生大的变化。     

X射线激光自支撑Mo滤光膜的制备及特性研究

用直流平面磁控溅射方法在抛光玻璃衬底上淀积Mo薄膜,将薄膜在真空环境中进行热处理,用扫描探针显微镜(SPM)方法观察了薄膜的表面形貌,X-射线衍射方法分析了薄膜中应力各向异性特征及其与淀积时溅射气体压强和真空热处理的关系.发现薄膜中晶粒具有明显的择优取向,内应力沿径向对称分布,切向应力比径向应力更具有压应力特性,应力的各向异性特征与溅射原子的入射方向有关.真空热处理对薄膜中压应力的释放作用不明显,然而能有效地释放薄膜中的张应力.用HF酸腐蚀衬底的方法制备了自支撑Mo薄膜,发现脱膜前后薄膜表面微观形貌未产生大的变化.     

X射线激光自支撑Mo滤光膜的制备及特性研究

用直流平面磁控溅射方法在抛光玻璃衬底上淀积Mo薄膜,将薄膜在真空环境中进行热处理,用扫描探针显微镜(SPM)方法观察了薄膜的表面形貌,X-射线衍射方法分析了薄膜中应力各向异性特征及其与淀积时溅射气体压强和真空热处理的关系.发现薄膜中晶粒具有明显的择优取向,内应力沿径向对称分布,切向应力比径向应力更具有压应力特性,应力的各向异性特征与溅射原子的入射方向有关.真空热处理对薄膜中压应力的释放作用不明显,然而能有效地释放薄膜中的张应力.用HF酸腐蚀衬底的方法制备了自支撑Mo薄膜,发现脱膜前后薄膜表面微观形貌未产生大的变化.     

将平面用溅射装置改造为微粒用溅射装置

采用在真空室内加旋转筒的方法，将某平面用溅射装置改造为微粒用溅射装置。运行结果表明，利用筒体旋转的方法，可以在粒度100μm左右的微粒表面包覆均匀完整的铬膜层，微粒形状对表面涂层的均匀、完整、涂层速度等有重要影响，微粒被筒体带动的力主要为二者间的分子间作用力，离心力起的作用很小。若将用于平面镀涂的溅射装置改造为处理微粒，需对溅射装置中的溅射靶和真空系统进行较大的改造。     

差压式真空注型数字控制系统研究

在差压式真空注型工艺方法分析的基础上,确定影响浇注件质量的关键因素,构建差压式数字控制真空注型系统,对其关键技术进行研究,提出了基于直接图像法的气泡监控方法和基于模糊神经网络的质量控制方法,并介绍了具体的实现过程。最后,通过物理样机进行实验以验证差压真空注型工艺对浇注件质量的影响以及系统的可行性和先进性。     

浅谈10kV真空断路器的应用

我国于20世纪60年代开始研制真空断路器，70年代正式投入生产。目前我国10kv级真空断路器的额定短路开断电流已达63kA，切电容器组的重击穿率已降至1％以下。随着电力系统的迅猛发展，10kV真空断路器在我国已经大批量地生产和使用。对于一线检修人员来说，提高对真空断路器的认识，加强维护保养，使其安全运行，成了一个迫在眉睫的问题。     

Vector control of induced magnetic anisotropy using an in situ quadrupole electromagnet in ultrahigh vacuum sputtering

We demonstrate the incorporation of a quadrupole electromagnet into an ultrahigh vacuum sputtering system for the vector control of induced magnetic anisotropy in magnetic thin-film heterostructures. A stationary quadrupole electromagnet is used to generate a magnetic field, which rotates synchronously with the physical axes of the substrate in situ during sputtering. An arbitrary anisotropy direction can be set for successive ferromagnetic layers by adjusting the phase difference of substrate and field rotation. The ability to rotate the substrate during deposition and change anisotropy without breaking vacuum enables the deposition of magnetically soft heterostructures with arbitrary in-plane anisotropy axes.     

Vacuum interlock system for molecular beam epitaxy

A vacuum interlock system which permits rapid loading of substrates for molecular beam epitaxy crystal growth is described. Substrates are introduced through a separate, independently pumped, loading chamber while maintaining the main growth chamber under vacuum, thereby minimizing contamination of the evaporation sources and reducing the downtime of the system between successive growth runs. The design permits outgassing of the substrates prior to their insertion in the growth chamber, and has provisions for a later addition of a separate sputtering or chemical etching capability.     

Cryosputtering—a combined freeze-drying and sputtering method for high-resolution electron microscopy

Preparing cellular structures for visualization by high-resolution scanning electron microscopy (SEM) is a multi-step process which includes fixation, dehydration, drying and metal coating. Drying and metal coating are limiting for high-resolution work. Commonly, the dried samples are exposed to the air before they are inserted into a metal coating apparatus, thereby exposing them to moisture and the accompanying risk of rehydration, which may cause changes in the supramolecular structure. We have modified a freeze-dryer to accommodate a magnetron sputtering head, in order to sputter-coat the frozen-dried samples while still in the drying chamber in the cold, a process we call cryosputtering. A layer of 1·5 nm of tungsten was cryosputtered onto whole mounts of cytoskeletons from detergent-extracted human glioma cells or fibroblasts and the specimens were examined by high-resolution SEM and transmission electron microscopy (TEM). To reduce the effects of backstreaming oil from the vacuum system, a turbomolecular pump backed by a two-stage rotary vane pump was connected to the drying-coating chamber. This pump system provides a high vacuum, making it possible to dry the specimens at — 90°C/183 K, thus reducing the risk for recrystallization of water. Furthermore, the high vacuum minimizes the negative effects of contaminants, which can be deposited onto the specimen surface and affect the quality of the metal coat formed during sputtering.     

大型铝环轧机的研制

为改良大型铝合金环件的生产工艺,研制了环轧机.介绍该轧机的设备组成、生产工艺流程及自动化控制系统.此大型铝环轧机的成功研制为改良大型铝合金环件的生产工艺奠定了基础.     

焊缝自动跟踪的发展现状与展望

焊缝自动跟踪在焊接工业中占有极其重要的地位,焊缝自动跟踪的精度和实时性对保证焊接质量有着不可估量的作用。研究如何提高焊缝自动跟踪的精度和降低焊缝自动跟踪系统的成本很有意义。从焊缝跟踪系统的硬件组成和控制方法角度分析了焊缝自动跟踪系统的发展历程,并对该技术的发展趋势进行了分析和展望。     

An application of ESD technology for the R2R printing process

The conductive coating method is used for various industrial fields. For example, the sputtering process is used to coat the ITO layer in LCD or OLED panel manufacturing process and fabricate a base layer of substrate of an electric printing device. However, conventional coating processes (beam sputtering, spin coating etc.) have problems in the industrial manufacturing process. These processes have a very high cost and critical manufacturing environment as a vacuum process. Recently, many researchers have proposed various printing processes instead of conventional coating processes. We propose an ESD printing process in ITO coating layer and apply to fabricate a conductive coating film. Furthermore, the effect of the nozzle and also the applied voltage on different configurations of the nozzle head was also studied for better understanding of the electro static deposition process.     

磁控溅射中频电源仿真研究

磁控溅射中频电源及其辉光放电负载是一个典型的强非线性时变系统，对该系统建模并求其解析解是相当困难的。使用Simulink对磁控溅射中频电源建模，对电源工作时各种工况下输出电流波形进行了研究，研究表明，这种仿真方法对电源系统设计有效，可以推广应用。     

An installation for magnetron deposition of getter coatings in narrow-aperture chambers

An installation for magnetron sputtering of thin-film coatings has been designed to deposit getter films in extended vacuum structures with a complex aperture. A solenoid used in the installation (diameter, 600 mm; length, 6000 mm; and maximum field, 800 G) makes it possible to deposit materials by sputtering onto internal walls in any type of vacuum chambers employed in modern accelerators. Results of deposition of a TiZrV getter coating in narrow-aperture aluminum vacuum chambers that will be mounted in the damping sections of a PETRA III synchrotron radiation source by DESY (Hamburg, Germany) are presented. The atomic composition and the homogeneity of the film along its length have been investigated on a channel for SR-XRF analysis at the Budker Institute of Nuclear Physics.