半导体ZnTe/GaAs界面层错的高分辨显微分析

本项研究对经热壁外延（ＨＷＥ）生长在ＧａＡｓ基底上的ＺｎＴｅ进行分高分辨显微结构的观察，在ＺｎＴｅ／ＧａＡｓ界面上不仅存在着混合型全位错的扩展，而且首次发现类似螺旋位错分解的层错，并将其归结为原子在不全位错之后的堆积。     

硅中硼离子注入校准样品的研制

本文主要介绍了硅中硼离子注入校准样品的制备与研究。分别用三台SIMS仪器对样品进行了深度剖析与比对,并对用作校准目的的样品主要参数进行了定值。     

Formation of titanium and cobalt germanides on Si (100) using rapid thermal processing

Titanium and cobalt germanides have been formed on Si (100) substrates using rapid thermal processing. Germanium was deposited by rapid thermal chemical vapor deposition prior to metal evaporation. Solid phase reactions were then performed using rapid thermal annealing in either Ar or N₂ ambients. Germanide formation has been found to occur in a manner similar to the formation of corresponding silicides. The sheet resistance was found to be dependent on annealing ambient (Ar or N₂) for titanium germanide formation, but not for cobalt germanide formation. The resistivities of titanium and cobalt germanides were found to be 20 μΩ-cm and 35.3μΩ-cm, corresponding to TiGe₂ and Co₂Ge, respectively. During solid phase reactions of Ti with Ge, we have found that the Ti₆Ge₅ phase forms prior to TiGe₂. The TiGe₂ phase was found to form approximately at 800° C. Cobalt germanide formation was found to occur at relatively low temperatures (425° C); however, the stability of the material is poor at elevated temperatures.     

Microstructure of Silicon Carbide Whiskers Synthesized by Carbothermal Reduction of Silicon Nitride

The microstructure of silicon carbide whiskers synthesized by carbothermal reduction of silicon nitride has been studied using transmission electron microscopy. All of the whiskers examined are single crystals, and grow in the (111) crystallographic direction. Two different forms of stacking faults and microtwins were observed; in one the planar defects are normal to the whisker growth direction, and the other has the defect planes at an angle of about 70° to the growth axis, while both forms of the defects are on the [111] closed-packed planes. Without the addition of catalyst, droplets containing metallic impurities were not found at the tips of the whiskers synthesized by the present process. A core and outer regions were observed in the single-crystal whiskers, which may be evidence that the whiskers were formed by a two-stage mechanism.     

一种硅衬底镂空结构的圆形射频微电感

利用MEMS工艺以及硅的湿法刻蚀工艺制作了一种硅衬底镂空结构的圆形射频微电感，并研究了硅衬底背面减薄对射频微电感性能的影响，结果表明：微电感硅衬底经过局部刻蚀减薄后其自谐振频率上升，电感量的频率稳定性提高，而其最大Q值下降。     

醋酸甲酯在Cs_(1.5)PW/SiO_2催化剂上的水解反应

通过改变阳离子的种类与配比,制备了一系列SiO2负载的磷钨酸盐催化剂,考察了制备方法对催化剂性能的影响,采用傅里叶变换红外光谱、X射线衍射、X射线荧光光谱、环境扫描电子显微镜等方法对催化剂进行了表征,并考察了该系列催化剂对醋酸甲酯水解反应的活性。实验结果表明,Cs1.5PW/SiO2催化剂的活性最好,当Cs1.5PW负载量(质量分数)为30%时,Cs1.5PW的Keggin结构保持完好,没有硅钨酸阴离子形成,Cs1.5PW在SiO2载体上高度分散;在反应温度55℃、反应时间2h的条件下,醋酸甲酯的转化率为35.79%,约为均相磷钨酸催化剂的1.3倍。该催化剂重复使用4次后,醋酸甲酯的转化率稳定在25%;80℃下反应2h,与NKC-9磺酸树脂催化剂相比,醋酸甲酯的转化率提高了5.17%。     

大型预焙铝电解槽使用碳化硅砖与普通碳砖复合块的探讨

碳化硅砖和碳化硅砖与普通碳砖复合侧块，在上世纪末期我国铝电解槽上开始推广应用。使用后各厂家普遍发现碳化硅砖及碳化硅砖与普通碳块复合侧块均出现不同程度的断裂、上抬和脱落现象，该文对断裂、上抬和脱落原因进行了分析，并提出了改进措施。     

Oxidation behavior of silicide coating on Ti3SiC2-based ceramic

A silicide coating was prepared on Ti₃SiC₂-based ceramic by pack cementation to improve the oxidation resistance of Ti₃SiC₂, which is a technologically important material for high temperature applications. The microstructure, phase composition and oxidation resistance of the coated sample were investigated. The results demonstrated that the silicide coating was mainly composed of TiSi₂ and SiC. A single layer of a mixture of SiO₂ and TiO₂ was formed on the surface of the coated sample during isothermal oxidation at 1100 °C and 1200 °C for 20h. Compared to Ti₃SiC₂, the parabolic rate constant of silicide coated Ti₃SiC₂ decreased by 2~3 orders of magnitude. Furthermore, the coated sample showed much better cyclic oxidation resistance than Ti₃SiC₂ during the cyclic oxidation at 1100 °C for 400 times. However, during the preparation of the coating, a number of fine cracks formed in the outer layer of the coating. When these cracks penetrated the whole coating during the cyclic oxidation, the oxidation rate was accelerated, which degraded the oxidation resistance. Electronic Publication     

等离子体氧化nc-Si/SiO_2多层膜的蓝光发射

报道了在等离子体增强化学气相沉积 (PECVD)系统中用交替淀积 a-Si对其进行原位等离子体氧化的方法制备了 a-Si∶H/ Si O2 多层膜。随着 a-Si∶H子层的厚度从 3 .8nm减小到 1 .5 nm,a-Si∶H/ Si O2 多层膜的光吸收边和光致发光 (PL )出现了蓝移。在晶化的 a-Si∶ H/ Si O2 多层膜中不仅观察到室温下的红光带 (80 0nm)的发光峰 ,而且还观察到蓝光发射 (4 2 5 nm) ,结合 Raman,TEM和 PL测试 ,对其原因作了简单的分析     

高压热处理对氧沉淀低温形核的影响

研究了外加高压(1GPa)下对450℃热处理硅片中氧沉淀行为的影响.透射电镜观察表明相对于大气压下热处理的样品,高压处理的样品会产生密度更高、尺寸更小的氧沉淀,表明高压有利于小直径氧沉淀的生成.电学性能测试表明,高压下处理的样品其热施主生成浓度和生成速率远远高于常压下处理的样品,这表明热施主与低温热处理过程中生成的高浓度氧沉淀核心有密切的关系.