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101.
S. Sakkopoulos E. Vitoratos E. Dalas N. Kyriakopoulos P. Malkaj T. Argyreas 《应用聚合物科学杂志》2005,97(1):117-122
The dc electrical conductivity (σ) of HCl‐protonated polyaniline, polypyrrole, and their blends was measured from 80 to 300 K for thermal aging times between approximately 0 and 600 h. The thermal aging took place at 70°C under room atmosphere. The change of σ with the temperature (T) and the decrease of σ with the thermal aging time (t) are consistent with a granular metal type structure, in which conductive grains are randomly distributed into an insulating matrix. Aging makes the grains shrink in a corrosion‐like process. From σ = σ(T) measurements the ratio s/d, where s is the average separation between the grains and d their diameter, as well as the rate d(s/d)/dt of their decrease with t were calculated. These revealed that the conductive grains consist of a shell, in which aging proceeds at a decreasing rate, and a central core, which is consumed at a much slower rate. Our measurements not only permitted the estimation of the shell thickness, which lies between 0 and 5 Å, but also gave quantitative information about the quality of the shells and the cores from their aging rates. The shells are consumed with an average rate of d(s/d)/dt = 6.6 × 10?4 (h?1), which is about 5 times greater than the more durable cores. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 97: 117–122, 2005 相似文献
102.
《Journal of Parallel and Distributed Computing》2014,74(6):2512-2520
Accurate age modeling, and fast, yet robust reliability sign-off emerged as mandatory constraints in Integrated Circuits (ICs) design for advanced process technology nodes. In this paper we introduce a novel method to assess and predict the circuit reliability at design time as well as at run-time. The main goal of our proposal is to allow for: (i) design time reliability optimization; (ii) fine tuning of the run-time reliability assessment infrastructure, and (iii) run-time aging assessment. To this end, we propose to select a minimum-size kernel of critical transistors and based on them to assess and predict an IC End-Of-Life (EOL) via two methods: (i) as the sum of the critical transistors end-of-life values, weighted by fixed topology-dependent coefficients, and (ii) by a Markovian framework applied to the critical transistors, which takes into account the joint effects of process, environmental, and temporal variations. The former model exploits the aging dependence on the circuit topology to enable fast run-time reliability assessment with minimum aging sensors requirements. By allowing the performance boundary to vary in time such that both remnant and nonremnant variations are encompassed, and imposing a Markovian evolution, the probabilistic model can be better fitted to various real conditions, thus enabling at design-time appropriate guardbands selection and effective aging mitigation/compensation techniques. The proposed framework has been validated for different stress conditions, under process variations and aging effects, for the ISCAS-85 c499 circuit, in PTM 45 nm technology. From the total of 1526 transistors, we obtained a kernel of 15 critical transistors, for which the set of topology dependent weights were derived. Our simulation results for 15 critical transistors kernel indicate a small approximation error (i.e., mean smaller than 15% and standard deviation smaller than 6%) for the considered circuit estimated end-of-life (EOL), when comparing to the end-of-life values obtained from Cadence simulation, which quantitatively confirm the accuracy of the IC lifetime evaluation. Moreover, as the number of critical transistors determines the area overhead, we also investigated the implications of reducing their number on the reliability assessment accuracy. When only 5 transistors are included into the critical set instead of 15, which results in a 66% area overhead reduction, the EOL estimation accuracy diminished with 18%. This indicates that area vs. accuracy trade-offs are possible, while maintaining the aging prediction accuracy within reasonable bounds. 相似文献
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Creep and physical aging behaviour of PA6 nanocomposites 总被引:1,自引:0,他引:1
The creep and physical aging behavior of various types of PA6 nanocomposites and unfilled PA6 are described. After annealing far above Tg the samples were quenched to room temperature and tested after various ageing times. The creep compliance shows a significant reduction with the addition of exfoliated layered silicate to the matrix polymer. The shape of the creep curves of the nanocomposites is similar to unfilled PA6 and time—ageing time superposition is possible with all materials. The shift rate for superposition is in the same range, but slightly higher in nanocomposites. The creep behavior of nanocomposites conditioned with an equilibrium amount of moisture and dry samples at elevated temperatures shows that the effect of nanofillers is much stronger under these conditions. 相似文献
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稀土基汽车尾气催化剂的研究Ⅰ:催化剂老化和SO_2添加对催化活性的影响 总被引:2,自引:1,他引:2
制备了低Pt、Rh担载量的稀土基催化剂体系 ,研究了贵金属担载量、催化剂高温老化、抗硫水热老化和SO2 对催化活性的影响。结果表明 :随着贵金属质量分数从 0 2 5 %降低到0 1% ,CO、碳氢化合物 (HC)和NO的起燃温度分别平均提高 2 0℃ ;随着m(Pt)∶m(Rh)从 5∶1提高到 9∶1,CO、HC和NO的起燃温度分别提高 17、2 0和 5 3℃ ;当在反应体系中添加SO2 ,随SO2 体积分数从 0 0 0 2 %增加到 0 0 1% ,CO和NO的起燃温度和完全转化温度分别平均提高2 0℃ ,而对于HC ,催化活性几乎保持不变 ;催化剂在水热含硫条件下连续老化 4 0 0h ,CO、NO和HC的起燃温度分别为 2 5 2、2 6 7和 30 3℃ ,仍具有良好的反应活性。表明该稀土基催化剂在一定条件下 ,能满足汽车实际工况的要求 相似文献
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110.
F. Fraga P. Payo E. Rodríguez‐Núñez J. M. Martínez‐Ageitos C. Castro‐Díaz 《应用聚合物科学杂志》2007,103(6):3931-3935
The physical aging of the epoxy network consisting of a diglycidyl ether of bisphenol A, m‐xylylenediamine, and polyetherimide was studied by differential scanning calorimetry. The glass transition temperature and the variation of the specific heat capacities have been calculated using the method, based on the intersection of both enthalpy–temperature lines for glassy and liquid states. The apparent activation energy (EH) was calculated using a single method that involved separate temperature and excess enthalpy dependency. All calorimetric data were compared with those obtained for the epoxy network without thermoplastic. thermoplastic. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 103: 3931–3935, 2006 相似文献