低温烧结AlN陶瓷基片

通过添加助烧结剂和改进粉体性能，进行ＡｌＮ陶瓷的低温致密化烧结。研究结果表明，添加以Ｄｙ２Ｏ３为主的助烧结剂系统，在１６５０℃下，无压烧结４ｈ，热导率高达１５６Ｗ／（ｍ·Ｋ）；而对ＡｌＮ粉体进行冲击波处理，可以提高粉体的烧结活性，使烧结温度降低２５℃。讨论了低温烧结ＡｌＮ陶瓷基片及低温共烧多层ＡｌＮ陶瓷基片的制备工艺。两步排胶法可以较好地解决金属Ｗ氧化及ＡｌＮ陶瓷颗粒表面吸附残余碳的问题，是制备ＡｌＮ陶瓷与金属Ｗ共烧多层基片的有效排胶方法。     

GaAs／GaAlAs中红外量子阱探测器和双色量子阱红外探测器

本文报道我们在国内率先研制的ＧａＡｓ／ＧａＡｌＡｓ中红外（３～５μｍ）量子阱探测器和双色量子阱红外探测器的制备和性能．ＧａＡｓ／ＧａＡｌＡｓ中红外量子阱探测器是光伏型，探测峰值波长为５．３μｍ，８５Ｋ下的５００Ｋ黑体探测率为３e９ｃｍ·Ｈｚ１／２／Ｗ，峰值探测率达到５×１０１１ｃｍ·Ｈｚ１／２／Ｗ，阻抗为５０ＭΩ．ＧａＡｓ／ＧａＡｌＡｓ双色量子阱红外探测器是偏压控制型的两端器件，在零偏压下该探测器仅在３～５μｍ波段有响应，响应峰值波长为５．３μｍ，８５Ｋ温度下５００Ｋ黑体探测率为３e９ｃｍ     

硅基GaAs／GaAlAs平面光波导的研究

分析了金属有机化合物化学气相淀积（ＭＯＣＶＤ）ＧａＡｓ／ＧａＡｓＡｌ／ＧａＡｓ／Ｓｉ材料结构的性能，用ＭＯＣＶＤ法地硅衬底上生长了ＧａＡｓ／ＧａＡｓＡｌ／ＧａＡｓ材料，并用这种材料制备了平面光波导样品，测定了１．３μｍ，单模激光的传输损耗小于０．６５ｄＢ／ｃｍ。     

溅射条件对Al2O3薄膜介电强度和沉积速率的影响

用射频溅射方法，在不同工作气体（纯Ａｒ和Ａｒ＋１０％Ｏ＿２）和不同基片偏压（－３０Ｖ到－１８０Ｖ，间隔－３０Ｖ）下，由烧结Ａｌ＿２Ｏ＿３靶材制备Ａｌ＿２Ｏ＿３薄膜。测试了样品的介电强度和沉积速率，对部分样品的结构和成份分别用ＸＰＳ和Ｘ射线进行了分析。结果表明：薄膜均呈非晶态；在两种工作气体中，随着基片负偏压的升高，沉积速率和介电强度均下降，但在－６０Ｖ偏压时，介电强度具有最大值。含氧的工作气体导致沉积速率下降，但提高了介电强度。在含氧和－６０Ｖ偏压下，Ａｌ＿２Ｏ＿３薄膜的平均介电强度为３．４６ＭＶ／ｃｍ。纯氩气氛中制备的Ａｌ＿２Ｏ＿３薄膜是缺氧的，而含氧的工作气体可使薄膜中的氧含量提高。     

溅射沉积AlN薄膜结构与基片种类的关系

采用高真空直流磁控反应溅射成功地在５种基片上制备出多晶择优取向的ＡＩＮ薄膜。结果表明,５种基片均可生长（１００）面掺优取向的ＡＩＮ薄膜,并且具有良好的纵向组成均匀性,表面粗造度小,晶粒均匀致密。在金属电极和Ｓｉ片上沉积的ＡＩＮ薄膜结晶度、取向性、衍射强度差别较小,两者的结构均优于在盖玻片上的沉积的ＡＩＮ薄膜。     

光波导用玻璃薄膜的制备及其性能研究

采用磁控射频溅射法制备光波导用玻璃薄膜。本文重点分析了不同溅射条件如氧分压、基片种类、基片温度下制备的薄膜光学性能，通过比较，得到制备０．６３２８μｍ和１．５５μｍ窗口下光波导器件用玻璃薄膜所需溅射条件。     

GaAs／AlGaAs多量子阱红外探测器材料研究

本文报道ＧａＡｓ／ＡｌＧａＡｓ多量子阱长波长红外探测器材料的制备及其性能．这种材料由ＧａＡｓ阱和ＡｌＧａＡｓ势垒组成，除内ｎ型掺杂，具有５０个周期．利用分子束外延技术成功地生长出了大面积（２英寸）均匀（厚度△ｔ＿ｍａｘ／≤３％，组分△　ｘ＿ｍａｘ／ｘ≤３．４％，掺杂浓度△ｎｍａｘ／ｎ≤３％，椭圆缺陷≤３００ｃｍ－２）的外延材料．分析了暗电流的成因，通过加厚势垒（Ｌｂ≥３００）、控制掺杂（ｎ≤１×１０￣１８ｃｍ￣３）、精确设计子带结构，将暗电流降低了几个数量级，同时使电子的输运得到了改善．由此得到了高质量的     

3～5.3μmIn_xGa_(1-x)As/Al_yGa_(1-y)As/Al_zGa_(1-z)As非对称台阶量子阱红外探测器

本文报道我们率先研制出的３～５．３μｍＩｎｘＧａ１－ｘＡｓ／ＡｌｙＧａ１－ｙＡｓ／ＡｌｚＧａ１－ｚＡｓ非对称台阶量子阱红外探测器的制备和性能．该探测器具有光伏特征，７７Ｋ温度、±７Ｖ外偏压下的５００Ｋ黑体探测率达到约１．０×１０１０ｃｍ·Ｈｚ１／２／Ｗ，并且，与１→２子带间跃迁相对应的光电流峰值响应波长可随外偏压在中红外（３～５．３μｍ）波段作适当调谐．运用平面波展开法，依据样品的阱、垒结构参数，计算了ＩｎｘＧａ１－ｘＡｓ／ＡｌｙＧａ１－ｙＡｓ／ＡｌｚＧａ１－ｚＡｓ非对称台阶量子阱１→２子带间跃迁的Ｓｔａ     

掺杂聚合物蓝绿发光二极管

本文报道了用有机染料８－羟基喹啉铝（Ａｌｑ３分散到聚乙烯基咔唑（ＰＶＫ）中的掺杂聚合物作为有源层制作的蓝绿发光二极管（ＬＥＤ），聚合物发光层用旋转涂敷的方法制备．ＩＴＯ／Ａｌｑ３：ＰＶＫ／Ａｌ器件在正向偏压为６Ｖ时可以看到蓝绿发光，峰值波长为５１０ｎｍ，最大亮度为１６８ｃｄ／ｍ２．     

1.3μm低阈值InGaAsP/InP应变补偿MQW激光器的LP-MOCVD生长

报道了用低压金属有机物化学气相淀积（ＬＰ－ＭＯＣＶＤ）方法外延生长ＩｎＧａＡｓＰ／ＩｎＰ应变补偿多量子阱结构。用此材料制备的掩埋异质结（ＢＨ）条形结构多量子阱激光器具有极低阈值电流４～６ｍＡ。２０～４０℃时特征温度Ｔ０高达６７Ｋ，室温下外量子效率为０．３ｍＷ／ｍＡ。     

AlN多层基板的研制

MCM技术推动了现代微电子技术迅猛发展,已广泛应用于各种通讯系统的收发组件之中。AIN基板作为MCM技术多层基板主流之一,由于其高热导率、与硅片匹配的热膨胀系数、高介电常数、兼容各种芯片组装工艺的优点,在各个领域均获得了广泛的应用。文章结合一个微波组件AIN基板的研制,阐述了在AIN基板研制过程中解决的工艺难点,如粉料配制、流延、层压、烧结等,对研制的AIN基板进行了物理性能与电性能测试,结果表明AIN基板完全可以满足大功率毫米波／微波组件的实用化要求。     

高性能氮化铝陶瓷基片生产关键技术研究

文章主要介绍氮化铝陶瓷基片生产的关键技术。重点研究了原材料控制、氮化铝基片配方、成型工艺、烧结技术、磨抛技术等五个方面的因素对氮化铝陶瓷基片生产的影响以及解决措施。通过研究发现添加3%左右的Y2O3作为烧结助剂,同时采用低温段缓慢升温的方法可以极大地提高氮化铝陶瓷基片的烧成质量。我们的研究,优化了生产工艺,提高了氮化铝陶瓷基片的质量和生产的成品率。     

氮化铝陶瓷直接覆铜技术

研制出一种直接覆铜ＡｌＮ基板。先将ＡｌＮ 陶瓷基板作表面氧化处理, 然后在１ ０６３～１ ０７０℃下, 氮气氛中煅烧, 使铜箔直接焊敷在ＡｌＮ基板上。铜箔的剥离强度可达到８５３．２ Ｐａ, 厚度为０．１～０．５ ｍ ｍ , 最大基板面积可达５０ ｍ ｍ ×５０ ｍ ｍ     

Morphology and crystalline property of an AIN single crystal grown on AIN seed

AIN single crystal grown by physical vapor transport (PVT) using homogeneous seed is considered as the most promising approach to obtain high-quality AIN boule.In this work,the morphology of AIN single crystals grown under different modes (3D islands and single spiral center) were investigated.It is proved that,within an optimized thermal distribution chamber system,the surface temperature of AIN seed plays an important role in crystal growth,revealing a direct relationship between growth mode and growth condition.Notably,a high-quality AIN crystal,with (002) and (102) reflection peaks of 65 and 36 arcsec at full width at half maximum (FWHM),was obtained grown under a single spiral center mode.And on which,a high-quality AlxGa1-xN epitaxial layer with high Al content (x =0.54) was also obtained.The FWHMs of (002) and (102) reflection of AlxGa1-xN were 202 and 496 arcsec,respectively,which shows superiority over their counterpart grown on SiC or a sapphire substrate.     

Perspectives on the AIN architecture

The advanced intelligent network (AIN) is examined in terms of its history, present day architecture, and future evolution. The history of the AIN is traced from predivestiture 800 and calling card service capabilities, through IN/1, IN/2, and IN/1+, leading to the various AIN releases. The present-day view of the AIN architecture includes the switching system and other network systems, as well as operations. The AIN functionality supported by this architecture is described from a customer point of view, by means of an illustrative service that could be provided from an AIN platform. The next steps in the AIN evolution are discussed. An appendix that provides detailed information about the AIN Release 1 call model is included     

AlN基片的薄膜金属化

讨论了ＡｌＮ基片的薄膜金属化。通过试验,确定了有效的清洗方法及优化溅射参数。实验证明,ＴｉＷ－Ａｕ 是ＡｌＮ的优良金属化体系。ＡｌＮ材料经激光划片后出现导电物质, 经稀盐酸处理可去掉导电物质     

Operations issues for advanced intelligent networks

An overview of a specific form of advanced intelligent network (AIN), rapid service delivery (RSD), is presented. RSD is the adjunct-based AIN architecture scheduled for regional deployment in the United States in 1993. The accounting management, fault management, data collection, network traffic management, and configuration management operations of AIN/RSD are outlined. AIN deployment and operations issues are discussed     

The intelligent network and forward-looking technology

The authors discuss the Advanced Intelligent Network (AIN), an architecture that includes both IN/1+ and IN/2 and will be introduced in phases, with releases envisioned at two-year intervals. Phase 1 requirements will be released in 1989 and first applications are targeted for deployment in 1991/2. They examine some future technologies and their impact on the AIN. They describe an AIN system architecture that can respond to change, concentrating on the effect of switching-system evolution to narrowband and broadband ISDN     

GaN/AIN multiple quantum wells grown on GaN-AIN waveguide structure by metalorganic vapor-phase epitaxy

High-optical-confinement waveguide structure based on nitride semiconductors is proposed and demonstrated for the first time with metal organic vaporphase epitaxy. The waveguide structure composed of 1-μm-thick AIN cladding layer, 2-μm-thick GaN guiding layer, and 40 periods of GaN/AIN multiple quantum wells (MQWs) was grown using optimized growth conditions for each layer. For improved material quality, the two-step growth technique using low-temperature AIN and GaN nucleation layers was utilized to reduce the stress induced by lattice mismatch between each layer. The high-optical-confinement structure could therefore be grown with high quality, leading to a successful observation of inter-sub-band absorption in GaN/AIN MQWs. The inter-sub-band absorption wavelength observed in such structure is in good agreement with that of MQWs grown on GaN layer, showing that the proposed waveguide structure can be used as a standard structure for optical devices based on inter-sub-band absorption.     

AlN陶瓷的应用及其表面金属化

ＡｌＮ陶瓷由于其优良的导热性能，良好的高频性能及与ＢｅＯ相比无毒性，是一种很有潜力的微波功率器件用材料。ＡｌＮ陶瓷的许多应用都涉及到了陶瓷表面金属化技术及与金属接合技术，本文对ＡｌＮ陶瓷的应用、ＡｌＮ陶瓷表面金属化及其与金属接合技术的现状及发展进行了评述。