Highly ordered microstructures of poly(styrene-b-isoprene) block copolymers induced by solution meniscus

Microstructures of hundreds of micron thick poly(styrene-block-isoprene) copolymer films solution-cast in a cylindrical tube with the solvent evaporation controlled were investigated by transmission electron microscope (TEM), small angle X-ray scattering (SAXS) and optical microscope (OM). In a block copolymer with cylindrical polyisoprene microdomains, the orientation of the cylinders was varied along radial direction of the cylindrical tube. Highly aligned hexagonal arrays of in-plane polyisoprene cylinders were formed with their cylindrical axis parallel to the circumference of the tube in the regimes close to the wall edge. In contrast randomly ordered microdomains were observed at the center of the tube. We have also found that the orientation depends on the solvent evaporation rate and an intermediate rate (∼2.3 nL/s) provides the best orientation. In the case of a block copolymer with a bicontinuous double gyroid structure, we obtained a globally ordered microstructure where [111] crystallographic direction was parallel to the circumference of the tube. For both block copolymers, the area of highly ordered arrays of nanoscopic domains is over 1 mm². Development of the orientation was explained by coupling two orthogonal fields: (1) The flow of a solution induced by strong capillary force at a meniscus between the cylindrical tube wall and the block copolymer solution and (2) the solvent evaporation.     

Effect of type of processing on the microstructural features and mechanical properties of Al-Cu/SiC metal matrix composites

In this study, an aluminum based metallic matrix (Al-2wt.% Cu) was reinforced with SiC particulates using a conventional casting technique and a new disintegrated melt deposition technique. Microstructural characterization studies conducted on the samples taken from disintegrated melt deposition technique revealed a more uniform distribution of SiC particulates and good interfacial integrity between SiC particulates and metallic matrix when compared to the conventionally cast composite samples. Results of ambient temperature mechanical tests demonstrate an increase in 0.2% YS and ultimate tensile strength of samples taken from disintegrated melt deposition technique when compared with the unreinforced and conventionally cast composite samples. The results of microstructural characterization and mechanical testing were finally rationalized in terms of the nature of processing technique employed to reinforce Al-2wt.% Cu metallic matrix with SiC particulates.     

溅射——气体——聚集共沉积法制备金属／金属（介质）复合团簇镶嵌薄膜

提出了溅射－气体－聚集共沉积制备金属／金属（介质）复合团簇镶嵌薄膜的新方法，并利用该方法成功地在方华膜衬底上制备了系列Ｆｅ／Ａｇ及ＣａＦ２复合团簇镶嵌薄膜样品。透射电镜分析结果表明，样品中Ｆｅ（Ｃｕ）团簇都较好地镶嵌于Ａｇ（ＣａＦ２）基质中，其结构为两种材料的多晶共存形态。进一步分析发现，与块材相比，Ｆｅ／Ａｇ样品中Ｆｅ团簇晶格常数呈现出不同程度的收缩，而Ｃｕ／ＣａＦ２样品中Ｃｕ团簇晶格常数则呈现出不同程度的膨胀。运用附加压力的模型对该现象进行了解释。     

聚乙烯包装薄膜形变性能与微观结构的研究

采用拉伸实验，研究形变速率对聚乙烯包装薄膜力学性能的影响。采用Ｘ射线衍射方法，分析聚乙烯薄膜形变后微观结构的变化，得到了形变后材料内部的微晶尺寸和点阵畸变值。     

Cr12钢的预处理工艺研究

本文研究了Ｃｒ１２钢经４种不同的预处理工艺处理后钢中碳化物的大小，数量，分布及钢的硬度，强度和韧性，试验结果表明，经调质处理，高温固溶淬火＋高温退火处理后，Ｃｒ１２钢中碳化物的大小，分布及其组织，性能均优于常规球化退火预处理的。通过扫描电镜对冲击断口的分析，初步探讨了新的预处理工艺提高韧性的原因。     

搅拌工艺对半固态Y112铝合金组织及性能的影响

采用自行研制的机械搅拌装置,研究了不同工艺参数对半固态Y112铝合金组织及性能的影响.研究表明,搅拌温度越高,搅拌速度越大,固相颗粒越细小、均匀和圆整,其抗拉强度与伸长率越高;但温度太高,固相颗粒会熔化,抗拉强度及伸长率也降低;随搅拌时间的延长,固相颗粒先变得细小、均匀和圆整,然后长大,抗拉强度、伸长率先升高后降低.     

Structure and dynamics of dipolar fluids under strong shear

Molecular dynamical simulation has been carried out to investigate the structure and dynamics of a dipolar fluid under strong shear. Dipolar fluid consists of polarizable particles, which have an induced dipole moment in the applied field direction. Shear stress is perpendicular to the field direction. When shear stress is small, the flow has a flowing-chain structure. If shear stress increases to pass a critical value, flowing-chain structure changes to flowing layer structure. Each layer is parallel to the flow direction and shear direction. Within one layer, particles form strings in the flow direction.     

LASER ENHANCED ELECTROCHEMICAL MACHINING PROCESS

An experimental apparatus was designed and built for the hybrid process of laser enhanced electrochemical machining (ECM). Comparison experiments had been done between solely ECM and laser enhanced ECM. The machining performance of hybrid process was investigated and compared with solely ECM. The principle of the hybrid process was exposed by analyzing the microstructure of machining surface. The results show that the hybrid process has advantages in machining accuracy, surface quality, and machining efficiency.     

Isothermal Gas Forming of Mg Alloy AZ31 Sheet

There have been reports on sheet forming of Mg alloy in industry via the punch and die method;this paper is probably the first formal one for studying the sheet formability of AZ31 employing pressurized gas to press the sheet into a female die cavity at various elevated temperatures.The results indicate it is feasible to form a rectangular box via pressurized gas from extruded sheets of 0.5 and 1.7 mm thick.The formed box has 1:2 depth over width ratio,which should be large enough when dealing with realistic industrial sheet forming parts.Presently,forming a sheet of 0.5 mm thick is considered a technical challenge by industry,and it is conquered as demonstrated in this paper.Gas forming technique applied to Mg alloy is unprecedented and shows potential for industrial utilization.     

Preparation of ultra-fine copper powder and its lead-free conductive thick film

In this paper, non-agglomerated monodispersed ultra-fine copper metallic powders have been synthesized with chemical reduction method. Fine lead-free glass powders were also prepared by solid synthesis process. Thick film paste prepared by above-mentioned copper metallic powders and lead-free glass powders was applied as conductive paste of MLCC. Mixture of glass and zinc oxide give the thick film a high adhesion strength which is attributed to the rough interface from interfacial reaction between glass and chip, and a good densification. Diffusion of metal between copper thick film and nickel thick film is clear. Ni-Cu solid solution appears under high temperature firing.