厚膜导体的金属迁移研究

金属迁移能导致混合微电路发生灾难性失效。本文介绍一种简单易行的测试方法－水滴试验法，来测量厚膜电路的实际金属迁移率。用引方法测量时，发现Ｐｄ－Ａｇ导体的迁移率最大，Ｐｔ－Ａｕ导体的金属迁移率最小。     

Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

Low-cycle fatigue (LCF) tests on as-cast Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-3Ag-0.5Cu-1Bi, and Sn-3Ag-0.5Cu-3Bi solders was carried out using a noncontact strain-controlled system at 20°C with a constant frequency of 0.1 Hz. The addition of Cu does not significantly affect the fatigue life of eutectic Sn-Ag solder. However, the fatigue life was significantly reduced with the addition of Bi. The LCF behavior of all solders followed the Coffin-Manson relationship. The fatigue life of the present solders is dominated by the fracture ductility and can be described by the ductility-modified Coffin-Manson’s relationship. Steps at the boundaries of dendrite phases were the initiation sites for microcracks for Sn-3.5Ag, Sn-3Ag-0.5Cu, and Sn-3Ag-0.5Cu-1Bi solders, while for Sn-3Ag-0.5Cu-3Bi solder, cracks initiated along both the dendrite boundaries and subgrain boundaries in the dendrite phases. The linking of these cracks and the propagation of cracks inside the specimen occurred both transgranularly through eutectic phases and intergranularly along dendrite boundaries or subgrain boundaries.     

电双稳薄膜阻抗转变机理研究

采用真空蒸发的方法交替沉积Ag和TCNQ分子制备了Ag TCNQ金属 有机络合物薄膜 ,并研究了多种外加电压激发下膜的电阻转变特性。发现在转变过程中存在着一种能量效应 ,即当外电压超过某一阈值后 ,完成转变的能量不变。对此现象的可能解释是薄膜内分子在一定的外部电场能量诱导下发生重排 ,致使电导率发生跃变     

All Ag Nanoparticles Are Not the Same: Covalent Interactions between Ag Nanoparticles and Nitrile Groups Help Combat Drug- and Ag-Resistant Bacteria

Antimicrobial resistance has long been viewed as a lethal threat to global health. Despite the availability of a wide range of antibacterial medicines all around the world, organisms have evolved a resistance mechanism to these therapies. As a result, a scenario has emerged requiring the development of effective antibacterial drugs/agents. In this article, we exclusively highlight a significant finding reported by Zbořil and associates (Adv. Sci. 2021, 2003090). The authors construct a covalently bounded silver-cyanographene (GCN/Ag) with the antibacterial activity of 30 fold higher than that of free Ag ions or typical Ag nanoparticles (AgNPs). Ascribed to the strong covalent bond between nitrile and Ag, an immense cytocompatibility is shown by the GCN/Ag towards healthy human cells with a minute leaching of Ag ions. Firm interactions between the microbial membrane and the GCN/Ag are confirmed by molecular dynamics simulations, which rule out the dependence of antibacterial activity upon the Ag ions alone. Thus, this study furnishes ample scope to unfold next-generation hybrid antimicrobial drugs to confront infections arising from drug and Ag-resistant bacterial strains.     

室温下ZnO超疏水表面的制备及油水分离性能

利用简便的液相法,在室温下于不锈钢网上沉积ZnO纳米片和纳米花粗糙结构,接着通过浸渍法修饰低表面能物质硬脂酸,制备了超疏水不锈钢网。对沉积后的不锈钢网表面形貌、晶体结构、润湿性能、耐磨性能、油水分离性能等进行表征与测定。结果表明,该不锈钢网表面由纳米片和纳米花组成的微纳米结构ZnO构成,具有超疏水性,水接触角161 °;油水分离效率达98%,循环使用20次后分离效率仍保持在95.5%以上;具有良好的机械耐磨性,在高盐环境中表现出化学稳定性。     

WO3/C/Ag3PO4复合材料光催化降解双酚A

以磷酸法制备的活性炭、WO3、AgNO3、Na2HPO4为原料,采用共沉淀法制备WO3/C/Ag3PO4复合材料。采用X 射线衍射（XRD）、傅里叶红外光谱（FT-IR）、光电子能谱（XPS）、扫描电镜（SEM）、透射电镜（TEM）和固体紫外漫反射（UV-DRS）技术对其进行表征。结果表明,Ag3PO4与WO3之间形成异质结。在可见光照射下,以双酚A(BPA)模拟污染物,评价WO3/C/Ag3PO4复合材料的光催化降解性能,并提出 WO3/ C/Ag3PO4 复合材料对BPA的光降解机理。结果表明,在一系列光催化剂中, 23% WO3/ 7% C/ Ag3PO4 复合材料在可见光下对10 mg/L BPA水溶液的降解率在90 min分钟达到95%,明显高于单一的Ag3PO4和WO3。经过3次循环重复,BPA的降解率仍能保持在74%,表明WO3/C/Ag3PO4光催化剂具有良好的稳定性。光催化机理表明,自由基?O- 2和h 在降解过程中起主要作用。     

STUDY OF INTERFACES AND SURFACES OF YBa_2Cu_3O_(7-x)-Ag

Interfaces and surfaces of YBa_2Cu_3O_(7-x)(YBCO)-Ag have been studied by SEM-EDXand AES.No effect of Ag on 123 structure in X-ray diffraction pattern was observedfor 0.4 mol Ag doped YBCO.AES analysis indicated that Ag segregated on surfaceof YBCO and resulted in decrease of YBCO-metal lead resistance.In addition,solutionand segregation of Ag as elemental state were often appeared on interfaces and surfacesof high temperature annealed YBCO,whether elemental Ag or compound Ag_2O andAgNO_3 adopted as doping material.     

银基氟化镁材料的研究

采用粉末冶金的方法制备了银基氟化镁材料。利用X射线衍射仪、金相显微镜和差热分析仪等对其组织结构进行分析，同时对其硬度、电导率、密度和摩擦系数等进行了测试。结果表明：形成的合金相对密度达98％以上，银与氟化镁能达到原子级别的结合：在银中添加氟化镁，样品的电导率有较大幅度的下降，并且晶粒显著细化，但材料的硬度提高不大，对银和铜的摩擦系数没有明显的降低。因此，氟化镁不能作固体自润滑材料的添加剂。     

半导体硫化银纳米管的制备与光学性能

在以Triton X-100为表面活性剂形成的反相胶束体系中,成功地制备了半导体硫化银纳米管,管径88 nm～120nm、长度大于2.6 μm.X射线衍射测定表明,产物为纯单斜结构.紫外-可见光谱在275 nm处发现新的吸收峰,最大发射波长与体相材料相比,蓝移了38 nm.     

金芯-银壳复合纳米微粒光学吸收光谱分析

通过液相还原法制备出金．银复合纳米颗粒。透射电镜图像显示所制备金-银复合纳米颗粒呈球状的芯-壳结构。光学吸收谱的实验表明：金芯．银壳复合结构纳米微粒具有双峰的等离子体吸收带。一个峰值的波长位于纯银纳米颗粒的等离子体吸收带附近；另一个介于纯银和纯金纳米颗粒的等离子体吸收峰之间，且随着反应试样中银的摩尔分数的增加发生蓝移，基于实验分析和Mie散射理论的定量计算。结果认为：该吸收峰的蓝移可归因于银壳层厚度的增加。