NH_3 Plasma Surface Treatments of Engineering Fluoropolymers: A Way to Enhance Adhesion of Ni or Cu Thin Films Deposited by Electroless Plating

FLUOROPOLYMERS(FPs)are thermoplasticmaterials which exhibit a number of unique chemicaland physical characteristics that no other man-madeplastic product gets together.For example,FPs showvery good resistance to almost all chemicals,excellentwater vapor barrier properties,high thermal stability,outstanding electrical insulation properties(lowdielectric constant and dissipation factors),extremelylow frictional coefficient giving them high auto-lubrication properties,high resistance to rad…     

高耐蚀性和全光亮化学镀Ni-P合金的研究

本文对化学镀Ni-P合金的工艺参数进行研究，确定了最佳工艺条件，采用扫描电镜、电子探针、X射线衍射仪对镀层的成分和组织结构进行分析，得到Ni-P非晶态合金层。试验表明：镀层在15％H2SO4和10％HCI溶液中，具有优良的耐蚀性，其外观有较好的光亮性。     

热处理对1420铝锂合金化学镀镍的影响

对1420铝锂合金进行固溶及固溶后欠时效、峰时效和过时效处理,并对热处理后的试样进行化学镀镍.结果表明,峰时效处理的铝锂合金试样化学镀镍过程容易进行,化学镀镍后在NaCl水溶液中的耐腐蚀性能有所提高.     

Ni-P-SiO2(纳米)化学复合镀研究

通过Ni-P化学镀及Ni-P-SiO2(微米)、Ni-P-SiO2(纳米)化学复合镀探讨纳米SiO2颗粒对镀速及镀层性能的影响。结果表明：添加适量的SiO2纳米粒子于镀液中，使镀速上升，所得镀层硬度、耐磨性等性能相对于Ni-P镀层及微米颗粒复合镀层都有显著地提高。     

铝合金表面处理技术新进展

简要介绍了铝合金表面处理技术的新进展,重点介绍了铝合金的阳极氧化、电镀、化学镀和微弧氧化、激光熔覆等工艺.     

AZ91D镁合金化学复合镀Ni-P-ZrO2的工艺与性能

对镁合金传统化学镀工艺进行了改进,避免了使用氢氟酸和六价铬等有毒物质。采用化学镀与化学复合镀相结合方法,在AZ91D镁合金上获得了Ni-P-ZrO2纳米化学复合镀层,并研究了新工艺化学镀前处理和镍沉积机理及复合镀层的结构和性能。结果表明:新工艺方法获得的Ni-P镀层更均匀、致密,耐蚀性优于传统工艺化学镀层;Ni-P-ZrO2复合镀层与AZ91D合金基体在3.5%NaCl溶液中的动电位极化曲线对比表明,该复合镀层对镁合金可以起到明显的保护作用;从磨损实验结果可见,Ni-P镀层的磨损质量损失率几乎为Ni-P-ZrO2镀层的3倍,说明ZrO2纳米粉的加入能改善镀层的耐磨性。     

化学镀Ni-P合金在氯化物溶液中的化学钝化

本文对化学镀Ni-P合金在3.5%NaCl溶液中的阳极行为进行了研究。运用动电位极化技术和电化学阻抗谱(EIS)技术对活化区和钝化区的测量结果表明:过电位与呈线性关系,但不同电位区,其斜率相差较大。在活化区,界面电容C随过电位的增大而减小,而在钝化区,C维持恒定。对表面膜的XPS分析证实:在活化区形成有磷酸盐膜,保护性差,不能有效地抑制溶解过程;而当表面吸附有H2PO2阴离子时,合金进入化学致钝的钝化区.     

Pre-annealing effect of electroless Ni−B deposit as a diffusion barrier for electroplated Cu electrodes

Ni−B film of 1 μm thickness was electrolessly deposited on an electroplated Cu bus electrode. The film, which encapsulates the Cu bus electrodes, prevents Cu oxidation and serves as a diffusion barrier against Cu contamination of the transparent dielectric layer in a plasma display during the firing process at 580 °C. The microstructure of theas-deposited barrier film was amorphous phase and crystallized to Ni and Ni₃B after annealing at 300 °C. The good barrier properties observed here can be explained by Ni₃B precipitates at the grain boundaries acting as a fast diffusion path via pre-annealing at 300 °C before the firing process at 580 °C.     

化学镀镍磷表面改性Cu-Zn-Al形状记忆合金的腐蚀行为

采用电化学方法研究了Cu-Zn-Al形状记忆合金(SMA)及其化学镀镍磷表面改性试样在Tyrode's人工体液中的腐蚀行为.结果表明，在Tyrode's人工体液中Cu-Zn-Al SMA发生脱锌腐蚀.化学镀镍磷Cu-Zn-Al SMA随NaCl浓度增加、pH值降低、环境温度升高，阳极活性电流密度增大，电化学溶解敏感性增强.X-射线衍射分析结果表明，Cu-Zn-Al SMA表面化学镀镍磷后，形成了非晶态镀层，其在Tyrode's人工体液中的耐蚀性显著提高；这是由于改性表面形成均匀、稳定的阻碍性镀层，有效地将基体金属和外界腐蚀介质隔绝而达到防护作用. 镀镍磷      

Electroless plating of carbon nanotubes and their millimeter-wave absorbing properties

A method of electroless plating was utilized to deposit Cu, Ni, Co, Ag on the surface of carbon nanotubes (CNTs) respectively, in order to prepare millimeter-wave absorbing materials. Field emission scanning electron microscope (FE-SEM) and energy dispersive spectrometer (EDS) were used to observe morphologies and chemical compositions of the samples respectively. Millimeter-wave radiometer imaging detection was employed to measure the absorbing properties of the samples. FE-SEM and EDS results demonstrate the effectiveness of successful metal deposition. The results of millimeter-wave radiometer imaging detection reveal that the millimeter-wave absorbing properties of electroless-silver plating are better than other kinds of samples.