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31.
Chenxu Liu Shuguang Zhang Ruonan Ji Peng Wang Jin Zhang Yu Tian Yonggang Meng Yedong He 《Ceramics International》2019,45(4):4747-4755
Semiconductor particles doped Al2O3 coatings were prepared by cathode plasma electrolytic deposition in Al(NO3)3 electrolyte dispersed with SiC micro- and nano-particles (average particle sizes of 0.5–1.7?µm and 40?nm respectively). The effects of the concentrations and particle sizes of the SiC on the microstructures and tribological performances of the composite coatings were studied. In comparison with the case of dispersing with SiC microparticles, the dispersion of SiC nanoparticles in the coatings was more uniform. When the concentration of SiC nanoparticles was 5?g/L, the surface roughness of the composite coating was reduced by 63%, compared with that of the unmodified coating. Friction results demonstrated that the addition of 5?g/L SiC nanoparticles reduced the friction coefficient from 0.60 to 0.38 and decreased the wear volume under dry friction. The current density and bath voltage were measured to analyze the effects of SiC particles on the deposition process. The results showed that the SiC particles could alter the electrical behavior of the coatings during the deposition process, weaken the bombardment of the plasma, and improve the structures of the coatings. 相似文献
32.
Scientometrics - In traditional research, the application of quantitative measurement on the value and influence of uncited papers is not feasible owing to the lack of data. The rapid advancement... 相似文献
33.
Loboda P. I. Minitsky A. V. Byba Ye. G. Sysoev M. O. Radchuk S. V. 《Powder Metallurgy and Metal Ceramics》2020,58(11-12):651-656
Powder Metallurgy and Metal Ceramics - The infiltration of aluminum melts into porous metal skeletons produced by powder metallurgy methods, including 3D printing, under a pressure gradient was... 相似文献
34.
As a solid state joining process, ultrasonic spot welding has been proven to be a promising technique for joining copper alloys. However, challenges still remain in employing ultrasonic spot welding to join copper alloys. This article comprehensively reviews the current state of ultrasonic spot welding of copper alloys with a number of critical issues including materials flow, plastic deformation, temperature distribution, vibration, relative motion, vertical displacement, interface friction coefficient, online monitoring technique, coupled with the macrostructure and microstructure, the mechanical properties and electrical conductivity. In addition, the future trends in this field are provided. 相似文献
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