InxGa1−xAs ohmic contacts to n-type GaAs with a tungsten nitride barrier

Significant reduction of the contact resistance of In_0.7Ga_0.3As/Ni/W contacts (which were previously developed by sputtering in our laboratory) was achieved by depositing a W₂N barrier layer between the Ni layer and W layer. The In_0.7Ga_0.3 As/Ni/W₂N/W contact prepared by the radio-frequency sputtering technique showed the lowest contact resistance of 0.2 Ωmm after annealing at 550°C for 10 s. This contact also provided a smooth surface, good reproducibility, and excellent thermal stability at 400°C. The polycrystalline W₂N layer was found to suppress the In diffusion to the contact surface, leading to improvement of the surface morphology and an increase in the total area of the In_xGa−As between metal and the GaAs substrate. These improvements are believed to reduce the contact resistance.     

高效率平面磁控溅射器的研制

介绍一种新型磁控溅射装置。它采用两块极性相对的环状磁铁的设计方法，通过扩大靶表面的等离子放电区域面积，使传统磁控溅射枪使用中经常受到的两个限制──溅射速率与靶的利用率得到了较大的改善。实验中铜靶在溅射功率密度为11W／cm~2时溅射速率约为800nm／min，如果继续提高功率则可获得更高的速率。而靶的利用率可达64％左右。另外，在认为出射粒子符合cos~nθ分布的前提下，发现当n＝3．3时，实验数据和理论数据符合得较好。     

GIC－4117／HC1．7MV Tandetron上的MeV离子注入系统

利用通用离子公司（ＧＩＣ）的４１１７型１．７ＭＶＴａｎｄｅｔｒｏｎ离子束分析设备进行ＭｅＶ级离子注入。所注入的离子能量范围由５００ｋｅＶ到１０ＭｅＶ，离子的质量在２４０ｕ以下，某些元素的负离子束流强度在１５０μＡ以上。双向机械扫描技术可将离子均匀地注入样片。     

中频反应溅射SiO2膜与直流溅射ITO膜的在线联镀

多数ITO透明导电玻璃生产线在实现SiO2膜与ITO膜在线联镀时，应用SiO2靶射频溅射沉积SiO2膜工艺和ITO靶直流溅射沉积ITO膜工艺，如果SiO2膜应用硅靶反应磁控溅射工艺，存在这种工艺是否可以与ITO靶直流溅射沉积ITO膜工艺在线联用以及如何实现联用的问题。作者对现有的生产线进行了改造设计、加工，做了大量实验、质谱分析和多项测试研究，成功地实现反应溅射SiO2膜与ITO膜在线联镀，做到SiO2镀膜室的工作状态的变化基本上不影响ITO镀膜室的工艺条件。     

Influence of growth rate on the structural and morphological properties of TiN, ZrN and TiN/ZrN multilayers

The effect of the deposition rate on the structural and morphological properties of TiN and ZrN single layers and TiN/ZrN multilayers deposited by radiofrequency reactive magnetron sputtering has been studied. The total pressure was kept constant and the growth rate variation was obtained by small difference of nitrogen concentration in the fed gas. The decreasing deposition rate results in a structural change in the thin films from (111) orientation to (100) one. As consequence the surface morphology becomes smoother. Films roughness is strongly related with texture and it decreases with an increase in the (100) X-ray diffraction line intensity. In order to achieve a clear interpretation of our experimental results, the ratio between the N⁺ ions of the plasma and the atoms number reaching the substrate was considered. At high deposition rate with respect to the N⁺ concentration, the chemical potential of transition metal on (100) growth surface is higher than (111) one favouring the (111) orientation of the films. On the contrary, when the growth rate is low with respect to the nitrogen concentration, the chemical potential of transition metal on (111) growth surface is higher than the (100) one leading to a preferential growth in the (100) direction.     

源气体流量比对F-DLC薄膜结构的影响

以高纯石墨作靶，CHF3/Ar作源气体采用反应磁控溅射法制备出了氟化类金刚石（F-DLC）薄膜。拉曼光谱表明，CHF3相对流量的增加会引起薄膜的D峰与G峰强度之比I（D）/I（G）减小，晶粒增大，芳香环结构出例下降。红外吸收光谱分析证实了这些推论，指出这是由于薄膜中氟含量上升的结果。     

溅射靶材的应用及制备初探

随着电子及信息产业突飞猛进的发展，世界溅射靶材的需求越来越多，本文介绍了靶材的发展概况、分类和应用情况，以及靶材的特性要求．探讨Ni-Cr合金靶材的制备工艺，结果表明，产品能满足靶材特性要求。     

五氧化二钽薄膜的制备及其I-U特性

本文利用脉冲直流反应磁控溅射的方法制备了五氧化二钽 (Ta2 O5)薄膜 ,俄歇电子能谱仪测试了薄膜的成分含量 ,椭偏仪测试了Ta2 O5薄膜的厚度和折射率 ,XRD分析了薄膜的晶体结构 ,并且分别研究了氧气含量、基底温度等成膜工艺对薄膜的影响。研究结果表明薄膜的成分主要是由氧气含量决定的。利用金属 绝缘体 (介质膜 ) 金属 (MIM)结构初步对Ta2 O5薄膜进行了电学性能的测试 :皮安电流电压源测试了薄膜的I U特性 ,制备出的薄膜折射率在 2 1～ 2 2 ,MIM的I U特性曲线显示了较好的对称性和低的漏电流密度     

High-pressure dc sputtering of High-Tc BPSCCO thin films withTc(0) above 100 K

High-T _c Bi(Pb)-Sr-Ca-Cu-O thin films have been made on single-crystal MgO substrates using high-pressure dc sputtering technique. X-ray studies confirm the crystallinity and highly oriented structure withc-axis perpendicular to the substrate. By optimizing the annealing schedule the formation of the high-T _c phase is stabilized. The best film exhibited superconducting transition temperature with zero-resistance temperature,T _c(0), as high as 101 K. Temperature dependence ofJ _c indicates the presence of Josephson-type weak links.     

磁控溅射WO3薄膜特性研究

用磁控溅射法制成WO3薄膜,通过改变成膜的溅射参数来改变WO3薄膜的性能.利用XRD分析了样品的粒径大小,研究了成膜工艺参数对气敏元件性能的影响.结果表明,薄膜中WO3晶粒的平均尺寸为17 nm,该传感器对NOx气体有非常好的灵敏度和选择性,对体积分数为1×10-5的NOx气体灵敏度高于50倍,而对其他干扰气体的灵敏度小于2倍.