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101.
102.
随着发展的需要,高速数字电路PCB板上信号速度越来越快,由于差分信号有较强的抗干扰能力,因此用的得越来越普遍。但是,随着上升时间的进一步减小,差分信号的信号完整性问题也变得越来越重要。由于双绞的结构在一定程度上使得干扰相互抵消,从而提高系统对串扰和辐射发射的抵抗能力,因此,近两年来有一种新的双绞差分传输线被引入到布线中。本文从理论上分析了双绞差分线结构减小串扰和辐射发射的机理,并且通过建模仿真验证了其正确性. 相似文献
103.
数字电路集成度的提高特别是近年来系统芯片的出现,信号线之间的间距不断缩小,使得信号线间容易发生串扰.文章首先对串扰故障模型,特别是信号线间容性和感性耦合所产生的串扰及其特征进行了讨论,其次针对数字电路中串扰故障的检测,研究了基于路径敏化的测试矢量生成方法,给出了方法的实现步骤. 相似文献
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105.
Metal wires and through silicon vias (TSVs) are frequently performance bottlenecks of 3D ICs due to their high capacitive crosstalk which can be reduced using coding techniques. In this work we show that existing TSV crosstalk avoidance codes (CACs) are impractical for real applications due to the edge effects in TSV bundles. Additionally, these 3D CACs do not reduce the metal wire crosstalk and dramatically increase the power consumption of 2D and 3D interconnects. This work presents a 3D CAC which overcomes previous limitations. The method is based on an intelligent fixed mapping of the bits of existing 2D CACs onto rectangular or hexagonal TSV arrangements. Simulation results, obtained by circuit simulations in combination with an electromagnetic field solver, show that existing 3D CACs only reduce the TSV crosstalk by a maximum of 9.4%, provide no optimization of the metal wire crosstalk and induce an increase in the interconnect power consumption by about 50%. In contrast, the presented technique requires less hardware and reduces the maximum crosstalk of modern TSV and metal wire buses by 37.8% and 47.6%, respectively, while leaving their power consumption almost unaffected. Alternatively, our technique can reduce the TSV and metal wire crosstalk peaks by 20.3% and 47.7%, respectively, while additionally providing a reduction in the TSV and metal wire power consumption by 5.3% and 21.9%, respectively. 相似文献
106.
Commercial designs are currently integrating from 10 to 100 embedded processors in a single system on chip (SoC) and the number is likely to increase significantly in the near future. With this ever increasing degree of integration, design of communication architectures for large, multi-core SoCs is a challenge. Traditional bus-based systems will no longer be able to meet the clock cycle requirements of these big SoCs. Instead, the communication requirements of these large multi processor SoCs (MP-SoCs) are convened by the emerging network-on-chip (NoC) paradigm. Crosstalk between adjacent wires is an important signal integrity issue in NoC communication fabrics and it can cause timing violations and extra energy dissipation. Crosstalk avoidance codes (CACs) can be used to improve the signal integrity by reducing the effective coupling capacitance, lowering the energy dissipation of wire segments. As NoCs are built on packet-switching, it is advantageous to modify data packets by including coded bits to protect against the negative effects of crosstalk. By incorporating crosstalk avoidance coding in NoC data streams and organizing the CAC-encoded data packets in an efficient manner, so that total number of encoding/decoding operations can be reduced over the communication channel, we are able to achieve lower communication energy, which in turn will help to decrease the overall energy dissipation. 相似文献
107.
基于信息最大化(Informax)的独立分量分析(independent component analysis-ICA)盲源分离(blind source separation-BSS)算法中,采用现有的非线性转换函数,算法的收敛速度慢、串扰大,分离结果不确定。针对这些不足,本文设计了新的分离函数、推导出新的分离矩阵,并进行了仿真,实验结果验证了:采用新算法可使BSS速度加快、分离后语音信号串扰减小,并在一定程度上解决了BSS排序不确定的问题。 相似文献
108.
深亚微米片上总线的功耗、布线面积约束和线间串扰是限制总线数据吞吐率的关键因素,为此该文提出一种自适应时空编码方法以降低总线的串扰延迟和功耗。该方法首先采用空间编码将总线分割为两个子总线,从而减小了恶性串扰发生几率;然后通过恶性串扰判决器分别判断子总线的原码数据及反码数据是否存在恶性串扰:对于任意子总线的原码数据与反码数据均存在恶性串扰的情况,传送屏蔽字;否则,选取无恶性串扰且动态功耗小的总线数据形式并传送。采用SPEC标准数据源对算法进行了评估,该方法在消除恶性串扰的同时使总线数据吞吐率提高了62.59%~81.62%,功耗比同类方法降低14.63%~54.67%,对于32位数据总线,仅需7根冗余线,在动态功耗、布线资源和性能方面获得了有效的优化。 相似文献
109.
110.
Analysis of crosstalk in HgCdTe p-on-n heterojunction photovoltaic infrared sensing arrays 总被引:1,自引:0,他引:1
C. A. Musca J. M. Dell L. Faraone J. Bajaj T. Pepper K. Spariosu J. Blackwell C. Bruce 《Journal of Electronic Materials》1999,28(6):617-623
In this paper, an experimental and theoretical study is carried out of crosstalk between nearest-neighbor devices within a
backside-illuminated linear HgCdTe photovoltaic infrared sensing array. The dominant form of crosstalk that occurs in high
performance photovoltaic arrays is associated with photogenerated minority carriers that diffuse laterally between adjacent
devices within the array. To measure crosstalk, a scanning laser microscope is used to obtain a spatial map of spot-scan photoresponse
at a temperature of 80K for individual p-on-n photovoltaic devices within the linear array. These experimental results are
compared to calculations performed on a commercial two-dimensional device simulation package. The crosstalk measurements and
calculations presented in this paper include results on mid-wavelength infrared planar device structures, as well as long-wavelength
infrared mesa-isolated devices, which give measured crosstalk values of 6.2 and 8.3%, respectively. The results indicate that
the device simulations are in good agreement with experimental results. Further simulations are carried out to determine the
sensitivity of crosstalk to various material and device parameters such as epitaxial layer thickness (7 to 25 μm), illumination
wavelength (1.047 to 11.0 μm), minority carrier diffusion length (8 to 90 μm), and diode pitch. It is found that the dominant
feature influencing the value of crosstalk is the distance between the region of photogeneration and the collecting p-n junction. 相似文献