硬脂酸改性三氧化二铝表面润湿性的特性分析

目的 研究氧化铝经硬脂酸分子改性后的润湿行为,从表面改性角度探索聚合物自组装润湿性原理,进而制备出一种疏水性能良好的超疏水表面。方法 使用COMPASS力场进行分子动力学模拟,构建基于非键合粒子的Al2O3超晶胞模型体系,采用最速下降法和共轭梯度法进行优化,使所构建的模型在体系平衡下保持能量最小原则,并对其求解分析。进而基于模拟材料,通过两步喷涂法制备以改性纳米氧化铝为涂层的超疏水表面,观察表征特征,验证模型的正确性。最后从模拟构象、径向分布函数以及均方根位移方面分析氧化铝经硬脂酸分子改性前后水分子团簇在玻璃、氧化铝表面的微观润湿行为。结果 经硬脂酸改性后,氧化铝表面由亲水表面成为疏水表面。经分子动力学模拟表明,当硬脂酸浓度增加,每个硬脂酸的表面能由–110.5 kJ/mol变为–80.4 kJ/mol,硬脂酸分子降低了水分子团簇在玻璃和氧化铝表面的扩散系数,对疏水性的强弱有着重要的影响。结论 氧化铝颗粒与玻璃表面都具有强亲水性,且氧化铝对水分子的吸附能力要强于玻璃。硬脂酸能够降低氧化铝的表面能,且与纳米氧化铝发生化学反应后,将氧化铝由超亲水改性为超疏水。     

BN对AlN耐火材料烧结性能及抗钛熔体侵蚀性能的影响

以新型耐火材料AlN为基体,添加不同含量的高活性h-BN及烧结助剂Y2O3,在1850 ℃保温4 h下无压烧结制备出无氧、易加工的AlN/BN耐火复合陶瓷,分析了该复合陶瓷的显微组织,研究了其与TiAl熔体的界面润湿规律及界面反应。结果表明,BN颗粒的加入可以有效填充AlN颗粒间隙,促进复合陶瓷的烧结致密化,当添加5 wt% BN颗粒时,复合陶瓷致密度达到最高,为89.24%。复合陶瓷的组织由AlN、BN及钇铝酸盐Y4Al2O9组成,其中Y4Al2O9主要分布在AlN颗粒界面处。BN颗粒可以降低复合陶瓷与TiAl熔体的界面润湿性,其中含5 wt% BN的复合陶瓷与TiAl熔体的界面润湿角约为136°,表明二者润湿较差,复合陶瓷表现出良好的化学惰性。界面反应实验发现复合陶瓷具有良好的抗TiAl熔体侵蚀性能,其与TiAl熔体的界面平整清晰,界面层厚度为9.5 μm,未发生明显元素扩散,表明了AlN/BN复合陶瓷是一种极具潜力的钛合金熔炼用耐火材料。     

TiZrNiCu/Ti60润湿性及与TiBw-TC4钎焊研究

本文采用座滴法在真空下系统研究了硼含量对TiZrNiCu/Ti60润湿性的影响,且在940°C保温10分钟条件下实现了与的钎焊。通过SEM、XRD以及剪切实验研究了界面显微组织及剪切力学性能。添加B元素可以与Ti原位合成TiBw,从而细化界面的显微组织。当B含量为0.3 wt %时,TiBw-TC4 /TiZrNiCu-B/Ti60接头的最大剪切强度为177 MPa,比无B含量的接头强度高65%。然而,过量的B含量使TiZrNiCu-B在Ti60合金基体上产生大量的TiBw,导致润湿性恶化,在钎焊接头形成微孔和未焊合区域,从而使剪切强度下降。     

电场对竖直微槽润湿及毛细流动特性影响

竖直微槽群毛细结构广泛应用在重力热管、蒸发器等散热设备内,但受重力等因素影响易达到毛细极限。引入电场的主动强化方式来提高竖直微槽的毛细极限,并通过实验和建立数学模型研究电场对竖直微槽内液体润湿及毛细流动特性的影响。结果表明,电场可以提高竖直微槽内液体润湿高度,当电场为5.0 kV时与无电场时相比,润湿高度强化比可达到30.0%。同时,电场作用下流体在微槽道内的毛细润湿流动呈分段效应：润湿流动初期,润湿高度与时间的1/2次方呈线性关系,即h-t^1/2,润湿速率与润湿高度的倒数呈线性关系,即v-1/h;润湿流动中后期,润湿高度与时间的1/3次方呈线性关系,即h-t^1/3,润湿速率与润湿高度平方的倒数呈线性关系,即v-1/h²,且润湿速率随时间呈下降趋势。     

冶金用耐火材料与铁水相际间运动的电现象

钢铁冶炼过程中,耐火材料与钢液(铁水)界面间存在的电场将影响两相间的润湿、溶解以及化学反应等界面作用。为明确钢液(铁水)与耐火材料间因相对运动所引起的摩擦起电行为,进行低温流体流动带电试验和热态模拟试验。由低温流体流动带电试验可知,随着搅拌速度的增加,流体与石墨容器因摩擦起电所产生的静电电压逐渐增大;不同种类的流体因其密度、黏度以及流体内部含有的杂质、离子数量不同,流动所产生的静电大小差别明显。由热态模拟试验可知,流动的铁水与耐火材料会产生摩擦起电,且随铁水流动速度的增加,由此产生的静电增大;不同种类的耐材与流动的铁水产生的静电大小各异,与其自身理化性质有关。     

Raft crystals of poly(isoprene)-block-poly(ferrocenyldimethylsilane) and their surface wetting behavior during melting as observed by AFM and NanoTA

We report on the morphology evolution during heating and melting of lamellar poly(isoprene)-block-poly(ferrocenyldimethylsilane) (PI₇₆-b-PFDMS₇₆) raft crystals deposited at the native oxide surface of silicon (SiO₂) or at a highly ordered pyrolytic graphite (HOPG) surface, studied by in situ temperature controlled atomic force microscopy. Crystals deposited on hydrophilic SiO₂ surfaces revealed an irreversible decrease in length at temperatures of up to tens of degrees above their expected melting temperature, while maintaining their platelet-like structure. Crystals deposited on hydrophobic HOPG surfaces initially decreased in length below their expected melting temperature, while at 120 °C and above a typical molten morphology was observed. In addition, the irreversible formation of a PI₇₆-b-PFDMS₇₆ wetting layer around the crystals was observed upon increasing the temperature. These observations in the morphological behavior upon heating emphasize the role of interfacial energy between a surface deposited block copolymer based macromolecular nanostructure and its supporting substrate.     

Initial rapid wetting in metallic systems

The initial rapid wetting of a solid surface by a liquid phase is an important step in many industrial processes. Liquid-phase sintering of powder metallurgical steels is one such industrial process, where metallic powders of micrometer size are used. Investigating the dynamic wetting of a high-temperature metallic drop of micrometer size experimentally is very challenging. Here, a phase-field-based numerical model is first implemented and verified by accurately capturing the initial dynamic wetting of millimeter-sized metal drops and then the model is extended to predict the dynamic wetting of a micrometer-sized metal drop. We found, in accordance with recent observations, that contact line friction is required for accurate simulation of dynamic wetting. Our results predict the wetting time for a micrometer-sized metal drop and also indicate that the dynamic wetting patterns at the micro- and millimeter length scales are qualitatively similar. We also found that the wetting process is much faster for a micrometer-sized metal drop compared to a millimeter-sized metal drop.     

Study of wetting reaction between eutectic AuSn and Au foil

Wetting reactions between eutectic AuSn solder and Au foil have been studied. During the reflow process, Au foil dissolution occurred at the interface of AuSn/Au, which increases with temperature and time. The activation energy for Au dissolution in molten AuSn solder is determined to be 41.7 kJ/mol. Au₅Sn is the dominant interfacial compound phase formed at the interface. The activation energy for the growth of interfacial Au₅Sn phase layer is obtained to be 54.3 kJ/mol over the temperature range 360–440°C. The best wettability of molten AuSn solder balls on Au foils occurred at 390°C (wetting angle is about 25°). Above 390°C, the higher solder oxidation rate retarded the wetting of the molten AuSn solder.