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51.
Evaluation of Slow Crack Growth Resistance in Ceramics for High-Temperature Applications 总被引:1,自引:0,他引:1
The slow (subcritical) crack growth (SCG) resistance of Si3 N4 and SiC ceramics has been evaluated by a stepwise loading test on bending bars precracked by Vickers indentation. Three highly refractory materials were selected for the evaluation: i.e., (1) high-purity Si3 N4 sintered by hot isostatic pressing (HIP) without additives and (2,3) α - and β - SiC pressureless sintered with B and C addition. Under the hypothesis of linear elastic behavior at high temperature, which was found satisfied in the present materials, the SCG resistance was expressed in terms of initial stress intensity factor critical for SCG failure within a predetermined lifetime. The present method was found useful in shortening the testing time and consistent with other traditional fatigue tests (e.g., static-fatigue test): It is recommended as a screening test for materials under research and development. Among the materials tested in the present study, the highest SCG resistance up to 1440°C was found in the high-purity Si3 N4 without additives. 相似文献
52.
Numerical Modeling of Silicon Photodiodes for High-Accuracy Applications Part I. Simulation Programs
Jon Geist Deane Chandler-Horowitz A. M. Robinson C. R. James 《Journal of research of the National Institute of Standards and Technology》1991,96(4):463-469
The suitability of the semiconductor-device modeling program PC-1D for high-accuracy simulation of silicon photodiodes is discussed. A set of user interface programs optimized to support high-accuracy batch-mode operation of PC-1D for modeling the internal quantum efficiency of photodiodes is also described. The optimization includes correction for the dark current under reverse- and forward-bias conditions before calculating the quantum efficiency, and easy access to the highest numerical accuracy available from PC-1D, neither of which is conveniently available with PC-1D’s standard user interface. 相似文献
53.
Crystallization of Polymer-Derived Silicon Carbonitride at 1873 K under Nitrogen Overpressure 总被引:1,自引:0,他引:1
Martin Friess Joachim Bill Jerzy Golczewski re Zimmermann Fritz Aldinger Ralf Riedel Rishi Raj 《Journal of the American Ceramic Society》2002,85(10):2587-2589
The chemical stability of an amorphous silicon carbonitride ceramic, having the composition 0.57SiC·0.43Si3 N4 ·0.49C is studied as a function of nitrogen overpressure at 1873 K. The ceramic suffers a weight loss at p N2 < 3.5 bar (1 bar = 100 kPa), does not show a weight change from 3.5 to 11 bar, and gains weight above 11 bar. The structure of the ceramic changes with pressure: it is crystalline from 1 to 6 bar, amorphous at ∼10 bar, and is crystalline above ∼10 bar. The weight-loss transition, at 3.5 bar, is in excellent agreement with the prediction from thermodynamic analysis when the activities of carbon, SiC, and Si3 N4 are set equal to those of the crystalline forms; this implies that the material crystallizes before decomposition. The amorphous to crystalline transition that occurs at ∼10 bar, and which is accompanied by weight gain, is likely to have taken place by a different mechanism. A nucleation and growth reaction with the atmospheric nitrogen is proposed as the likely mechanism. The supersaturation required to nucleate α-Si3 N4 crystals is calculated to be 30 kJ/mol. 相似文献
54.
The interaction between thin films of hydrogenated amorphous silicon and sputter-deposited chromium has been studied. Following
deposition of the chromium films at room temperature, the films were annealed over a range of times and temperatures below
350°C. It was found that an amorphous silicide was formed only a few nanometers thick with the square of thickness proportional
to the annealing time. The activation energy for the process was 0.55±0.05 eV. The formation process of the silicide was very
reproducible with the value of density derived from the thickness and Cr surface density being close to the value for crystalline
CrSi2 for all films formed at temperatures ≤300°C. The specific resistivity of the amorphous CrSi2 was ≈600 μΩ·cm and independent of annealing temperature. 相似文献
55.
56.
用50W连续波CO_2激光器为热源,诱发SiH_4和C_2H_4反应,合成SiC超细粉末。实验确定了反应腔体内压力p、气源中的C/Si原子比、喷嘴内径2r以及激光功率密度与粉末特性之间的关系,并对合成的产物进行物理、化学表征。 相似文献
57.
58.
Namoi Shibasaki Ryousuke Obika Toshikuni Yonemoto Teiriki Tadaki 《Journal of chemical technology and biotechnology (Oxford, Oxfordshire : 1986)》1995,63(3):201-208
Suspension cultures of tobacco cells were studied using airlift and rotary-drum bioreactors. The effect of initial concentrations of a major substrate, sucrose, on the growth and production of a secondary metabolite, phenolic compounds, was investigated. The dry weights and total concentrations of the phenolic compounds increased with the initial sucrose concentration in both bioreactors. Both bioreactors were found to have the same tendency for the effect of initial sucrose concentration. The structured model, presented previously was modified by considering that sucrose was hydrolyzed to glucose and fructose by an enzymatic reaction. The previous and the new models were applied to the above two sets of experimental data obtained with two bioreactors, independently. The hydrolysis of sucrose was elucidated to contribute slightly to the overall kinetics of growth and secondary metabolite production in these cultures. Furthermore, the levels of shear damage in each bioreactor were quantitatively compared based on the death rate constant, ki, which is one of the model constants. 相似文献
59.
涂层材料的断裂分析(英文) 总被引:1,自引:0,他引:1
和基体厚度相比,涂层很薄,因此细观力学模型可把基体作为半无限弹性体。由于涂层和基体材料的膨胀系数及弹性系数不匹配,涂层材料中残余热应力的解析解为 E_c/(1-γ_c)·(α_s-α_c)△T。用有限元法校核,该应力和解析解吻合得好。通过对涂层产生裂纹驱动力和断裂韧性的讨论,提出了抗裂涂层厚度公式。 相似文献
60.
Shubneesh Batra Nanseng Jeng Akif Sultan Kyle Picone Surya Bhattacharya Keun-Hyung Park Sanjay Banerjee David Kao Monte Manning Chuck Dennison 《Journal of Electronic Materials》1993,22(5):551-554
When dopants are indiffused from a heavily implanted polycrystalline silicon film deposited on a silicon substrate, high thermal
budget annealing can cause the interfacial “native” oxide at the polycrystalline silicon-single crystal silicon interface
to break up into oxide clusters, causing epitaxial realignment of the polycrystalline silicon layer with respect to the silicon
substrate. Anomalous transient enhanced diffusion occurs during epitaxial realignment and this has adverse effects on the
leakage characteristics of the shallow junctions formed in the silicon substrate using this technique. The degradation in
the leakage current is mainly due to increased generation-recombination in the depletion region because of defect injection
from the interface. 相似文献